公开(公告)号：US08808888B2

公开(公告)日：2014-08-19

申请号：US12868489

申请日：2010-08-25

申请人： Gregory J. Wilson ,  Kyle M. Hanson

发明人： Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： H01M2/36

CPC分类号： H01M8/186 ,  H01M4/42 ,  H01M8/0232 ,  H01M8/0245 ,  H01M8/188 ,  H01M8/20 ,  H01M12/08 ,  H01M2250/00 ,  Y02E60/528

摘要： Embodiments of the invention generally provide for flow battery cells and systems containing a plurality of flow battery cells, and methods for improving metal plating within the flow battery cell, such as by flowing and exposing the catholyte to various types of cathodes. In one embodiment, a flow battery cell is provided which includes a cathodic half cell and an anodic half cell separated by an electrolyte membrane, wherein the cathodic half cell contains a plurality of cathodic wires extending perpendicular or substantially perpendicular to and within the catholyte pathway and in contact with the catholyte, and each of the cathodic wires extends parallel or substantially parallel to each other. In some examples, the plurality of cathodic wires may have at least two arrays of cathodic wires, each array contains at least one row of cathodic wires, and each row extends along the catholyte pathway.

摘要翻译： 本发明的实施例通常提供了包含多个流动电池单元的流动电池单元和系统，以及用于改善流动电池单元内的金属电镀的方法，例如通过将阴极电解液流过和暴露于各种类型的阴极。 在一个实施例中，提供了流动电池单元，其包括阴极半电池和由电解质膜分离的阳极半电池，其中阴极半电池包含垂直于或基本垂直于阴极电解液通道延伸的多个阴极线， 与阴极电解液接触，并且每个阴极线彼此平行或基本平行延伸。 在一些示例中，多个阴极线可以具有至少两个阴极线阵列，每个阵列包含至少一排阴极线，并且每排沿着阴极电解液通道延伸。

公开(公告)号：US20110042224A1

公开(公告)日：2011-02-24

申请号：US12917997

申请日：2010-11-02

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

IPC分类号： H01L21/02 ,  C25D5/02

CPC分类号： C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25F3/30

摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.

摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。

公开(公告)号：US07842173B2

公开(公告)日：2010-11-30

申请号：US11699768

申请日：2007-01-29

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

IPC分类号： C25B9/00

CPC分类号： C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25F3/30

摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.

摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。

公开(公告)号：US07393439B2

公开(公告)日：2008-07-01

申请号：US10733807

申请日：2003-12-11

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff ,  Nolan Zimmerman ,  James J. Erickson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff ,  Nolan Zimmerman ,  James J. Erickson

IPC分类号： C25D17/16 ,  C25B9/18 ,  C25C7/00

CPC分类号： C25D17/001 ,  C25D17/02 ,  C25D21/10

摘要： Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positions between positioning elements of the module are fixed so that the transport system does not need to be recalibrated when the processing chamber is removed and replaced with another processing chamber. The processing chamber includes a paddle device for agitating processing liquid at a process surface of the workpiece. The paddle device, the processing chamber, and electrodes within the processing chamber are configured to reduce the likelihood for electrical shadowing created by the paddles at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the paddles reciprocate relative to the workpiece.

摘要翻译： 公开了具有配准系统的安装模块的工具。 安装模块包括用于精确定位处理室的定位元件和将工件移至和离开处理室的输送系统。 模块的定位元件之间的相对位置是固定的，使得当处理室被移除并被另一处理室更换时，输送系统不需要重新校准。 处理室包括用于在工件的处理表面处搅拌处理液体的桨装置。 处理室中的桨装置，处理室和电极被配置为减少由工件表面上的桨形成的电阴影的可能性，并且当桨叶往复运动时考虑对电场的三维效应 相对于工件。

公开(公告)号：US07371998B2

公开(公告)日：2008-05-13

申请号：US11428742

申请日：2006-07-05

申请人： Randy A. Harris ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Randy A. Harris ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： F27B5/04 ,  F27B5/14 ,  F27B11/02 ,  F27D3/12 ,  F27D1/12

CPC分类号： F27B17/0025 ,  H01L21/67109 ,  H01L21/6719

摘要： A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.

摘要翻译： 热处理器可以包括可在处理容器或罐内的处理室周围定位的冷却套。 加热器可以进入基本上处理室容器和冷却套之间的位置。 提供具有多个工件保持位置的保持器，用于保持批次或工件或晶片。 处理室容器可移动到其基本上包围保持器的位置，使得保持器中的晶片可以在受控环境中进行处理。 可以提供冷却罩以在热处理之前或之后从加热器吸收热量。 热处理器是紧凑的和热屏蔽的，并且可以用于具有其他类型的处理器的自动处理系统中。

公开(公告)号：US08968533B2

公开(公告)日：2015-03-03

申请号：US13468273

申请日：2012-05-10

申请人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D7/12

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002

摘要： An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

摘要翻译： 电镀处理器包括具有形成在通道中的连续流路的电极板。 流路可以可选地是卷绕的流动路径。 一个或多个电极定位在通道中。 膜板在它们之间附着有电极板。 电解液以高速移动通过流路，防止气泡粘到膜底部。 流动路径中的任何气泡被夹带在快速移动的电解质中并从膜中带走。 电镀处理器可以替代地具有延伸通过形成为线圈或其它形状的管状膜的线电极，任选地包括具有直段的形状。

公开(公告)号：US20080006617A1

公开(公告)日：2008-01-10

申请号：US11428742

申请日：2006-07-05

申请人： Randy A. Harris ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Randy A. Harris ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： F27B5/14

CPC分类号： F27B17/0025 ,  H01L21/67109 ,  H01L21/6719

摘要： A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.

