中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

41 records (took 0.017 seconds)

    MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
    31.
    发明申请
    MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES 有权
    具有可拆卸模块的多芯片模块系统

    公开(公告)号：US20120098116A1

    公开(公告)日：2012-04-26

    申请号：US12909980

    申请日：2010-10-22

    Applicant: Jon Alfred Casey ,  John Lee Colbert ,  Paul Marlan Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L. Reynolds

    Inventor： Jon Alfred Casey ,  John Lee Colbert ,  Paul Marlan Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L. Reynolds

    IPC: H01L23/36 ,  H01L21/60

    CPC classification number: H01L23/49833 ,  H01L22/14 ,  H01L23/32 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/16251 ,  H01L2924/16747

    Abstract: A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

    Abstract translation: 多芯片模块（MCM）包括作为独立可测试实体制造的芯片子模块。 芯片子模块插入MCM框架中的相应插槽。 在插入MCM之前，可以对每个芯片子模块进行测试。 芯片子模块可以包括安装到向模块提供互连的子模块有机衬底的诸如处理器的IC芯片。 每个芯片子模块插入的框架位于将芯片子模块互连在一起的微型卡有机基板上。 MCM可以包括微卡有机基板和系统板之间的下停，以限制或防止微卡有机基板和系统板之间的焊料连接的焊料蠕变。

    Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer
    32.
    发明授权
    Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer 失效
    具有倒置混合光栅阵列（LGA）插入器的塑料焊盘阵列（PLGA）模块

    公开(公告)号：US07658617B1

    公开(公告)日：2010-02-09

    申请号：US12364110

    申请日：2009-02-02

    Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

    Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

    IPC: H01R12/00

    CPC classification number: H05K7/1069

    Abstract: An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB). The inverted hybrid LGA interposer supports the PLGA module carrier and, in addition, a stiffener frame (with or without a heat sink) may be provided to reinforce the PLGA module carrier.

    Abstract translation: 一种用于塑料地面网格阵列（PLGA）模块的增强的接触构造和加载支撑机构。 多个反相混合光栅阵列（LGA）触点分别被分别捕获并且至少部分地穿过反向混合LGA插入器的多个孔中的一个。 倒置的混合LGA触点固定到PLGA模块载体上的多个金属焊盘。 优选地，反向混合LGA触点使用表面贴装技术（SMT）同时固定，并且具有提供增强的耐磨性和耐腐蚀性的冶金结构（例如涂覆有镍和硬金的铍铜弹簧）。 每个倒置的混合LGA触点被配置为在诸如印刷电路板（PWB）的另一基板上与金属触点进行机械/压力接触。 反向混合LGA插入器支持PLGA模块载体，此外，可以提供加强框架（具有或不具有散热器）以加强PLGA模块载体。

    High performance reworkable heatsink and packaging structure with solder release layer
    34.
    发明授权
    High performance reworkable heatsink and packaging structure with solder release layer 有权
    高性能可重复工作的散热器和包装结构，具有焊料释放层

    公开(公告)号：US07342306B2

    公开(公告)日：2008-03-11

    申请号：US11316264

    申请日：2005-12-22

    Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

    Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

    IPC: H01L23/34 ,  H01L21/48

    CPC classification number: H01L23/3736 ,  H01L23/3672 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322

    Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

    Abstract translation: 提供了一种制造方法和一种具有焊料释放层的高性能可重复工作的散热器和封装结构。 散热器结构包括散热器底座。 所选择的热管或蒸气室中的一个以及多个平行翅片焊接到散热器基座。 将焊料释放层施加到散热器基座的外表面。 焊料释放层具有比用于将所选择的一个热管或蒸气室固定的每个焊料以及多个平行散热片连接到散热器基座的熔融温度范围更低的温度范围。 在施加焊料释放层之后，用选定的传热介质填充热管或蒸汽室。

    Adhesive-less cover on area array bonding site of circuit board
    37.
    发明授权
    Adhesive-less cover on area array bonding site of circuit board 有权
    电路板区域阵列焊接部位无粘合剂盖

    公开(公告)号：US06700068B2

    公开(公告)日：2004-03-02

    申请号：US09924711

    申请日：2001-08-08

    Applicant: Mark Kenneth Hoffmeyer ,  Daniel Scott Johnson

    Inventor： Mark Kenneth Hoffmeyer ,  Daniel Scott Johnson

    IPC: H05K100

    CPC classification number: H05K3/3452 ,  H05K3/1216 ,  H05K3/3415 ,  H05K3/3468 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0557 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    Abstract: An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site for form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.

