公开(公告)号：US20080310062A1

公开(公告)日：2008-12-18

申请号：US11763672

申请日：2007-06-15

Applicant: Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Caggiano ,  Kanakasabapathi Subramanian ,  Charles Stephan Pitzen

Inventor： Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Caggiano ,  Kanakasabapathi Subramanian ,  Charles Stephan Pitzen

IPC: H02H7/00

CPC classification number: H01H59/0009 ,  H01H9/541 ,  H01H47/002 ,  H01H71/1081 ,  H01H2071/008

Abstract: Electrical distribution systems implementing micro-electromechanical system based switching devices. Exemplary embodiments include a method in an electrical distribution system, the method including determining if there is a fault condition in a branch of the electrical distribution system, the branch having a plurality of micro electromechanical system (MEMS) switches, re-closing a MEMS switch of the plurality of MEMS switches, which is furthest upstream in the branch and determining if the fault condition is still present. Exemplary embodiments include an electrical distribution system, including an input port for receiving a source of power, a main distribution bus electrically coupled to the input port, a service disconnect MEMS switch disposed between and coupled to the input port and the main distribution bus and a plurality of electrical distribution branches electrically coupled to the main distribution bus.

Abstract translation: 实现基于微机电系统的开关装置的配电系统。 示例性实施例包括在配电系统中的方法，所述方法包括确定在配电系统的分支中是否存在故障状况，所述分支具有多个微机电系统（MEMS）开关，重新闭合MEMS开关 在分支中最上游的多个MEMS开关中，确定故障状况是否仍然存在。 示例性实施例包括配电系统，包括用于接收电力源的输入端口，电耦合到输入端口的主配电总线，设置在输入端口和主配电总线之间并耦合到输入端口和主配电总线的服务断开MEMS开关 多个配电支路电耦合到主配电总线。

公开(公告)号：US20080190748A1

公开(公告)日：2008-08-14

申请号：US11674189

申请日：2007-02-13

Applicant: Stephen Daley Arthur ,  Ahmed Elasser ,  Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Arun Virupaksha Gowda

Inventor： Stephen Daley Arthur ,  Ahmed Elasser ,  Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Arun Virupaksha Gowda

IPC: H01H57/00 ,  H01H11/00

CPC classification number: H01H59/0009 ,  H01H9/52 ,  H01L24/24 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49105 ,  H01L2924/00

Abstract: One embodiment of the invention comprises a MEMS structure further comprising: a MEMS device (240) having a first surface with one or more contact structures (244, 245 and 246) thereon connected to functional elements of the MEMS device (240), a dielectric layer (100) overlying the first surface defining openings therein through which the contact structures (244, 245 and 246) are exposed, a patterned metallization layer (254, 255 and 256) comprising conductive material extending from the contact structures (244, 245 and 246) through the openings in the dielectric layer (100) and onto a surface of the dielectric layer and a first heat sink (190) in thermal communication with the metallization layer (254, 255 and 256).

Abstract translation: 本发明的一个实施例包括一种MEMS结构，其进一步包括：MEMS器件（240），其具有其上连接到所述MEMS器件（240）的功能元件的一个或多个接触结构（244,245和246）的第一表面， 覆盖所述第一表面的层（100），所述第一表面限定其中所述接触结构（244,245和246）暴露于其中的开口;图案化金属化层（254,255和256），包括从所述接触结构（244,245和255）延伸的导电材料 246）通过介电层（100）中的开口并延伸到电介质层的表面上，以及与金属化层（254,255和256）热连通的第一散热器（190）。

公开(公告)号：US20080137238A1

公开(公告)日：2008-06-12

申请号：US11567296

申请日：2006-12-06

Applicant: Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Edward Keith Howell

Inventor： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Edward Keith Howell

IPC: H02H3/10 ,  H02H3/08

CPC classification number: H01H9/541 ,  H01H59/0009 ,  H01H2071/008

Abstract: A switching system is provided. The switching system includes electromechanical switching circuitry, such as a micro-electromechanical system switching circuitry. The system may further include solid state switching circuitry coupled in a parallel circuit with the electromechanical switching circuitry, and a controller coupled to the electromechanical switching circuitry and the solid state switching circuitry. The controller may be configured to perform selective switching of a load current between the electromechanical switching circuitry and the solid state switching circuitry in response to a load current condition appropriate to an operational capability of a respective one of the switching circuitries.

