Bicycle Transmission System
    31.
    发明申请
    Bicycle Transmission System 有权
    自行车传动系统

    公开(公告)号:US20120012412A1

    公开(公告)日:2012-01-19

    申请号:US13148635

    申请日:2010-02-12

    IPC分类号: B62M6/45

    摘要: A method is provided for controlling operation of a pedal cycle (10) having a rear hub-mounted electro-mechanical transmission arrangement in which a chain-driven rear sprocket (80), an input electrical machine (120) and the hub (100) are each coupled to a respective branch of a three-branch epicyclic gear set (140). Allowing for natural variations in input torque by a cyclist over a cycle of the crank arms (50), a substantially constant current is caused to exist in the input electrical machine (120) such that a change in torque applied by the cyclist results in a change in transmission ratio between the rear sprocket (80) and the hub (100), thereby providing a form of automatic and continuously variable transmission for the pedal cycle (10).

    摘要翻译: 提供了一种用于控制具有后轮毂安装的机电传动装置的踏板循环(10)的操作的方法,其中链驱动的后链轮(80),输入电机(120)和轮毂(100) 各自联接到三分支行星齿轮组(140)的相应分支。 允许骑自行车者在曲柄臂(50)的周期上的输入扭矩的自然变化,使得输入电机(120)中存在基本上恒定的电流,使得由骑自行车者施加的扭矩的变化导致 改变后链轮(80)和轮毂(100)之间的传动比,从而为踏板循环(10)提供一种自动且无级变速的传动装置。

    BRANCHED POLYARYLENE ETHERS AND THERMOPLASTIC MOLDING COMPOUNDS CONTAINING SAID ETHERS
    32.
    发明申请
    BRANCHED POLYARYLENE ETHERS AND THERMOPLASTIC MOLDING COMPOUNDS CONTAINING SAID ETHERS 审中-公开
    分散的聚乙烯和含有其他物质的热塑性成型化合物

    公开(公告)号:US20110201747A1

    公开(公告)日:2011-08-18

    申请号:US13125898

    申请日:2009-10-19

    IPC分类号: C08L61/16 C08G14/00

    摘要: The present invention relates to branched polyarylene ethers (A) comprising branching sites of the formula (I): The present invention further relates to a process for preparing the branched polyarylene ethers (A) and to thermoplastic molding materials comprising the branched polyarylene ethers (A) and further thermoplastic polymers (B). The present invention finally relates to the use of the thermoplastic molding materials for producing moldings, and to moldings obtainable from the aforementioned thermoplastic molding materials.

    摘要翻译: 本发明涉及包含式(I)的支化位点的支链聚亚芳基醚(A):本发明还涉及制备支化聚亚芳基醚(A)的方法和包含支链聚亚芳基醚(A )和其它热塑性聚合物(B)。 本发明最终涉及热塑性成型材料用于生产模制品的用途,以及可从上述热塑性模塑材料获得的模制品。

    POLYAMIDES WITH ACRYLATE RUBBERS
    33.
    发明申请
    POLYAMIDES WITH ACRYLATE RUBBERS 有权
    具有丙烯酸酯橡胶的聚酰胺

