摘要:
A shoulder webbing anchoring device according to the present invention includes a side anchor fixed on a window frame or a side wall of a vehicle body and a webbing anchor holding one end of the webbing and coupled to the side anchor through an anchor pin having an enlarged head. The side anchor has small and large diameter holes partially overlapping each other, the small diameter hole being smaller than the enlarged head and the large diameter hole being larger than the enlarged head, whereby when the anchor pin is in the small diameter hole, the webbing anchor is rotatably coupled with the side anchor, and when the anchor pin is in the large diameter hole, the webbing anchor is allowed to be separated from the side anchor.
摘要:
When leaving a vehicle, an occupant turns forwardly in the vehicle a guide lever, through which extends a webbing, one end of which is engaged with a vehicle door and the other end of which is wound up into a retractor provided at the substantially central portion of the vehicle, to thereby enlarge a space formed between the webbing and a seat. This release lever is locked in a condition of being turned forwardly in the vehicle. However, the release lever is unlocked after the occupant enters the vehicle and before the vehicle enters the normal running condition, thereby enabling to bring the occupant into a suitable seatbelt fastened condition.
摘要:
A glass substrate is held by a glass substrate holding member in the vertical direction, and a nozzle is used to eject an infrared cutoff liquid onto the upper portion of the glass substrate. The infrared cutoff liquid flows vertically downward so as to be applied onto the glass substrate. The film thickness of the lower portion of an infrared cutoff film is greater than that of the upper portion. The glass substrate is dried for approximately five minutes at room temperature. Then, the glass substrate onto which the infrared cutoff liquid has been applied is placed in an oven preheated to 200° C., heated for ten minutes, and then cooled. The glass substrate having the infrared cutoff film thereon is installed in a railroad vehicle such that the lower portion of the glass substrate is located on the lower side with respect to the railroad vehicle.
摘要:
A semiconductor device including a first transistor of a first conductivity type provided on a first active region of a semiconductor region, and a second transistor of a second conductivity type provided on a second active region of the semiconductor region. The first transistor includes a first gate insulating film and a first gate electrode, the first gate insulating film contains a high-k material and a first metal, and the first gate electrode includes a lower conductive film, a first conductive film and a first silicon film. The second transistor includes a second gate insulating film and a second gate electrode, the second gate insulating film contains a high-k material and a second metal, and the second gate electrode includes a second conductive film made of the same material as the first conductive film, and a second silicon film.
摘要:
The semiconductor device includes: a transistor having a gate electrode formed on a semiconductor substrate and first and second source/drain regions formed in portions of the semiconductor substrate on both sides of the gate electrode; a gate interconnect formed at a position opposite to the gate electrode with respect to the first source/drain region; and a first silicon-germanium layer formed on the first source/drain region to protrude above the top surface of the semiconductor substrate. The gate interconnect and the first source/drain region are connected via a local interconnect structure that includes the first silicon-germanium layer.
摘要:
A semiconductor device includes a MIS transistor formed in a region of a semiconductor region. The MIS transistor includes a gate insulating film formed on the region, a gate electrode formed on the gate insulating film and fully silicided with metal, source/drain regions formed in parts of the region on the sides of the gate electrode and an insulating film formed to cover the gate electrode and the source/drain regions to cause stress strain in part of the region below the gate electrode.
摘要:
A memory cell transistor and a planar capacitor are provided in a memory region, and both transistors of a CMOS device are provided in a logic circuit region. A capacitance dielectric 15 and a plate electrode 16b of the planar capacitor are provided over a trench shared with a shallow trench isolation 12a, and the upper part of the trench is filled with the capacitance dielectric 15 and the plate electrode 16b. An n-type diffusion layer 19 that is a storage node is formed, with an end region thereof extending along one side of the upper part of the trench, to a region of the substrate overlapping with the shallow trench isolation 12a. The area of a part of the substrate functioning as a capacitor can be increased without increasing the substrate area.
摘要:
Coating liquid prepared by dissolving an acid and a silicon alkoxide into alcohol, containing at least one of either a silicon alkoxide or a hydrolyzate thereof (including a partial hydrolyzate) in an amount of 0.010 to 3% by weight (in terms of silica), an acid in terms of 0.0010 to 1.0 normality, and water in terms of 0 to 10% by weight is coated on a substrate to produce an article coated with a silica-based film. By this method for producing a silica-based film coated article, an excellent silica-based film coated article can be obtained without requiring baking and pretreatment. Furthermore, a functional film coated article excellent in durability can be produced in a short period of time and safely by using the abovementioned silica-based film as a primer film and applying thereon an organosilane having a hydrolyzable group and a functional group having a specific function or a hydrolyzate thereof.
摘要:
A manufacturing method for a semiconductor device, whereby poly-silicon serving as an etching stopper is formed above a redundant fuse at the same time as a cell plate is. A silicon nitride film, an oxide film, and another oxide film on the redundant fuse are consecutively etched using the poly-silicon as the etching stopper. Then the poly-silicon is etched.
摘要:
Formed in a second interlayer dielectric are a first contact hole and a second contact hole. The first and second contact holes each extend to a first-level interconnect line. Tungsten is formed on the entirety of a substrate to form a first plug, a second plug, and a tungsten layer. A silicon oxide layer is formed. Thereafter, a patterning process is carried out to form a second-level interconnect line which is connected with the first plug and a top protective layer, and the top of the second plug remains exposed. A sidewall is formed on the side surfaces of the second-level interconnect line and the top protective layer. Subsequently, a third-level interconnect line, which is connected with the exposed second plug, is formed. Such arrangement not only reduces the number of contact hole formation masks, it also cuts down the number of fabrication steps. Further, the aspect ratio of the second contact hole becomes lower thereby achieving highly reliable semiconductor devices.