摘要翻译： 热处理器可以包括可在处理容器或罐内的处理室周围定位的冷却套。 加热器可以进入基本上处理室容器和冷却套之间的位置。 提供具有多个工件保持位置的保持器，用于保持批次或工件或晶片。 处理室容器可移动到其基本上包围保持器的位置，使得保持器中的晶片可以在受控环境中进行处理。 可以提供冷却罩以在热处理之前或之后从加热器吸收热量。 热处理器是紧凑的和热屏蔽的，并且可以用于具有其他类型的处理器的自动处理系统中。

公开(公告)号：US06780374B2

公开(公告)日：2004-08-24

申请号：US09733608

申请日：2000-12-08

申请人： Robert A. Weaver ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Robert A. Weaver ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C21D106

CPC分类号： H01L21/67103

摘要： An apparatus and method for processing a microelectronic workpiece at an elevated temperature. In one embodiment, the apparatus includes a workpiece support positioned to engage and support the microelectronic workpiece during operation. The apparatus can further include a heat source having a solid engaging surface positioned to engage a surface of the microelectronic workpiece with at least one of the heat source and the workpiece support being movable relative to the other between a first position with the microelectronic workpiece contacting the engaging surface of the heat source and a second position with the microelectronic workpiece spaced apart from the engaging surface. The heat source is sized to transfer heat to the microelectronic workpiece at a rate sufficient to thermally process a selected material of the microelectronic workpiece when the microelectronic workpiece is engaged with the heat source. A heat sink can be positioned at least proximate to the heat source to cool both the heat source and the microelectronic workpiece.

摘要翻译： 一种用于在高温下处理微电子工件的装置和方法。 在一个实施例中，该装置包括被定位成在操作期间接合和支撑微电子工件的工件支撑件。 该设备还可包括热源，其具有固体接合表面，该固体接合表面定位成与微电子工件的表面接合，热源和工件支撑件中的至少一个可在第一位置和微电子工件接触的第一位置之间相对于另一个移动 所述热源的接合表面和所述微电子工件与所述接合表面间隔开的第二位置。 热源的尺寸被设计成当微电子工件与热源接合时以足以热处理微电子工件的选定材料的速率将热量传递到微电子工件。 散热器可以至少靠近热源定位以冷却热源和微电子工件。

公开(公告)号：US20140061053A1

公开(公告)日：2014-03-06

申请号：US13603836

申请日：2012-09-05

申请人： Paul R. McHugh ,  Gregory J. Wilson

发明人： Paul R. McHugh ,  Gregory J. Wilson

IPC分类号： C25D21/12

CPC分类号： C25D21/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008

摘要： In an electroplating process, electric current is applied to two or more electrodes, with the current varying over time according to a multi-variable function. The multi-variable current function is integrated over time, for each electrode, to determine a net plating charge delivered. A plating profile of a plated-on layer of material is compared to a target plating profile. Deviations between the actual plating profile and the target plating profile are identified and used to determine new net plating charges for each electrode. One or more variables of the multi-variable function is changed to provide as new multi-variable function. The new net plating charges are distributed according to the new multi-variable current function, and are used to electroplate a layer of material on a second substrate.

摘要翻译： 在电镀工艺中，电流被施加到两个或更多个电极，电流根据多变量功能随时间而变化。 随着时间的推移，多变量电流功能对于每个电极进行积分，以确定传送的净电镀电量。 将电镀层材料的电镀轮廓与目标电镀轮廓进行比较。 识别实际电镀曲线和目标电镀曲线之间的偏差，并用于确定每个电极的新净镀层电荷。 多变量函数的一个或多个变量被更改为提供新的多变量函数。 新的净电镀费用根据新的多变量电流功能分配，并用于在第二基板上电镀一层材料。

公开(公告)号：US20130146447A1

公开(公告)日：2013-06-13

申请号：US13313865

申请日：2011-12-07

申请人： Gregory J. Wilson ,  Paul R. McHugh

发明人： Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D17/008

摘要： In an electro processor for plating semiconductor wafers and similar substrates, a contact ring has a plurality of spaced apart contact fingers. A shield at least partially overlies the contact fingers. The shield changes the electric field around the outer edge of the workpiece and the contact fingers, which reduces or eliminates the negative aspects of using high thief electrode currents and seed layer deplating. The shield may be provided in the form of an annular ring substantially completely overlying and covering, and optionally touching the contact fingers.

摘要翻译： 在用于电镀半导体晶片和类似基板的电子处理器中，接触环具有多个间隔开的接触指状物。 护罩至少部分地覆盖在接触指状物上。 屏蔽层改变了工件外边缘周围的电场和接触指，这减少或消除了使用高电极电流和种子层脱落的负面方面。 护罩可以以环形的形式提供，基本上完全覆盖并覆盖并且可选地接触接触指。