    公开(公告)号:US20100048821A1

    公开(公告)日:2010-02-25

    申请号:US12519030

    申请日:2007-12-05

    IPC分类号: C08L77/00

    摘要: Thermoplastic molding compositions, comprising A) from 10 to 95% by weight of a thermoplastic polyamide, B) from 5 to 90% by weight of an acrylate rubber, obtainable via free-radical-initiated aqueous emulsion polymerization of ethylenically unsaturated monomers in the presence of at least one dispersing agent and of at least one free-radical initiator, where the emulsion polymerization uses from 1 to 50% by weight of an alkene having from 5 to 12 carbon atoms [monomer A], and from 50 to 99% by weight of an ester based on an α,β-monoethylenically unsaturated mono- or dicarboxylic acid having from 3 to 6 carbon atoms and on an alkanol having from 1 to 12 carbon atoms [monomer B], and also, if appropriate, up to 10% by weight of an α,β-monoethylenically unsaturated mono- or dicarboxylic acid having from 3 to 6 carbon atoms and/or its amide [monomer C], and up to 30% by weight of an α,β-ethylenically unsaturated compound different from the monomers A to C [monomer D], and the monomers A to D give a total of 100% by weight, C) from 0 to 40% by weight of a copolymer which comprises vinylaromatic monomer units, D) from 0 to 70% by weight of further additives, where the total of the percentages by weight of A) to D) is 100%.

    摘要翻译: 热塑性成型组合物,其包含A)10至95重量%的热塑性聚酰胺,B)5至90重量%的丙烯酸酯橡胶,其可通过烯键式不饱和单体的自由基引发的水乳液聚合在存在下获得 的至少一种分散剂和至少一种自由基引发剂,其中乳液聚合使用1至50重量%的具有5至12个碳原子的烯烃[单体A]和50至99重量% 基于具有3至6个碳原子的α,b-单 - 烯属不饱和单或二羧酸和具有1至12个碳原子的链烷醇[单体B]的酯的重量,以及如果合适的话,直到 10重量%的具有3至6个碳原子和/或其酰胺[单体C]的α,b-单烯属不饱和单或二羧酸和至多30重量%的α,bgr-烯属 不同于单体A至C [单体D]的不饱和化合物,和t 单体A至D给出总共100重量%,C)0至40重量%的包含乙烯基芳族单体单元的共聚物,D)0至70重量%的其它添加剂,其中 A)至D)的重量百分比为100%。

    THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS
    34.
    发明申请
    THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS 有权
    具有高硬度的热塑性成型组合物

    公开(公告)号:US20100019210A1

    公开(公告)日:2010-01-28

    申请号:US12374954

    申请日:2007-07-17

    IPC分类号: H01B1/24 H01B1/20

    摘要: Thermoplastic molding compositions comprising A) from 40 to 96.2% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of an impact-modifying polymer which comprises functional groups, C) from 1 to 50% by weight of fibrous or particulate fillers or a mixture of these, D) from 0.2 to 5% by weight of a lubricant, E) from 0.5 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of other added materials, where the total of the percentages by weight of components A) to F) is 100%.

    摘要翻译: 包含A)40至96.2重量%的半芳族聚酰胺B)2至30重量%的包含官能团的抗冲改性聚合物,C)1至50重量%的纤维或 颗粒填料或其混合物,D)0.2至5重量%的润滑剂,E)0.5至15重量%的导电添加剂,F)0至30重量%的其它添加材料, 其中组分A)至F)的重量百分比的总和为100%。

    Thermoplastic Molding Materials Based on Polyesters and Styrene Copolymers
    36.
    发明申请
    Thermoplastic Molding Materials Based on Polyesters and Styrene Copolymers 有权
    基于聚酯和苯乙烯共聚物的热塑性成型材料