    Abstract translation: 一种用于处理包含区域阵列表面处理的接合位置的电路​​板的装置，程序产品和方法，例如Land Grid Array（LGA）组件的贵金属端子焊盘。 电路板包括围绕接合位置图案化的多个孔，以形成覆盖区。 形状为符合足迹的保护盖包括注册以可拆卸地装配到孔中的柱。 在制造工艺如焊丝丝网印刷，返修和洗涤时，保护盖仍然覆盖在电路板上，然后拆下。 因此，避免了制造过程中的污染，并且消除了使用胶带进行保护的可能的污染源。

    Apparatus and method to test for known good die
    39.
    发明授权
    Apparatus and method to test for known good die 失效
    测试已知好的模具的装置和方法

    公开(公告)号：US5789930A

    公开(公告)日：1998-08-04

    申请号：US572591

    申请日：1995-12-14

    Applicant: Phillip Duane Isaacs ,  David Allen Sluzewski ,  Mark Kenneth Hoffmeyer

    Inventor： Phillip Duane Isaacs ,  David Allen Sluzewski ,  Mark Kenneth Hoffmeyer

    IPC: G01R31/28 ,  H05K3/34 ,  G01R31/02

    CPC classification number: H05K3/3436 ,  G01R31/2886 ,  H05K2201/035 ,  H05K2203/162 ,  H05K3/3484 ,  Y02P70/613

    Abstract: The present invention may be characterized as an improved integrated circuit die testing system which includes a number of components which cooperate together. An integrated circuit carrier is provided for holding the integrated circuit die. Attached to the integrated circuit carrier is a chip site. Proximate to this chip site exists a plurality of contact pads. These contact pads are electrically coupled to a plurality of test points. Also provided is an integrated circuit die. Finally, a pattern of electrically conductive paste is provided. This electrically conductive paste electrically couples the integrated circuit die and the contact pads thereby allowing the integrated circuit die to be tested from the test points.

    Abstract translation: 本发明可以被表征为一种改进的集成电路芯片测试系统，其包括多个组合在一起的组件。 提供了用于保持集成电路管芯的集成电路载体。 连接到集成电路的载体是一个芯片现场。 靠近该芯片位置存在多个接触垫。 这些接触垫电耦合到多个测试点。 还提供集成电路管芯。 最后，提供导电浆料的图案。 该导电浆料电耦合集成电路管芯和接触焊盘，从而允许从测试点测试集成电路管芯。

    Multigigabit adaptable transceiver module
    40.
    发明授权
    Multigigabit adaptable transceiver module 失效
    千兆位适应性收发模块

    公开(公告)号：US5757998A

    公开(公告)日：1998-05-26

    申请号：US724400

    申请日：1996-10-02

    Applicant: Raymond Jonathan Thatcher ,  Mark Kenneth Hoffmeyer ,  David Peter Gaio ,  Sukhvinder Singh Kang

    Inventor： Raymond Jonathan Thatcher ,  Mark Kenneth Hoffmeyer ,  David Peter Gaio ,  Sukhvinder Singh Kang

    IPC: G02B6/42 ,  H05K13/04 ,  G02B6/36

    CPC classification number: G02B6/4277 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4284 ,  G02B6/4292

    Abstract: A package for containing a high speed electronic assembly has a small physical size, shielding, pluggability, and is capable of operating at multigigabit transmission rates. The package includes a module and a cover which covers at least the top of the module. An optical assembly and a circuit packaging are inserted into the module. The package, with an appropriate cover, can be removed and inserted without disturbing other packages secured on the board. The circuit packaging is electrically connected to the board through bump connectors, while the circuit packaging itself supplies a normal force for insuring the bump connectors are in contact with the board. The package is attached to the board using an attachment member which is separate from the bump connectors. The bump connectors facilitate high speed transmission. Alignment pins may be used to improve mechanical stability, provide feedback indicative of proper insertion, and to prevent bump connectors from contacting the board until the module is properly positioned. Electromagnetic interference shielding may be provided in the cover. The cover and various components of the module serve as heat sinks for the module. The cover, the pattern of the bump connectors and the positioning of the alignment pins may be selected/altered by an end user without affecting the construction of the module.

    Abstract translation: 用于容纳高速电子组件的包装具有小的物理尺寸，屏蔽性，可插拔性，并且能够以千兆位传输速率运行。 该包装包括至少覆盖模块顶部的模块和盖。 将光学组件和电路封装插入模块中。 具有适当盖子的包装可以被移除并插入，而不会干扰固定在板上的其他包装。 电路封装通过凸块连接器电连接到电路板，而电路封装本身提供法向力以确保凸块连接器与板接触。 使用与凸块连接器分开的附接构件将包装件附接到板上。 凸块连接器便于高速传输。 对准销可用于提高机械稳定性，提供指示正确插入的反馈，以及防止凸块连接器接触板，直到模块正确定位。 可以在盖中提供电磁干扰屏蔽。 模块的盖子和各种部件用作模块的散热器。 盖子，凸块连接器的图案和对准销的定位可以由终端用户选择/改变，而不影响模块的结构。

Patent Agency Ranking