公开(公告)号：US20110156428A1

公开(公告)日：2011-06-30

申请号：US12648594

申请日：2009-12-29

Applicant: Masafumi Inoue ,  Kiyohito Takano ,  Mike Boyle ,  Scott Gordon

Inventor： Masafumi Inoue ,  Kiyohito Takano ,  Mike Boyle ,  Scott Gordon

IPC: B62D25/00 ,  E06B9/56

CPC classification number: B62D33/0273 ,  B60N2/3011 ,  B60N2/3022 ,  B60N2/305 ,  B60N2/3065 ,  B60N2/309 ,  B60R5/04 ,  B60R21/06 ,  B60R2021/0083 ,  B62D47/003

Abstract: A pick-up type utility vehicle with an expandable cargo bed, comprises a front seat, a rear seat; the cargo bed, and a screen separating between the rear seat and the cargo bed, on the chassis, the pick-up type utility vehicle further comprising an operating part for moving the screen, and a movement mechanism moving the screen toward the front and back direction by operation of the operating part.

Abstract translation: 一种具有可膨胀货床的拾取式多用途车，包括前排座椅，后座椅; 货物床和在后座和货物床之间分离在屏幕上的屏幕，拾取式多用途车还包括用于移动屏幕的操作部分和移动屏幕朝向前后移动的移动机构 操作部件的操作方向。

公开(公告)号：US20100264196A1

公开(公告)日：2010-10-21

申请号：US12761578

申请日：2010-04-16

Applicant: Yuzuru Inaba ,  Masafumi Inoue

Inventor： Yuzuru Inaba ,  Masafumi Inoue

IPC: B23K31/02

CPC classification number: H05K3/305 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2224/0401

Abstract: In electronic component mounting operation for mounting an electronic component having bumps provided on its lower surface to a substrate by soldering, solder paste is printed on electrodes, and positions of the solder paste are detected in print inspection. An inspection result is output as solder paste position data. In a resin coating process where corners are previously coated with reinforcing resin, control parameters of a coating device that applies the reinforcing resin are updated in accordance with solder paste position data, thereby correcting positions where the coating device applies the reinforcing resin. Mixed application of the reinforcing resin on the already-printed solder paste can thereby be prevented.

Abstract translation: 在电子部件安装操作中，通过焊接将具有设置在其下表面上的凸起的电子部件安装到基板上，将焊膏印刷在电极上，并且在印刷检查中检测焊膏的位置。 作为焊膏位置数据输出检查结果。 在预先用增强树脂涂覆角部的树脂涂布工序中，根据焊膏位置数据更新施加增强树脂的涂布装置的控制参数，由此校正涂布装置施加增强树脂的位置。 因此可以防止在已印刷的焊膏上混合施加增强树脂。

公开(公告)号：US20100071195A1

公开(公告)日：2010-03-25

申请号：US11813872

申请日：2006-01-20

Applicant: Masahiro Kihara ,  Masafumi Inoue ,  Wataru Hidese

Inventor： Masahiro Kihara ,  Masafumi Inoue ,  Wataru Hidese

IPC: B23P19/00

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  H05K13/082 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：US20080289518A1

公开(公告)日：2008-11-27

申请号：US12123959

申请日：2008-05-20

Applicant: Masafumi Inoue ,  Fumio Kikutsugi ,  Masahiro Kihara

Inventor： Masafumi Inoue ,  Fumio Kikutsugi ,  Masahiro Kihara

IPC: B05C9/08 ,  B41M1/12

CPC classification number: B41F15/26 ,  B41F15/0818 ,  B41F33/0036 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2203/163

Abstract: In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.