    公开(公告)号:US20080227920A1

    公开(公告)日:2008-09-18

    申请号:US11997797

    申请日:2006-07-31

    IPC分类号: C08F265/04

    摘要: Thermoplastic molding compositions, comprising A) from 10 to 97.5% by weight of at least one thermoplastic polyester A, B) from 1 to 97.5% by weight of at least one graft polymer B composed of b1) from 40 to 80% by weight of a graft base composed of an elastomeric polymer B1 based on alkyl acrylates having from 1 to 8 carbon atoms in the alkyl radical, on ethylene/propylene, on dienes, or on siloxanes, and with a glass transition temperature below 0° C., b2) from 20 to 60% by weight of a graft B2 composed of b21) from 60 to 95% by weight of styrene or of substituted styrenes B21 of the general formula I  where R is a C1-8-alkyl radical or hydrogen and R1 is a C1-8-alkyl radical and n is 1, 2, or 3, or a mixture of these, and b22) from 5 to 40% by weight of at least one unsaturated nitrile B22, C) from 1 to 97.5% by weight of at least one thermoplastic copolymer C composed of c1) from 60 to 85% by weight of styrene or of substituted styrenes C1 of the general formula 1, or a mixture thereof, and c2) from 15 to 40% by weight of at least one unsaturated nitrile C2, D) from 0.5 to 50% by weight of at least one copolymer D, obtainable via reaction of d1) from 5 to 95% by weight of at least one thermoplastic methacrylate polymer D1 comprising at least one type of functional groups, selected from epoxy, carboxy, hydroxy, anhydride, and oxazoline, with d2) from 5 to 95% by weight of at least one thermoplastic polyester D2, E) from 0 to 40% by weight of at least one filler E, F) from 0 to 2% by weight of at least one organic acid F, G) from 0 to 25% by weight of at least one halogen-free phosphorus compound G, H) from 0 to 45% by weight of other additives H, where the entirety of components A to H always gives 100%.

    摘要翻译: 热塑性成型组合物,其包含A)10至97.5重量%的至少一种热塑性聚酯A,B)1至97.5重量%的至少一种接枝聚合物B,其由以下组分组成:b1)40至80重量% 由基于丙烯酸烷基酯在烷基上具有1至8个碳原子的烷基丙烯酸酯,乙烯/丙烯,二烯或硅氧烷上的玻璃化转变温度低于0℃的弹性体聚合物B1,b2 )20〜60重量%的由b21组成的接枝物B2)60〜95重量%的苯乙烯或通式I的取代苯乙烯B21,其中R为C 1-8烷基, - 烷基或氢,R 1是C 1-8 - 烷基,n是1,2或3,或它们的混合物,和b22) 5至40重量%的至少一种不饱和腈B22,C)1至97.5重量%的至少一种由c1组成的热塑性共聚物C,60至85重量%的苯乙烯或取代苯乙烯的C1 ge 1)或其混合物,c2)15-40%(重量)的至少一种不饱和腈C2,D)0.5-50%重量的至少一种共聚物D,可通过d1) 5至95重量%的至少一种包含至少一种选自环氧基,羧基,羟基,酸酐和恶唑啉的官能团的热塑性甲基丙烯酸酯聚合物D1,其中d2)5至95重量%的至少一种 热塑性聚酯D2,E)0至40重量%的至少一种填料E,F)0至2重量%的至少一种有机酸F,G)0至25重量%的至少一种 无卤磷化合物G,H)0〜45重量%的其他添加剂H,其中组分A至H的总量总是给出100%。

    Semiconductor wafers of silicon and method for their production
    37.
    发明申请
    Semiconductor wafers of silicon and method for their production 有权
    硅半导体晶圆及其生产方法

    公开(公告)号:US20080187736A1

    公开(公告)日:2008-08-07

    申请号:US12011713

    申请日:2008-01-29

    IPC分类号: B32B9/00 H01L21/20

    CPC分类号: C30B29/06 C30B15/203

    摘要: Semiconductor wafers of silicon are produced by pulling a single crystal growing on a phase boundary from a melt contained in a crucible and cutting of semiconductor wafers therefrom, wherein during pulling of the single crystal, heat is delivered to a center of the phase boundary and a radial profile of a ratio V/G from the center to an edge of the phase boundary is controlled, G being the temperature gradient perpendicular to the phase boundary and V being the pull rate. The radial profile of the ratio V/G is controlled so that the effect of thermomechanical stress in the single crystal adjoining the phase boundary, is compensated with respect to creation of intrinsic point defects. The invention also relates to defect-free semiconductor wafers of silicon, which can be produced economically by this method.

