公开(公告)号：US08835222B2

公开(公告)日：2014-09-16

申请号：US13623244

申请日：2012-09-20

申请人： Mathias Bruendel ,  Frieder Haag ,  Jens Frey ,  Rolf Speicher ,  Juergen Fritz ,  Lutz Rauscher

发明人： Mathias Bruendel ,  Frieder Haag ,  Jens Frey ,  Rolf Speicher ,  Juergen Fritz ,  Lutz Rauscher

IPC分类号： H01L21/00 ,  B81C1/00 ,  H01L21/56 ,  H01L21/50 ,  H01L23/48 ,  H01L23/00 ,  H01L23/544 ,  H01L21/768

CPC分类号： H01L23/48 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00238 ,  B81C2203/0154 ,  B81C2203/0792 ,  H01L21/50 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54466 ,  H01L2224/0401 ,  H01L2224/09181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/00

摘要： A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

摘要翻译： 一种用于制造双芯片组件的方法包括：提供具有第一厚度的晶片，该晶片具有前侧和后侧，在晶片的前侧设置有第一多个第一芯片; 在晶片的前侧附加第二多个第二芯片，使得每个第一芯片在每种情况下都连接到第二芯片并形成相应的双芯片对; 在所述晶片的前侧形成粘结的模具包，使得所述第二芯片被包装; 将晶片从背面变薄至小于第一厚度的第二厚度; 从后侧到第二芯片形成通孔; 并将两芯片对分离成相应的双芯片组件。

公开(公告)号：US20110229375A1

公开(公告)日：2011-09-22

申请号：US13050762

申请日：2011-03-17

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： G01N33/00 ,  B32B37/02 ,  B32B38/10 ,  B32B37/24

CPC分类号： B01L3/5027 ,  B01J2219/00783 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2300/0663 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/16 ,  B81B7/007 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2207/098 ,  B81C2203/0154 ,  H01L23/473 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83191 ,  Y10T156/10 ,  H01L2924/00014

摘要： A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

摘要翻译： 用于分析和诊断的微流体系统由基本上彼此排列的层组成。 微流体系统至少包括第一和第二导电层，其分别包括至少一个通道，用于在相应导电层中导通的流体。 微流体系统还包括至少一个芯片层，其包括至少一个有源微机械元件，所述有源微机械元件与至少一个通道操作连接，并且所述芯片层布置在第一和第二 导通层，并且通道彼此流体连接。 除了微流体系统之外，还公开了相应的制造方法。

公开(公告)号：US08759988B2

公开(公告)日：2014-06-24

申请号：US13117240

申请日：2011-05-27

申请人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

发明人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

IPC分类号： H01L23/48 ,  H01L23/34 ,  H01L33/00 ,  H01L31/0203

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

摘要翻译： 公开了一种半导体元件的制造方法及其制造方法。 该方法包括以下步骤：将导电膜固定在载体上; 使用粘合剂层将半导体芯片粘合到导电膜上，其中半导体芯片的有源表面，具有连接触点的有源表面位于面向薄膜的芯片的该侧; 用模塑料将粘合到导电膜上的芯片包覆成型; 并用载体上的包覆成型芯片释放导电膜。 在这种情况下，粘合剂层的结构使得半导体芯片的至少连接触点不含粘合剂层，并且保持没有模塑料。

公开(公告)号：US20140077816A1

公开(公告)日：2014-03-20

申请号：US14028050

申请日：2013-09-16

申请人： Mathias BRUENDEL ,  Fabian HENRICI ,  Daniel PANTEL

发明人： Mathias BRUENDEL ,  Fabian HENRICI ,  Daniel PANTEL

IPC分类号： G01R31/36

CPC分类号： G01R31/382 ,  H01M10/48 ,  Y10T29/49002

摘要： A sensor device for accommodation in a galvanic cell, having a sensor for detecting a predetermined measured quantity of the galvanic cell. The sensor device includes a sensor housing for receiving the sensor, the sensor being disposed in a recess in the sensor housing, and a measured-quantity transfer medium that covers at least the recess in the sensor housing in fluid-tight fashion and is formed to couple the sensor to an external environment of the sensor device for the transfer of the measured quantity.

