公开(公告)号：US20160106653A1

公开(公告)日：2016-04-21

申请号：US14703654

申请日：2015-05-04

申请人： Sang Duck Kim

发明人： Sang Duck Kim

IPC分类号： A61K8/66

CPC分类号： A61K8/66 ,  A61K8/64 ,  A61K9/0014 ,  A61K9/12 ,  A61K38/4893 ,  A61K47/02 ,  A61K47/26 ,  A61Q19/00

摘要： The present invention relates to a pharmaceutical composition for treating scars on the skin, comprising a mixture of botulinum toxin and air. The mixture of botulinum toxin and air according to the present invention, when injected in the dermis, may temporarily removed the elasticity of the dermis and flatten out the depressed part of the scar, and thus enables elaborate intradermic resection and increases the therapeutic effects of lasers for treating pulsed dye laser or of fractional lasers. Thus, scars on the skin can be effectively improved through a one-time operation without negatively affecting the daily lives of patients.

摘要翻译： 本发明涉及用于治疗皮肤瘢痕的药物组合物，其包含肉毒杆菌毒素和空气的混合物。 根据本发明的肉毒杆菌毒素和空气的混合物当注射到真皮中时，可以暂时除去真皮的弹性并使瘢痕的凹陷部分变平，从而能够进行精细的皮内切除并增加激光的治疗效果 用于处理脉冲染料激光或分数激光。 因此，可以通过一次性手术有效地改善皮肤上的疤痕，而不会对患者的日常生活造成负面影响。

公开(公告)号：US20080102410A1

公开(公告)日：2008-05-01

申请号：US11976211

申请日：2007-10-22

申请人： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

发明人： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

IPC分类号： G03C5/00

CPC分类号： H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/108 ,  H05K3/20 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/308 ,  H01L2224/0401

摘要： A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on the core board in correspondence with a position of the cavity; stacking a first build-up layer, on which a first outer circuit is formed, on the core board; and selectively removing the first build-up layer in correspondence with the position of the cavity and removing the first photoresist. Utilizing the method, a board can be manufactured with greater precision, as the thickness tolerance of the cavity may be obtained by controlling the thickness of the photoresist, and the overall thickness of the board can be controlled by controlling the height of the cavity.

摘要翻译： 公开了一种制造印刷电路板的方法，其中形成用于嵌入部件的空腔，其包括：提供其中埋入内部电路的芯板; 在芯板中形成层间导电的第一通孔; 在所述芯板上与所述腔的位置对应地选择性地形成第一光致抗蚀剂; 在芯板上堆叠形成有第一外部电路的第一堆积层; 并且与空腔的位置相对应地选择性地去除第一堆积层并除去第一光致抗蚀剂。 利用该方法，可以通过控制光致抗蚀剂的厚度来获得更高精度的板，因为通过控制光致抗蚀剂的厚度可以获得空腔的厚度公差，并且可以通过控制空腔的高度来控制板的整体厚度。

公开(公告)号：US09884001B2

公开(公告)日：2018-02-06

申请号：US14821584

申请日：2015-08-07

申请人： Sang Duck Kim

发明人： Sang Duck Kim

IPC分类号： A61K8/04 ,  A61K8/66 ,  A61Q19/00 ,  A61K8/64 ,  A61Q19/08 ,  A61K8/19

CPC分类号： A61K8/66 ,  A61K8/046 ,  A61K8/19 ,  A61K8/64 ,  A61K2800/22 ,  A61K2800/74 ,  A61K2800/91 ,  A61Q19/00 ,  A61Q19/08

摘要： The present invention provides a composition for facial contouring, comprising a mixture of botulinum toxin and air, and a method of facial contouring using the same. When the mixture of botulinum toxin and air is injected into an SMAS layer, the mixture strengthens the SMAS layer and draws back the galea aponeurotica to effectively lift up the face or change the facial contour, thus effectively enhancing the effect of facial contouring.