Abstract translation: 在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时，获得每个单独基板的单独位置偏差的多个平均值，然后，如果 指示各个位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值DeltaM小于或等于公差值Delta（t），最大值Mmax的中间值 并且获得最小值Mmin，并且基于中间值（Mmax + Mmin）/ 2来校正掩模板和载体的定位参数。

公开(公告)号：US20080207618A1

公开(公告)日：2008-08-28

申请号：US11767021

申请日：2007-06-22

Applicant: Motohide SATOH ,  Hisateru Aramaki ,  Masaki Yamashita ,  Masafumi Inoue ,  Hiroshi Kawakami ,  Hisashi Shinkai ,  Hiroshi Nakamura ,  Yuji Matsuzaki ,  Shuichi Wamaki

Inventor： Motohide SATOH ,  Hisateru Aramaki ,  Masaki Yamashita ,  Masafumi Inoue ,  Hiroshi Kawakami ,  Hisashi Shinkai ,  Hiroshi Nakamura ,  Yuji Matsuzaki ,  Shuichi Wamaki

IPC: A61K31/5377 ,  C07D413/08 ,  C07D403/08 ,  A61K31/4709 ,  A61P31/18

CPC classification number: C07D215/56 ,  C07D401/10 ,  C07D413/10 ,  C07D417/10

Abstract: The present invention relates to a compound represented by the following formula [I] wherein each symbol is as defined in the specification, or a pharmaceutically acceptable salt thereof, or a solvate thereof, and a pharmaceutical composition, an anti-HIV agent and an HIV integrase inhibitor containing such compound. The compound of the present invention has an HIV integrase inhibitory activity, and is useful as an anti-HIV agent, or as an agent for the prophylaxis or treatment of AIDS. In addition, by the combined use with other anti-HIV agents such as a protease inhibitor, a reverse transcriptase inhibitor and the like, it can be a more effective anti-HIV agent. Because it shows integrase-specific high inhibitory activity, the compound can be a pharmaceutical agent safe on human body, which causes only a fewer side effects.

Abstract translation: 本发明涉及由下式[I]表示的化合物，其中每个符号如说明书中所定义，或其药学上可接受的盐，或其溶剂合物，药物组合物，抗HIV剂和HIV 含有该化合物的整合酶抑制剂。 本发明的化合物具有HIV整合酶抑制活性，可用作抗HIV剂，或用作预防或治疗AIDS的药剂。 此外，通过与其它抗HIV剂如蛋白酶抑制剂，逆转录酶抑制剂等的组合使用，它可以是更有效的抗HIV剂。 因为它显示出整合酶特异性的高抑制活性，所以化合物可以是对人体安全的药剂，其副作用较小。

公开(公告)号：US07213332B2

公开(公告)日：2007-05-08

申请号：US10922731

申请日：2004-08-20

Applicant: Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Youichi Yanai ,  Yasuhiro Morimitsu

Inventor： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Youichi Yanai ,  Yasuhiro Morimitsu

IPC: H05K3/34

CPC classification number: H05K13/08 ,  H05K13/0469 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract translation: 将组件安装在电路板上的方法。 计算安装组件的安装坐标。 确定组件的焊料位于电极上的打印位置。 存储焊料的打印位置。 基于以前的步骤制备安装在焊料上的部件的安装位置数据。 使用前面步骤中收集的信息安装组件。

公开(公告)号：US20070087663A1

公开(公告)日：2007-04-19

申请号：US11602336

申请日：2006-11-21

Applicant: Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

Inventor： Takuji Hayama ,  Masafumi Inoue ,  Kunihiko Sakurai

IPC: B24B51/00 ,  B24B49/00

CPC classification number: B24B47/22 ,  B24B37/30 ,  B24B49/16 ,  H01L21/30625

Abstract: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28). The polishing apparatus also includes a control unit (34) operable to adjust the stopper (32) in vertical position when the retainer ring (44) is brought into contact with the polishing surface (10) while a lower surface of the housing (40) of the top ring (20) is located at a predetermined height from the polishing surface (10) so that the distance between the stopper (32) and the bracket (28) is equal to a difference between a height of the lower surface of the housing (40) from the polishing surface (10) at the time of polishing and the predetermined height.