摘要翻译： 一种用于容纳在电池中的传感器装置，具有用于检测预定测量量的原电池的传感器。 传感器装置包括用于接收传感器的传感器壳体，传感器设置在传感器壳体中的凹部中，以及测量量传递介质，其以流体密封的方式至少覆盖传感器壳体中的凹部，并形成为 将传感器耦合到传感器设备的外部环境，以传输测量的数量。

公开(公告)号：US09101929B2

公开(公告)日：2015-08-11

申请号：US13050762

申请日：2011-03-17

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： G01N33/00 ,  B32B37/02 ,  B32B38/10 ,  B01L3/00 ,  B81B7/00 ,  B32B37/24 ,  H01L23/473

CPC分类号： B01L3/5027 ,  B01J2219/00783 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2300/0663 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/16 ,  B81B7/007 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2207/098 ,  B81C2203/0154 ,  H01L23/473 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83191 ,  Y10T156/10 ,  H01L2924/00014

摘要： A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

摘要翻译： 用于分析和诊断的微流体系统由基本上彼此排列的层组成。 微流体系统至少包括第一和第二导电层，其分别包括至少一个通道，用于在相应导电层中导通的流体。 微流体系统还包括至少一个芯片层，其包括至少一个有源微机械元件，所述有源微机械元件与至少一个通道操作连接，并且所述芯片层布置在第一和第二 导通层，并且通道彼此流体连接。 除了微流体系统之外，还公开了相应的制造方法。

公开(公告)号：US08631813B2

公开(公告)日：2014-01-21

申请号：US13187475

申请日：2011-07-20

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： F17D3/00 ,  F15C1/06 ,  B01L3/00

CPC分类号： B01L3/502707 ,  B01L2300/0663 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/1827 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8158

摘要： A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure.

摘要翻译： 公开了一种含有至少一个具有至少一个微流体活性表面的微流体组分的微流体系统的制备方法。 该方法包括提供具有连接侧的微流体复合衬底，其包括引入聚合物组合物中的至少一个微流体组分，其中所述组分的微流体活性表面形成微流体复合衬底的连接侧的一部分。 该方法还包括提供具有用于连接到微流体复合衬底的连接侧的配合衬底。 此外，该方法包括至少在微流体系统中形成微流体通道结构的至少在复合衬底的连接侧和/或配合衬底的连接侧上提供微流体结构。 此外，该方法包括通过其连接侧连接微流体复合衬底和配合衬底以形成微流体通道结构。

公开(公告)号：US20120024396A1

公开(公告)日：2012-02-02

申请号：US13187475

申请日：2011-07-20

申请人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

发明人： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC分类号： F16K37/00 ,  B23P11/00

CPC分类号： B01L3/502707 ,  B01L2300/0663 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/1827 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8158

摘要： A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure.

摘要翻译： 公开了一种含有至少一个具有至少一个微流体活性表面的微流体组分的微流体系统的制备方法。 该方法包括提供具有连接侧的微流体复合衬底，其包括引入聚合物组合物中的至少一个微流体组分，其中所述组分的微流体活性表面形成微流体复合衬底的连接侧的一部分。 该方法还包括提供具有用于连接到微流体复合衬底的连接侧的配合衬底。 此外，该方法包括至少在微流体系统中形成微流体通道结构的至少在复合衬底的连接侧和/或配合衬底的连接侧上提供微流体结构。 此外，该方法包括通过其连接侧连接微流体复合衬底和配合衬底以形成微流体通道结构。

公开(公告)号：US20110291301A1

公开(公告)日：2011-12-01

申请号：US13117240

申请日：2011-05-27

申请人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

发明人： Mathias Bruendel ,  Frieder Haag ,  Ulrike Scholz

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

摘要翻译： 公开了一种半导体元件的制造方法及其制造方法。 该方法包括以下步骤：将导电膜固定在载体上; 使用粘合剂层将半导体芯片粘合到导电膜上，其中半导体芯片的有源表面，具有连接触点的有源表面位于面向薄膜的芯片的该侧; 用模塑料将粘合到导电膜上的芯片包覆成型; 并用载体上的包覆成型芯片释放导电膜。 在这种情况下，粘合剂层的结构使得半导体芯片的至少连接触点不含粘合剂层，并且保持没有模塑料。