公开(公告)号：US20090206468A1

公开(公告)日：2009-08-20

申请号：US12385316

申请日：2009-04-03

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

摘要翻译： 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。

公开(公告)号：US20090088527A1

公开(公告)日：2009-04-02

申请号：US12238634

申请日：2008-09-26

申请人： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

发明人： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

IPC分类号： C08L63/00

CPC分类号： C08L21/00 ,  C08L15/00 ,  C08L63/00 ,  C08L2666/04 ,  C09J163/00 ,  H01L2924/0002 ,  C08L2666/14 ,  H01L2924/00

摘要： The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.

摘要翻译： 本发明涉及一种半导体封装用贴剂组合物。 用于半导体封装的附着膏组合物包括混合树脂或作为基础树脂的弹性树脂和环氧树脂的共混物。 此时，碱性树脂优选包含50〜95重量％的弹性树脂和5〜50重量％的环氧树脂。 本发明能够实现使用模具粘合剂的常规半导体封装方法来消除在通过丝网印刷施加模具粘合剂之后执行的预干燥处理和在封装工艺之后进行的热硬化处理，保持模具粘合剂的性质确保 半导体产品的可靠性，实现了一个简单的过程。

公开(公告)号：US07485733B2

公开(公告)日：2009-02-03

申请号：US10431349

申请日：2003-05-06

申请人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

发明人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

IPC分类号： C07D333/02 ,  C09K11/06

CPC分类号： H01L51/0058 ,  C07D333/08 ,  C07D333/20 ,  C07D333/24 ,  C07D333/36 ,  C07D409/14 ,  C07D413/14 ,  C07D417/14 ,  C09B1/00 ,  C09B23/005 ,  C09B23/0058 ,  C09B23/14 ,  C09B57/008 ,  C09B69/008 ,  H01L51/0055 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0064 ,  H01L51/0068 ,  H01L51/0069 ,  H01L51/0072 ,  H01L51/0073 ,  H01L51/0085 ,  H01L51/50 ,  Y10S428/917

摘要： Disclosed is a novel group of compounds having a general structure of anthracene body substituted with at least one thiophenyl group, which can be further substituted with various substituent groups. These new compounds are generally compatible with organic electroluminescence. Also disclosed are organic electroluminescent devices and method of making the same. The organic electroluminescent devices include at least one of the compounds in various layers thereof. Organic electroluminescent devices employing the new compounds in their light-emitting layers show outstanding stability.

摘要翻译： 公开了具有被至少一个噻吩基取代的蒽体的一般结构的新一组化合物，其可进一步被各种取代基取代。 这些新化合物通常与有机电致发光相容。 还公开了有机电致发光器件及其制造方法。 有机电致发光器件包括其各层中的至少一种化合物。 在其发光层中使用新化合物的有机电致发光器件显示出优异的稳定性。

公开(公告)号：US20080102410A1

公开(公告)日：2008-05-01

申请号：US11976211

申请日：2007-10-22

申请人： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

发明人： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

IPC分类号： G03C5/00

CPC分类号： H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/108 ,  H05K3/20 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/308 ,  H01L2224/0401

摘要： A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on the core board in correspondence with a position of the cavity; stacking a first build-up layer, on which a first outer circuit is formed, on the core board; and selectively removing the first build-up layer in correspondence with the position of the cavity and removing the first photoresist. Utilizing the method, a board can be manufactured with greater precision, as the thickness tolerance of the cavity may be obtained by controlling the thickness of the photoresist, and the overall thickness of the board can be controlled by controlling the height of the cavity.

摘要翻译： 公开了一种制造印刷电路板的方法，其中形成用于嵌入部件的空腔，其包括：提供其中埋入内部电路的芯板; 在芯板中形成层间导电的第一通孔; 在所述芯板上与所述腔的位置对应地选择性地形成第一光致抗蚀剂; 在芯板上堆叠形成有第一外部电路的第一堆积层; 并且与空腔的位置相对应地选择性地去除第一堆积层并除去第一光致抗蚀剂。 利用该方法，可以通过控制光致抗蚀剂的厚度来获得更高精度的板，因为通过控制光致抗蚀剂的厚度可以获得空腔的厚度公差，并且可以通过控制空腔的高度来控制板的整体厚度。