公开(公告)号：US09050337B2

公开(公告)日：2015-06-09

申请号：US14114443

申请日：2012-06-26

申请人： Sang Duck Kim

发明人： Sang Duck Kim

IPC分类号： A61K38/48 ,  A61K9/00 ,  A61K9/12

CPC分类号： A61K8/66 ,  A61K8/64 ,  A61K9/0014 ,  A61K9/12 ,  A61K38/4893 ,  A61K47/02 ,  A61K47/26 ,  A61Q19/00

摘要： The present invention relates to a pharmaceutical composition for treating scars on the skin, comprising a mixture of botulinum toxin and air. The mixture of botulinum toxin and air according to the present invention, when injected in the dermis, may temporarily removed the elasticity of the dermis and flatten out the depressed part of the scar, and thus enables elaborate intradermic resection and increases the therapeutic effects of lasers for treating pulsed dye laser or of fractional lasers. Thus, scars on the skin can be effectively improved through a one-time operation without negatively affecting the daily lives of patients.

摘要翻译： 本发明涉及用于治疗皮肤瘢痕的药物组合物，其包含肉毒杆菌毒素和空气的混合物。 根据本发明的肉毒杆菌毒素和空气的混合物当注射到真皮中时，可以暂时除去真皮的弹性并使瘢痕的凹陷部分变平，从而能够进行精细的皮内切除并增加激光的治疗效果 用于处理脉冲染料激光或分数激光。 因此，可以通过一次性手术有效地改善皮肤上的疤痕，而不会对患者的日常生活造成负面影响。

公开(公告)号：US20140127186A1

公开(公告)日：2014-05-08

申请号：US14114443

申请日：2012-06-26

申请人： Sang Duck Kim

发明人： Sang Duck Kim

IPC分类号： A61K38/48

CPC分类号： A61K8/66 ,  A61K8/64 ,  A61K9/0014 ,  A61K9/12 ,  A61K38/4893 ,  A61K47/02 ,  A61K47/26 ,  A61Q19/00

摘要： The present invention relates to a pharmaceutical composition for treating scars on the skin, comprising a mixture of botulinum toxin and air. The mixture of botulinum toxin and air according to the present invention, when injected in the dermis, may temporarily removed the elasticity of the dermis and flatten out the depressed part of the scar, and thus enables elaborate intradermic resection and increases the therapeutic effects of lasers for treating pulsed dye laser or of fractional lasers. Thus, scars on the skin can be effectively improved through a one-time operation without negatively affecting the daily lives of patients.

摘要翻译： 本发明涉及用于治疗皮肤瘢痕的药物组合物，其包含肉毒杆菌毒素和空气的混合物。 根据本发明的肉毒杆菌毒素和空气的混合物当注射到真皮中时，可以暂时除去真皮的弹性并使瘢痕的凹陷部分变平，从而能够进行精细的皮内切除并增加激光的治疗效果 用于处理脉冲染料激光或分数激光。 因此，可以通过一次性手术有效地改善皮肤上的疤痕，而不会对患者的日常生活造成负面影响。

公开(公告)号：US20120244662A1

公开(公告)日：2012-09-27

申请号：US13491279

申请日：2012-06-07

申请人： Ji-Eun KIM ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim ,  Young-Hwan Shin ,  Kyung-Ro Yoon

发明人： Ji-Eun KIM ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim ,  Young-Hwan Shin ,  Kyung-Ro Yoon

IPC分类号： H01L21/50

CPC分类号： H05K3/00 ,  H01L2224/16225 ,  H05K3/30 ,  Y10T29/49124

摘要： A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.