公开(公告)号：US20060084665A1

公开(公告)日：2006-04-20

申请号：US11230330

申请日：2005-09-20

Applicant: Motohide Satoh ,  Hisateru Aramaki ,  Hiroshi Nakamura ,  Masafumi Inoue ,  Hiroshi Kawakami ,  Hisashi Shinkai ,  Yuji Matsuzaki ,  Kazunobu Yamataka

Inventor： Motohide Satoh ,  Hisateru Aramaki ,  Hiroshi Nakamura ,  Masafumi Inoue ,  Hiroshi Kawakami ,  Hisashi Shinkai ,  Yuji Matsuzaki ,  Kazunobu Yamataka

IPC: A61K31/519 ,  C07D455/02 ,  A61K31/4745

CPC classification number: C07D471/04 ,  A61K31/4745 ,  A61K31/519 ,  C07D455/02

Abstract: A pharmaceutical agent having an anti-HIV action, particularly, a pharmaceutical agent having an integrase inhibitory action, is provided. The present invention relates to a quinolizinone compound represented by the following formula [I] wherein each symbol is as defined in the specification, a pharmaceutically acceptable salt thereof, and an anti-HIV agent containing same as an active ingredient. The compound of the present invention has an HIV integrase inhibitory action and is useful as an anti-HIV agent for the prophylaxis or therapy of AIDS. Moreover, by a combined use with other anti-HIV agents such as protease inhibitors, reverse transcriptase inhibitors and the like, the compounds can become a more effective anti-HIV agent. Since the compound has a high inhibitory activity specific for integrases, the compound can provide a safe pharmaceutical agent for human with a fewer side effects.

Abstract translation: 提供具有抗HIV作用的药剂，特别是具有整合酶抑制作用的药剂。 本发明涉及由下式[I]表示的喹嗪酮化合物，其中各符号如说明书中所定义，其药学上可接受的盐和含有作为活性成分的抗HIV剂。 本发明的化合物具有HIV整合酶抑制作用，可用作预防或治疗AIDS的抗HIV剂。 此外，通过与其它抗HIV剂如蛋白酶抑制剂，逆转录酶抑制剂等的组合使用，化合物可以成为更有效的抗HIV剂。 由于化合物对整合酶具有高的抑制活性，所以化合物可以为人体提供安全的药剂，副作用较少。

公开(公告)号：US20060060263A1

公开(公告)日：2006-03-23

申请号：US10545374

申请日：2003-08-28

Applicant: Masafumi Inoue

Inventor： Masafumi Inoue

IPC: B27D1/00 ,  B27F7/00 ,  B27G11/00

CPC classification number: B27J1/00 ,  B27M3/00 ,  F16B15/00

Abstract: A method is disclosed for manufacturing bamboo nails. The method includes horizontally laying down small bamboo plates, obtained by cutting a bamboo piece radially from the center axis thereof, in a press. The small bamboo plates are then pressed perpendicularly to the fibers to produce a compressed flat plate. Finally, the compressed flat plate is cut in the shape of a multangular column. Thus the strength of a wooden material is increased.

Abstract translation: 披露制造竹钉的方法。 该方法包括水平放置通过在压机中从其中心轴线径向切割竹片而获得的小竹板。 然后将小竹板垂直于纤维压制以产生压缩的平板。 最后，将压缩平板切割成多角柱形。 因此，木材的强度增加。

公开(公告)号：US06957950B2

公开(公告)日：2005-10-25

申请号：US10356624

申请日：2003-02-03

Applicant: Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue

Inventor： Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue

IPC: F04B27/10 ,  F04B39/12 ,  F04B1/26 ,  F04B17/00

CPC classification number: F04B39/121 ,  F04B27/1081

Abstract: According to the invention, a compressor having a threaded screw connection portion formed directly on a fitting portion of the housing is provided. Since no through bolt or the like for connecting two-parts of the housing is used, the diameter of the housing can be reduced. However, in a case that a suction port and discharge port do not align with an external mounting structure, a mounting means able to slide on the housing and adjust the positions of mounting brackets at least in the direction of rotation is added.

Abstract translation: 根据本发明，提供一种压缩机，其具有直接形成在壳体的装配部分上的螺纹连接部分。 由于不使用用于连接壳体的两部分的通过螺栓等，因此可以减小壳体的直径。 然而，在吸入口和排出口不与外部安装结构对准的情况下，增加了能够在壳体上滑动并且至少沿旋转方向调节安装支架的位置的安装装置。