公开(公告)号：US20070037012A1

公开(公告)日：2007-02-15

申请号：US11585909

申请日：2006-10-25

申请人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

发明人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

IPC分类号： C09K11/06 ,  H01L51/54 ,  H05B33/14

CPC分类号： H01L51/0058 ,  C07D333/08 ,  C07D333/20 ,  C07D333/24 ,  C07D333/36 ,  C07D409/14 ,  C07D413/14 ,  C07D417/14 ,  C09B1/00 ,  C09B23/005 ,  C09B23/0058 ,  C09B23/14 ,  C09B57/008 ,  C09B69/008 ,  H01L51/0055 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0064 ,  H01L51/0068 ,  H01L51/0069 ,  H01L51/0072 ,  H01L51/0073 ,  H01L51/0085 ,  H01L51/50 ,  Y10S428/917

摘要： Disclosed is a novel group of compounds having a general structure of anthracene body substituted with at least one thiophenyl group, which can be further substituted with various substituent groups. These new compounds are generally compatible with organic electroluminescence. Also disclosed are organic electroluminescent devices and method of making the same. The organic electroluminescent devices include at least one of the compounds in various layers thereof. Organic electroluminescent devices employing the new compounds in their light-emitting layers show outstanding stability.

摘要翻译： 公开了具有被至少一个噻吩基取代的蒽体的一般结构的新一组化合物，其可进一步被各种取代基取代。 这些新化合物通常与有机电致发光相容。 还公开了有机电致发光器件及其制造方法。 有机电致发光器件包括其各层中的至少一种化合物。 在其发光层中使用新化合物的有机电致发光器件显示出优异的稳定性。

公开(公告)号：US09200196B2

公开(公告)日：2015-12-01

申请号：US13129768

申请日：2009-11-18

申请人： Jae-Soon Bae ,  Jeung-Gon Kim ,  Ji-Eun Kim ,  Hye-Young Jang ,  Jun-Gi Jang ,  Sang-Young Jeon

发明人： Jae-Soon Bae ,  Jeung-Gon Kim ,  Ji-Eun Kim ,  Hye-Young Jang ,  Jun-Gi Jang ,  Sang-Young Jeon

IPC分类号： H01L51/54 ,  H01L51/46 ,  H01L51/30 ,  C07D409/04 ,  C07C211/54 ,  C07D209/86 ,  C07D277/22 ,  C07D239/26 ,  C07D333/08 ,  C07C211/61 ,  C07D409/14 ,  C07C13/58 ,  C09K11/06 ,  C07C15/38 ,  H01L51/00 ,  H01L51/50

CPC分类号： C09K11/06 ,  C07C15/38 ,  C07C211/54 ,  C07C211/61 ,  C07C2603/24 ,  C07C2603/26 ,  C07C2603/48 ,  C07C2603/50 ,  C09K2211/1011 ,  C09K2211/1037 ,  C09K2211/1044 ,  C09K2211/1092 ,  H01L51/0054 ,  H01L51/006 ,  H01L51/008 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5088 ,  Y02E10/549

摘要： The present invention relates to a novel chrysene derivative and an organic electronic device using the same. A chrysene according to the present invention may act as a hole injection, hole transport, electron injection and transport, or light emitting material in an organic light emitting device and an organic electronic device, and in particular, may be used alone as a light emitting host or a dopant.

摘要翻译： 本发明涉及一种新颖的衍生物和使用其的有机电子器件。 根据本发明的一种可以用作有机发光器件和有机电子器件中的空穴注入，空穴传输，电子注入和输送或发光材料，特别地，可以单独使用作为发光 主体或掺杂剂。

公开(公告)号：US08197702B2

公开(公告)日：2012-06-12

申请号：US12508224

申请日：2009-07-23

申请人： Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

IPC分类号： C25D5/02 ,  B32B37/00 ,  B32B38/00

CPC分类号： B32B37/02 ,  B32B2457/08 ,  C25D5/022 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0384

摘要： Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.

摘要翻译： 公开了印刷电路板的制造方法。 制造具有用于层间连接的通孔的印刷电路板的方法可以包括在载体的一侧上形成电路图案，将载体的一侧压在绝缘体的一侧，去除载体，形成贯穿该载体的孔 通过处理电路图案的一端，并且在孔内形成导电材料以使导电材料对应于通孔。

公开(公告)号：US08173273B2

公开(公告)日：2012-05-08

申请号：US12226487

申请日：2007-04-20

申请人： Ji-Eun Kim ,  Kong-Kyeom Kim ,  Tae-Yoon Park ,  Hye-Young Jang ,  Jae-Chol Lee ,  Sung-Kil Hong ,  Dong-Seob Jeong

发明人： Ji-Eun Kim ,  Kong-Kyeom Kim ,  Tae-Yoon Park ,  Hye-Young Jang ,  Jae-Chol Lee ,  Sung-Kil Hong ,  Dong-Seob Jeong

IPC分类号： H01L51/54

CPC分类号： C07C211/54 ,  C07C2602/10 ,  C07C2603/24 ,  C07F7/081 ,  Y10S428/917

摘要： The present invention relates to a novel anthracene derivative, a method for preparation thereof, and an organic electronic device using the same. The anthracene derivative according to the present invention can function as a hole injecting, hole transporting, electron injecting, electron transporting, or light emitting in an organic electronic device including an organic light emitting device, and in particular, used alone as a light emitting, or as a host or dopant in a host/dopant system. The organic electronic device according to the present invention exhibits excellent characteristics in terms of efficiency, drive voltage, life time, and stability.