摘要翻译： 公开了一种单层片上封装衬底及其制造方法。 根据本发明的实施例，片上封装衬底上的单层板包括形成在绝缘体上表面上的绝缘体，电路图案和倒装焊接焊盘，导体凸块， 与电路图案的下表面接触并穿透绝缘体，阻焊层，其形成在绝缘体的上表面上，使得至少一部分倒装芯片接合焊盘露出，并且 倒装芯片焊接凸块，其形成在倒装焊盘的上表面上，以便与电子部件进行倒装芯片连接。

公开(公告)号：US20110266671A1

公开(公告)日：2011-11-03

申请号：US12949267

申请日：2010-11-18

申请人： Kwang Seop Youm ,  Young Hwan Shin ,  Kyoung Ro Yoon ,  Sang Duck Kim ,  Kyo Min Jung ,  Bong Hie Jung

发明人： Kwang Seop Youm ,  Young Hwan Shin ,  Kyoung Ro Yoon ,  Sang Duck Kim ,  Kyo Min Jung ,  Bong Hie Jung

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49827 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K3/421 ,  H05K2201/09563 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a substrate for a semiconductor package and a manufacturing method thereof. The substrate for the semiconductor package, which has a single-sided substrate structure including circuit patterns having a connection pad formed on only an electronic component mounting surface, can directly connect a connection pad on the top of the substrate to external connection terminals on the bottom of the substrate through a connection via formed of a metal plating layer formed in an inner wall of the via hole and a conductive metal paste filled in the via hole.

摘要翻译： 本发明公开了一种半导体封装用基板及其制造方法。 具有包括仅形成在电子部件安装面上的连接焊盘的电路图案的单面基板结构的半导体封装用基板能够将基板顶部的连接焊盘与底部的外部连接端子直接连接 通过由形成在通孔的内壁中的金属镀层形成的连接通孔和填充在通孔中的导电金属浆料构成。

公开(公告)号：US08889994B2

公开(公告)日：2014-11-18

申请号：US13018971

申请日：2011-02-01

申请人： Young-Ji Kim ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

发明人： Young-Ji Kim ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

IPC分类号： H05K1/16

CPC分类号： H05K1/11 ,  H05K3/06 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

摘要翻译： 公开了一种单层印刷电路板及其制造方法。 根据本发明的实施例，该方法可以包括在绝缘膜的表面上形成焊盘，电路图案和柱，其中柱的一个端部电连接到绝缘膜的至少一部分 电路图案，将电路图案和柱埋在绝缘体中的绝缘膜表面上的绝缘体按压绝缘体，选择性地蚀刻绝缘体，使得柱的另一端暴露，并且打开一部分 所述绝缘膜使得所述焊盘的至少一部分露出。

公开(公告)号：US08418355B2

公开(公告)日：2013-04-16

申请号：US11976071

申请日：2007-10-19

申请人： Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

发明人： Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

IPC分类号： H05K3/20

CPC分类号： H05K3/20 ,  H05K3/205 ,  H05K3/207 ,  H05K3/386 ,  H05K2203/0113 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49163

摘要： A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.

摘要翻译： 公开了一种形成转录电路的方法及其制造方法。 一种形成转录电路的方法，其包括通过在模板上选择性地形成抗蚀剂来形成对应于电路图案的凹版图案，将导电材料填充到凹版图案中，以及通过将载体压载到载体上而将载体转移到 使得载体面向具有填充有导电材料的模板的表面的模板，使得可以形成可以使用现有设备转录成绝缘板的转录电路，由此可以降低成本。

公开(公告)号：US20110186342A1

公开(公告)日：2011-08-04

申请号：US13018971

申请日：2011-02-01

申请人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

发明人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

IPC分类号： H05K1/11 ,  H05K3/06

CPC分类号： H05K1/11 ,  H05K3/06 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

摘要翻译： 公开了一种单层印刷电路板及其制造方法。 根据本发明的实施例，该方法可以包括在绝缘膜的表面上形成焊盘，电路图案和柱，其中柱的一个端部电连接到绝缘膜的至少一部分 电路图案，将电路图案和柱埋在绝缘体中的绝缘膜表面上的绝缘体按压绝缘体，选择性地蚀刻绝缘体，使得柱的另一端暴露，并且打开一部分 所述绝缘膜使得所述焊盘的至少一部分露出。