Abstract translation: 提供一种切换系统。 开关系统包括机电开关电路，例如微机电系统开关电路。 该系统还可以包括与机电开关电路并联的固态开关电路，以及耦合到机电开关电路和固态开关电路的控制器。 控制器可以被配置为响应于适合于相应一个开关电路的操作能力的负载电流条件来执行机电开关电路和固态开关电路之间的负载电流的选择性切换。

公开(公告)号：US07332835B1

公开(公告)日：2008-02-19

申请号：US11563774

申请日：2006-11-28

Applicant: Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Kuna Venkat Satya Rama Kishore

Inventor： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Kuna Venkat Satya Rama Kishore

IPC: H01H57/00 ,  H01H47/02

CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H2071/008 ,  Y10T307/685 ,  Y10T307/911

Abstract: MEMS-based switching module, as may be electrically connected to other such modules in a series circuit, to achieve a desired voltage rating is provided. A switching array may be made up of a plurality of such switching modules (e.g., used as building blocks of the switching array) with circuitry configured so that any number of modules can be connected in series to achieve the desired voltage rating (e.g., voltage scalability).

Abstract translation: 提供了可以电连接到串联电路中的其它这样的模块的基于MEMS的开关模块以实现期望的额定电压。 开关阵列可以由多个这样的开关模块（例如，用作开关阵列的构建块）组成，其电路被配置为使得任何数量的模块可以串联连接以实现期望的电压额定值（例如，电压 可扩展性）。

公开(公告)号：US07101789B2

公开(公告)日：2006-09-05

申请号：US10938247

申请日：2004-09-13

Applicant: Kanakasabapathi Subramanian ,  Jeffrey Bernard Fortin ,  Wei-Cheng Tian

Inventor： Kanakasabapathi Subramanian ,  Jeffrey Bernard Fortin ,  Wei-Cheng Tian

IPC: H01L21/44

CPC classification number: H01L21/30617 ,  H01L21/76898 ,  H01L23/481 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for forming smooth walled, prismatically-profiled through-wafer vias and articles formed through the method. An etch stop material is provided on a wafer, which may be a silicon wafer. A mask material is provided on the etch stop material and patterned in such a way as to lead to the formation of vias that have at least one pair of opposing side walls that run parallel to a plane in the wafer. A wet etchant, such as potassium hydroxide, is used to etch vias in the wafer. The use of a wet etchant leads to the formation of smooth side walls. This method allows an aspect ratio of height versus width of the vias of greater than 75 to 1.

公开(公告)号：US07022617B2

公开(公告)日：2006-04-04

申请号：US10606812

申请日：2003-06-26

Applicant: Kanakasabapathi Subramanian ,  Noel C. MacDonald

Inventor： Kanakasabapathi Subramanian ,  Noel C. MacDonald

IPC: H01L21/461

CPC classification number: B81C1/00142 ,  B81B2203/0361 ,  B81C1/00071 ,  B81C1/00111 ,  B81C2201/0112 ,  Y10S977/70 ,  Y10S977/762

Abstract: A process cycles between etching and passivating chemistries to create rough sidewalls that are converted into small structures. In one embodiment, a mask is used to define lines in a single crystal silicon wafer. The process creates ripples on sidewalls of the lines corresponding to the cycles. The lines are oxidized in one embodiment to form a silicon wire corresponding to each ripple. The oxide is removed in a further embodiment to form structures ranging from micro sharp tips to photonic arrays of wires. Fluidic channels are formed by oxidizing adjacent rippled sidewalls. The same mask is also used to form other structures for MEMS devices.

Abstract translation: 蚀刻和钝化化学物质之间的过程循环，以产生转变成小结构的粗糙侧壁。 在一个实施例中，使用掩模来限定单晶硅晶片中的线。 该过程在对应于循环的线的侧壁上产生波纹。 在一个实施例中，线被氧化以形成对应于每个纹波的硅线。 在另一个实施方案中去除氧化物以形成从微尖端到光线阵列的结构。 通过氧化相邻的波纹侧壁形成流体通道。 同样的掩模也用于形成MEMS器件的其他结构。

公开(公告)号：US07915696B2

公开(公告)日：2011-03-29

申请号：US11877786

申请日：2007-10-24

Applicant: David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

Inventor： David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

IPC: H01L29/82

CPC classification number: B81B7/007 ,  B81B2207/07 ,  B81B2207/096 ,  H01H1/0036

Abstract: An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.

