公开(公告)号：US20120061860A1

公开(公告)日：2012-03-15

申请号：US13232088

申请日：2011-09-14

申请人： Tjalf Pirk ,  Juergen Butz ,  Axel Franke ,  Frieder Haag ,  Heribert Weber ,  Arnim Hoechst ,  Sonja Knies

发明人： Tjalf Pirk ,  Juergen Butz ,  Axel Franke ,  Frieder Haag ,  Heribert Weber ,  Arnim Hoechst ,  Sonja Knies

IPC分类号： H01L21/56 ,  H01L23/28

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/568 ,  H01L23/5389 ,  H01L23/58 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01M6/40 ,  H01M10/0436 ,  H01M10/0525 ,  Y02E60/122 ,  Y02P70/54 ,  H01L2924/00

摘要： A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

摘要翻译： 公开了一种构造电路的方法，该电路包括至少一个用封装化合物封装的半导体芯片。 该方法包括在包括至少一个半导体芯片的电路的元件上施加用于形成电化学元件的电偶层布置。

公开(公告)号：US07838981B2

公开(公告)日：2010-11-23

申请号：US12069786

申请日：2008-02-13

申请人： Frieder Haag

发明人： Frieder Haag

IPC分类号： H01L23/48

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/24521 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a possibility of mounting conventionally capped components, that saves much space. The component assembly includes at least one component having a cap, a substrate for the component and connecting means for mounting the component on the substrate and for the electrical connection of the component. The substrate has at least one recess. The component is mounted on the substrate in flip-chip technique, so that the cap is inserted into the recess and the component is connected to the substrate via connecting bumps in the edge region of the recess.

摘要翻译： 本发明提供了安装常规封盖部件的可能性，节省了大量的空间。 部件组件包括至少一个具有盖的部件，用于部件的基板和用于将部件安装在基板上以及用于部件的电连接的连接装置。 衬底具有至少一个凹部。 该部件以倒装芯片技术安装在基板上，从而将盖插入凹部中，并且该部件通过凹部的边缘区域中的连接凸块连接到基板。

公开(公告)号：US07737544B2

公开(公告)日：2010-06-15

申请号：US11601420

申请日：2006-11-16

申请人： Stefan Mueller ,  Frieder Haag ,  Thomas-Achim Boes

发明人： Stefan Mueller ,  Frieder Haag ,  Thomas-Achim Boes

IPC分类号： H01L21/44

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A sensor system having a substrate and a housing and a method for manufacturing a sensor system are provided, the housing essentially completely enclosing the substrate in a first substrate region, the housing in a second substrate region being provided at least partially open via an opening, the second substrate region in the region of the opening being provided so as to project from the housing, the housing being manufactured using an injection molding compound and being molded in such a way that the injection molding compound has only one flow front.

摘要翻译： 提供了一种具有衬底和壳体的传感器系统以及用于制造传感器系统的方法，所述壳体基本上完全将衬底封闭在第一衬底区域中，所述壳体在第二衬底区域中经由开口至少部分地敞开， 开口区域中的第二基板区域设置成从壳体突出，壳体使用注射成型化合物制造并且以这样的方式模制，使得注射模塑料仅具有一个流动前端。

公开(公告)号：US20050253240A1

公开(公告)日：2005-11-17

申请号：US10514364

申请日：2003-02-21

申请人： Wolfgang Nuechter ,  Frank Fischer ,  Frieder Haag ,  Eckhard Graf

发明人： Wolfgang Nuechter ,  Frank Fischer ,  Frieder Haag ,  Eckhard Graf

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/495 ,  H01L21/48 ,  H01L23/28

CPC分类号： B81B7/0077 ,  H01L21/563 ,  H01L23/49575 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00

摘要： A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.

摘要翻译： 一种微机械部件，包括安装在基板上并具有高于其附近的封装芯片面积的芯片以及设置在封装芯片区域附近的安装区域。 芯片通过连接到安装区域的安装装置安装在基板上，使得封装的芯片区域面向基板并且定位在与其一定距离处。 封装的芯片区域被芯片下方的底部填充物包围。 还提供了用于制造微机械部件的方法。

公开(公告)号：US09101929B2

公开(公告)日：2015-08-11

申请号：US13050762

申请日：2011-03-17

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： G01N33/00 ,  B32B37/02 ,  B32B38/10 ,  B01L3/00 ,  B81B7/00 ,  B32B37/24 ,  H01L23/473

CPC分类号： B01L3/5027 ,  B01J2219/00783 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2300/0663 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/16 ,  B81B7/007 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2207/098 ,  B81C2203/0154 ,  H01L23/473 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83191 ,  Y10T156/10 ,  H01L2924/00014