    摘要翻译: 硅的半导体晶片是通过从包含在坩埚中的熔融物中拉出在相边界上生长的单晶并从其中切割半导体晶片而制造的,其中在单晶拉制期间,热被传递到相边界的中心,并且 控制从相位边界的中心到边缘的比率V / G的径向轮廓,G是垂直于相边界的温度梯度,V是牵引速率。 控制比率V / G的径向轮廓,使得邻接相位边界的单晶中的热机械应力的影响被补偿以产生固有点缺陷。 本发明还涉及硅的无缺陷半导体晶片,其可以通过该方法经济地制造。

    Image processing apparatus and methods
    38.
    发明申请
    Image processing apparatus and methods 有权
    图像处理装置和方法

    公开(公告)号:US20080069445A1

    公开(公告)日:2008-03-20

    申请号:US11220371

    申请日:2005-09-06

    申请人: Martin Weber

    发明人: Martin Weber

    IPC分类号: G06K9/00

    摘要: A method is provided of processing digital image data representing an image of an object to determine data representing a boundary for said object, the method comprising: inputting said image data; initializing a level set function representation of an interface for approximating said boundary; determining a motion of said interface subject to a combined cost function comprising a first cost comprising a signed distance constraint on said interface level set function representation and a second cost comprising a measure of said interface responsive to a density or metric of said image; modifying said level set function representation of said interface in accordance with said determined motion; repeating said determining and modifying such that said interface converges on said boundary; and determining boundary data representing said boundary from said converged level set function interface representation.

    摘要翻译: 提供了一种处理表示对象的图像的数字图像数据以确定表示所述对象的边界的数据的方法,所述方法包括:输入所述图像数据; 初始化用于近似所述边界的接口的级集合函数表示; 根据组合成本函数确定所述接口的运动,所述组合成本函数包括第一成本,所述第一成本包括对所述接口级集合函数表示的有符号距离约束,以及响应于所述图像的密度或度量的所述接口的度量的第二成本; 根据所述确定的运动修改所述接口的所述电平集函数表示; 重复所述确定和修改使得所述接口收敛在所述边界上; 以及从所述会聚级集合函数接口表示确定表示所述边界的边界数据。

    Thermoplastic molding compositions with an improved melt stability based on polyarlene ether sulfones
    40.
    发明授权
    Thermoplastic molding compositions with an improved melt stability based on polyarlene ether sulfones 失效
    具有改进的基于聚芳醚砜的熔体稳定性的热塑性模塑组合物

    公开(公告)号:US07163987B2

    公开(公告)日:2007-01-16

    申请号:US10491481

    申请日:2002-09-27

    IPC分类号: C08L81/06

    CPC分类号: C08L81/06 C08L81/00

    摘要: The present invention relates to molding compositions comprising A) from 39 to 99% by weight of at least one polyarylene ether sulfone built up from bifunctional monomer units, B) from 1 to 20% by weight of at least one polyarylene ether sulfone containing, based on the total weight of component B, from 0.1 to 10% by weight of units which derive from 1,1,1-tris(4-hydroxyphenyl)ethane, C) from 0 to 60% by weight of at least one filler, D) from 0 to 40% by weight of at least one impact-modifying rubber, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E give 100% in total, and also to a process for preparing these molding compositions, to their use, and to moldings, films, fibers, or foams obtainable from these molding compositions.

    摘要翻译: 本发明涉及模塑组合物,其包含A)39至99重量%的由双官能单体单元构成的至少一种聚亚芳基醚砜,B)1至20重量%的至少一种含有基团的聚亚芳基醚砜 组分B的总重量为0.1至10重量%的衍生自1,1,1-三(4-羟基苯基)乙烷的单元,C)0至60重量%的至少一种填料,D )0至40重量%的至少一种冲击改性橡胶,和E)0至40重量%的一种或多种各种添加剂,其中组分A至E的重量百分比总计为100% 以及制备这些模塑组合物及其用途的方法,以及可从这些模塑组合物获得的模制品,薄膜,纤维或泡沫的制备方法。