Abstract translation: 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。

公开(公告)号：US20110036690A1

公开(公告)日：2011-02-17

申请号：US12541321

申请日：2009-08-14

Applicant: Xuefeng Wang ,  Marco Francesco Aimi ,  Shubhra Bansal ,  Christopher Fred Keimel ,  Kuna Venkat Satya Rama Kishore ,  Kanakasabapathi Subramanian

Inventor： Xuefeng Wang ,  Marco Francesco Aimi ,  Shubhra Bansal ,  Christopher Fred Keimel ,  Kuna Venkat Satya Rama Kishore ,  Kanakasabapathi Subramanian

IPC: H01H57/00

CPC classification number: H01H59/0009 ,  H01H2001/0084

Abstract: A device, such as a switch structure, is provided, the device including a contact and a conductive element. The conductive element can be configured to be selectively moveable between a non-contacting position, in which the conductive element is separated from the contact (in some cases by a distance less than or equal to about 4 μm, and in others by less than or equal to about 1 μm), and a contacting position, in which the conductive element contacts and establishes electrical communication with the contact. When the conductive element is disposed in the non-contacting position, the contact and the conductive element can be configured to support an electric field therebetween with a magnitude of greater than 320 V μm−1 and/or a potential difference of about 330 V or more.

Abstract translation: 提供诸如开关结构的装置，该装置包括接触件和导电元件。 导电元件可以被配置为在非接触位置之间选择性地移动，在非接触位置中，导电元件与接触件分离（在一些情况下，距离小于或等于约4μm，而另一些距离小于或等于约4μm， 等于约1μm），以及接触位置，其中导电元件接触并建立与接触件的电连通。 当导电元件设置在非接触位置时，触点和导电元件可被配置为支撑其间具有大于320Vμm-1的大小和/或约330V的电位差的电场，或 更多。

公开(公告)号：US20100237227A1

公开(公告)日：2010-09-23

申请号：US12408937

申请日：2009-03-23

Applicant: Glen Peter Koste ,  Kathleen Ann O'Brien ,  Kanakasabapathi Subramanian ,  John Norton Park

Inventor： Glen Peter Koste ,  Kathleen Ann O'Brien ,  Kanakasabapathi Subramanian ,  John Norton Park

IPC: H03K17/94

CPC classification number: H03K17/941 ,  H01H59/0009

Abstract: An optically powered MEMS gate driver includes a photovoltaic converter configured to receive a light signal from a light source and output a DC supply voltage for a MEMS gate driver in response thereto. The MEMS gate driver further includes a DC to DC converter electrically coupled to the photovoltaic converter and configured to output a line level DC voltage in response to the DC supply voltage. An electrical circuit, also included as a portion of the MEMS gate driver is electrically coupled to both the photovoltaic converter and the DC to DC converter is configured to receive the supply voltage and the line level voltage and to output a line level drive signal in response thereto. The optically powered MEMS gate driver is self-contained within a common EMI enclosure thus providing isolation between the gate driver and command signal electronics.

Abstract translation: 光学驱动的MEMS栅极驱动器包括光电转换器，其被配置为从光源接收光信号，并响应于此向MEMS栅极驱动器输出DC电源电压。 MEMS栅极驱动器还包括电耦合到光伏转换器并被配置为响应于DC电源电压输出线路电平DC电压的DC-DC转换器。 还包括作为MEMS栅极驱动器的一部分的电路电耦合到光伏转换器和DC-DC转换器两者被配置为接收电源电压和线路电平电压并且响应地输出线路电平的驱动信号 到此。 光学驱动的MEMS栅极驱动器是独立于普通的EMI外壳内，从而提供栅极驱动器和命令信号电子器件之间的隔离。

公开(公告)号：US07663456B2

公开(公告)日：2010-02-16

申请号：US11303157

申请日：2005-12-15

Applicant: Kanakasabapathi Subramanian ,  William James Premerlani ,  Ahmed Elasser ,  Stephen Daley Arthur ,  Somashekhar Basavaraj

Inventor： Kanakasabapathi Subramanian ,  William James Premerlani ,  Ahmed Elasser ,  Stephen Daley Arthur ,  Somashekhar Basavaraj

IPC: H01H51/22

CPC classification number: H01H59/0009 ,  H01H47/004 ,  H01H2050/049 ,  H01H2071/008

Abstract: A micro-electromechanical system (MEMS) switch array for power switching includes an input node, an output node, and a plurality of MEMS switches, wherein the input node and the output node are independently in electrical communication with a portion of the plurality of MEMS switches, and wherein a failure of any one of the plurality of MEMS switches does not render ineffective another MEMS switch within the MEMS switch array.

Abstract translation: 用于功率切换的微机电系统（MEMS）开关阵列包括输入节点，输出节点和多个MEMS开关，其中输入节点和输出节点独立地与多个MEMS的一部分电通信 开关，并且其中所述多个MEMS开关中的任一个的故障不会使所述MEMS开关阵列内的另一个MEMS开关无效。