摘要： A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

摘要翻译： 用于分析和诊断的微流体系统由基本上彼此排列的层组成。 微流体系统至少包括第一和第二导电层，其分别包括至少一个通道，用于在相应导电层中导通的流体。 微流体系统还包括至少一个芯片层，其包括至少一个有源微机械元件，所述有源微机械元件与至少一个通道操作连接，并且所述芯片层布置在第一和第二 导通层，并且通道彼此流体连接。 除了微流体系统之外，还公开了相应的制造方法。

公开(公告)号：US08794074B2

公开(公告)日：2014-08-05

申请号：US12610667

申请日：2009-11-02

申请人： Eric Ochs ,  Frieder Haag ,  Eckart Schellkes

发明人： Eric Ochs ,  Frieder Haag ,  Eckart Schellkes

IPC分类号： G01L19/04

CPC分类号： G01L19/141 ,  B81B7/0058 ,  B81B2201/0264 ,  G01L19/04 ,  H01L23/3121 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element.

摘要翻译： 传感器模块设置有传感器元件，壳体和基底，传感器元件位于基底上，并且传感器元件设置成至少部分地嵌入壳体中; 并且所述传感器模块还具有用于补偿所述壳体的热变形的补偿元件; 壳体基本上位于衬底和补偿元件之间。

公开(公告)号：US08631813B2

公开(公告)日：2014-01-21

申请号：US13187475

申请日：2011-07-20

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： F17D3/00 ,  F15C1/06 ,  B01L3/00

CPC分类号： B01L3/502707 ,  B01L2300/0663 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/1827 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8158

摘要： A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure.

摘要翻译： 公开了一种含有至少一个具有至少一个微流体活性表面的微流体组分的微流体系统的制备方法。 该方法包括提供具有连接侧的微流体复合衬底，其包括引入聚合物组合物中的至少一个微流体组分，其中所述组分的微流体活性表面形成微流体复合衬底的连接侧的一部分。 该方法还包括提供具有用于连接到微流体复合衬底的连接侧的配合衬底。 此外，该方法包括至少在微流体系统中形成微流体通道结构的至少在复合衬底的连接侧和/或配合衬底的连接侧上提供微流体结构。 此外，该方法包括通过其连接侧连接微流体复合衬底和配合衬底以形成微流体通道结构。

公开(公告)号：US20120038065A1

公开(公告)日：2012-02-16

申请号：US13206271

申请日：2011-08-09

申请人： Juergen Butz ,  Axel Franke ,  Frieder Haag ,  Heribert Weber ,  Arnim Hoechst ,  Sonja Knies

发明人： Juergen Butz ,  Axel Franke ,  Frieder Haag ,  Heribert Weber ,  Arnim Hoechst ,  Sonja Knies

IPC分类号： H01L21/56 ,  H01L23/498

CPC分类号： H01L21/568 ,  B81C1/00301 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/96 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method for producing an electrical circuit having at least one semiconductor chip is disclosed. The method includes forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side. The wiring layer has at least one conductor loop for the purpose of forming an electrical coil.

摘要翻译： 公开了一种用于制造具有至少一个半导体芯片的电路的方法。 该方法包括在所述至少一个半导体芯片的接触侧形成布线层，所述布线层用除了接触侧的封装化合物封装。 为了形成电线圈，布线层具有至少一个导体环路。

公开(公告)号：US20120024396A1

公开(公告)日：2012-02-02

申请号：US13187475

申请日：2011-07-20

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： F16K37/00 ,  B23P11/00

CPC分类号： B01L3/502707 ,  B01L2300/0663 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/1827 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8158

摘要： A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure.

摘要翻译： 公开了一种含有至少一个具有至少一个微流体活性表面的微流体组分的微流体系统的制备方法。 该方法包括提供具有连接侧的微流体复合衬底，其包括引入聚合物组合物中的至少一个微流体组分，其中所述组分的微流体活性表面形成微流体复合衬底的连接侧的一部分。 该方法还包括提供具有用于连接到微流体复合衬底的连接侧的配合衬底。 此外，该方法包括至少在微流体系统中形成微流体通道结构的至少在复合衬底的连接侧和/或配合衬底的连接侧上提供微流体结构。 此外，该方法包括通过其连接侧连接微流体复合衬底和配合衬底以形成微流体通道结构。

公开(公告)号：US20110291301A1

公开(公告)日：2011-12-01

申请号：US13117240

申请日：2011-05-27

申请人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

发明人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

摘要翻译： 公开了一种半导体元件的制造方法及其制造方法。 该方法包括以下步骤：将导电膜固定在载体上; 使用粘合剂层将半导体芯片粘合到导电膜上，其中半导体芯片的有源表面，具有连接触点的有源表面位于面向薄膜的芯片的该侧; 用模塑料将粘合到导电膜上的芯片包覆成型; 并用载体上的包覆成型芯片释放导电膜。 在这种情况下，粘合剂层的结构使得半导体芯片的至少连接触点不含粘合剂层，并且保持没有模塑料。