摘要:
A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms --COO.sup.- or --SO.sub.3.sup.- ; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150.degree. C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. ##STR1## where R.sub.1 and R.sub.2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents >C.dbd.O or --SO.sub.2 --; Y represents a divalent organic group; R.sub.1 and R.sub.2 can be bonded together, forming a ring; and at least one of R.sub.1, R.sub.2, and Y has a substituent which is decomposed by an acid.
摘要:
A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
摘要:
The present invention provides a pattern forming method using phase separation structure of self-assembling block copolymer and minimizing variations in pattern. A substrate having groove structure pre-formed thereon, is coated with a solution of the block copolymer comprising at least one block having a mesogen group. The block copolymer is caused to self-assemble in the groove to form block copolymer assemblies, which are regularly arrayed. The invention also relates to a processing method of processing a substrate by the use of the pattern obtained by the pattern forming method as a template.
摘要:
There is provided a method for pattern formation, including a step of coating a composition comprising a block copolymer, a silicon compound, and a solvent for dissolving these components onto an object to form a layer of the composition on the object, a step of subjecting the layer of the composition to self-organization of the block copolymer to cause phase separation into a first phase, in which the silicon compound is localized, having higher etching resistance by heat treatment or/and oxygen plasma treatment, and a second phase comprising a polymer phase and having lower etching resistance by heat treatment or/and oxygen plasma treatment, and thereby forming a pattern layer with a fine pattern, and a step of etching the object using as a mask the thus formed pattern layer.
摘要:
A method of manufacturing a patterned magnetic recording medium includes coating a magnetic film with a resist which is decomposed by exposure to electromagnetic radiation or an electron beam to have a low molecular weight, forming a pattern on the resist by an imprinting method, transferring the pattern to the magnetic film by using the resist having the pattern formed thereon as a mask, and removing the resist by exposing the resist to the electromagnetic radiation or the electron beam.
摘要:
Provided is an organic EL display including a substrate, anodes arranged on one major surface of the substrate, an insulating separator layer covering the major surface of the substrate and having through-holes in the positions of the anodes, organic emitting layers disposed on the anodes, buffer layers disposed between the anodes and the organic emitting layers, and a cathode covering the organic emitting layers, wherein a central portion of each of the buffer layers is thicker than its periphery.
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO— or —SO3—; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. where R1 and R2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO− or —SO3−; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. where R1 and R2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents >C═O or —SO2—; Y represents a divalent organic group; R1 and R2 can be bonded together, forming a ring; and at least one of R1, R2, and Y has a substituent which is decomposed by an acid.
摘要:
Disclosed is a positive photosensitive composition, comprising an alkali soluble resin having at least some or all of the alkali soluble groups protected by a substituent which can be decomposed by an acid, a compound which generates an acid upon irradiation with an actinic radiation, and a compound which generates water under action of an acid catalyst.