摘要翻译： 本发明涉及一种新的蒽衍生物，其制备方法和使用其的有机电子器件。 根据本发明的蒽衍生物可以在包括有机发光器件的有机电子器件中起到空穴注入，空穴传输，电子注入，电子传输或发光的作用，特别是单独用作发光， 或作为主体/掺杂剂体系中的主体或掺杂剂。 根据本发明的有机电子器件在效率，驱动电压，寿命和稳定性方面表现出优异的特性。

公开(公告)号：US08173272B2

公开(公告)日：2012-05-08

申请号：US12225483

申请日：2007-03-23

申请人： Hye-Young Jang ,  Jae-Chol Lee ,  Jin-Kyoon Park ,  Kong-Kyeom Kim ,  Ji-Eun Kim ,  Tae-Yoon Park ,  Sung-Kil Hong ,  Sang-Young Jeon ,  Dong-Seob Jeong

发明人： Hye-Young Jang ,  Jae-Chol Lee ,  Jin-Kyoon Park ,  Kong-Kyeom Kim ,  Ji-Eun Kim ,  Tae-Yoon Park ,  Sung-Kil Hong ,  Sang-Young Jeon ,  Dong-Seob Jeong

IPC分类号： H01L51/54

CPC分类号： C07F7/30 ,  C07C211/54 ,  C07C211/61 ,  C07F7/081 ,  Y10S428/917

摘要： The present invention relates to a novel diamine derivative, a method for preparation thereof, and an organic electronic device using the same. The diamine derivative according to the present invention can serve as a hole injecting, hole transporting, electron injecting, electron transporting, or light emitting material in an organic electronic device including an organic light emitting device. Particularly, it can be used as a light emitting material as used alone, and also serve as a light emitting host, or a light emitting dopant, in particular, a blue light emitting dopant. The organic electronic device according to the present invention exhibits excellent characteristics in terms of efficiency, drive voltage, life time, and stability.

摘要翻译： 本发明涉及一种新的二胺衍生物，其制备方法和使用其的有机电子器件。 根据本发明的二胺衍生物可以在包括有机发光器件的有机电子器件中用作空穴注入，空穴传输，电子注入，电子传输或发光材料。 特别地，它可以用作单独使用的发光材料，并且还用作发光主体或发光掺杂剂，特别是蓝色发光掺杂剂。 根据本发明的有机电子器件在效率，驱动电压，寿命和稳定性方面表现出优异的特性。

公开(公告)号：US20110227838A1

公开(公告)日：2011-09-22

申请号：US12882528

申请日：2010-09-15

申请人： Hee-Chul JEON ,  Ji-Eun Kim ,  Sung-Joo Hwang ,  Se-Il Cho ,  Won-Mi Hwang

发明人： Hee-Chul JEON ,  Ji-Eun Kim ,  Sung-Joo Hwang ,  Se-Il Cho ,  Won-Mi Hwang

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G02F1/13338 ,  G06F2203/04111

摘要： A flat panel display integrated with a touch screen panel. The connecting patterns, which connect adjacent first sensing cells and adjacent second sensing cells are formed on the same level of the lower surface of the upper substrate of the flat panel display of the same material as metal patterns formed around the edge of the touch screen panel, and by arranging the connecting patterns not to cross each other. The flat panel display panel can also be integrated with a touch screen having improved visibility by forming the touch screen panel on the upper substrate of the flat panel display such that connecting patterns are formed in the regions between the pixels.

摘要翻译： 与触摸屏面板集成的平板显示器。 连接相邻的第一感测单元和相邻的第二感测单元的连接图案形成在与触摸屏面板的边缘周围形成的金属图案相同材料的平板显示器的上基板的下表面的相同水平面上 并且通过布置连接图案不互相交叉。 平板显示面板还可以通过在平板显示器的上基板上形成触摸屏面板而使得在像素之间的区域中形成连接图案的具有改善的可视性的触摸屏。