公开(公告)号：US07578886B2

公开(公告)日：2009-08-25

申请号：US10564980

申请日：2004-07-28

申请人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

发明人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

IPC分类号： B08B5/04

CPC分类号： H01L21/02052 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0229 ,  B08B2203/0288 ,  C23C18/1628 ,  C25D17/001 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. A substrate holding apparatus is provided for holding and rotating a substrate. The substrate processing apparatus for processing a substrate while supplying a fluid to the substrate includes a substrate holder for holding and rotating the substrate, and a holder suction unit for sucking the fluid from the substrate holder. The substrate holding apparatus includes a plurality of rollers which are brought into contact with an edge portion of a substrate so as to hold and rotate the substrate, and at least one moving mechanism for moving the rollers.

摘要翻译： 提供了一种基板处理装置和基板处理方法，用于在旋转诸如半导体晶片或液晶基板的基板的同时进行化学液体处理，清洁处理，干燥处理等。 提供用于保持和旋转衬底的衬底保持装置。 用于在向衬底供应流体的同时处理衬底的衬底处理设备包括用于保持和旋转衬底的衬底保持器，以及用于从衬底保持器吸取流体的保持器抽吸单元。 基板保持装置包括与基板的边缘部分接触以便​​保持和旋转基板的多个辊以及用于移动辊的至少一个移动机构。

公开(公告)号：US20090017733A1

公开(公告)日：2009-01-15

申请号：US11629463

申请日：2006-04-18

申请人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

发明人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B21/16 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67092 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68792

摘要： A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).

摘要翻译： 基板处理装置（1）具有用于研磨基板周边部分的第一研磨单元（400A）和第二研磨单元（400B）。 两个抛光单元（400A，400B）中的每一个包括用于抛光基板的周边部分的斜面抛光装置（450A，450B）和用于抛光基板的凹口的凹口抛光装置（480A，480B）。 基板处理装置（1）具有形成在两个研磨单元（400A，400B）之间的维护空间（7）。 两个抛光单元（400A，400B）中的斜面抛光装置（450A，450B）面向维护空间（7），以便从维护空间（7）进入。

公开(公告)号：US09138854B2

公开(公告)日：2015-09-22

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

公开(公告)号：US08506363B2

公开(公告)日：2013-08-13

申请号：US12654561

申请日：2009-12-23

申请人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

发明人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

IPC分类号： B24B29/02

CPC分类号： H01L21/68792 ,  B23Q3/088 ,  B24B37/30 ,  B24B41/068 ,  H01L21/6838 ,  H01L21/6875

摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.

摘要翻译： 衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。 衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性​​地耦合到真空源和流体供应源的流体通道。 抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。

公开(公告)号：US20110165825A1

公开(公告)日：2011-07-07

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B9/065

摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

摘要翻译： 根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置 衬底周边。 抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。 抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。

公开(公告)号：US06719300B2

公开(公告)日：2004-04-13

申请号：US09771786

申请日：2001-01-29

申请人： Michio Fujino ,  Katsunori Ueda ,  Toshihiko Kumasaka ,  Masaya Seki

发明人： Michio Fujino ,  Katsunori Ueda ,  Toshihiko Kumasaka ,  Masaya Seki

IPC分类号： F02F1100

CPC分类号： F16J15/123 ,  F16J15/0818 ,  F16J15/14 ,  F16J2015/0856

摘要： A metal gasket for sealing a region whereat there exists three pairs of sets of opposing surfaces between a cylinder block, a chain case and a cylinder head of a chain driving engine. The metal gasket includes an elastic seal member provided on an inner rim of a chain opening formed in said metal gasket, and a storing structure for liquid gasket material used for sealing. The storing structure defined is an enlargement of the chain opening oriented to coincide with a juncture of the region whereat three pairs of opposing surface areas exist, the enlargement defining a cavity in which is housed liquid gasket material and a through hole is provided externally of the cavity.

摘要翻译： 一种用于密封在链轮驱动发动机的气缸体，链条壳体和气缸盖之间存在三对相对表面的区域的金属衬垫。 金属垫圈包括设置在形成在所述金属垫圈中的链条开口的内缘上的弹性密封件，以及用于密封的液体垫圈材料的储存结构。 定义的存储结构是链开口的放大，其定向为与存在三对相对表面区域的区域的接合部重合，限定其中容纳有液体垫圈材料的空腔的扩大部和通孔设置在通孔的外部 腔。

公开(公告)号：US08393935B2

公开(公告)日：2013-03-12

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00 ,  B24B21/00

CPC分类号： B24B9/065

摘要： A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.

摘要翻译： 抛光装置通过使抛光工具与基板的周边滑动接触来抛光基板的周边（斜面部分，切口部分，边缘切割部分）。 抛光装置包括：被配置为保持基板的基板保持器，以及抛光头，其被构造成使用抛光工具抛光由基板保持器保持的基板的周边。 抛光头包括用于将抛光工具压靠在基板的周边上的压垫，以及配置成使压垫往复运动的线性电动机。

公开(公告)号：US20090227189A1

公开(公告)日：2009-09-10

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

摘要翻译： 抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。 抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑 通过流体的衬底的周边。 周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。

公开(公告)号：US20060234503A1

公开(公告)日：2006-10-19

申请号：US10564980

申请日：2004-07-28

申请人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

发明人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

IPC分类号： H01L21/44 ,  B65G47/91

CPC分类号： H01L21/02052 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0229 ,  B08B2203/0288 ,  C23C18/1628 ,  C25D17/001 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).

摘要翻译： 本发明涉及在旋转诸如半导体晶片或液晶基板的基板的同时进行化学液体处理，清洁处理，干燥处理等的基板处理装置和基板处理方法。 本发明还涉及用于保持和旋转衬底的衬底保持装置。 另外，在向基板（W）供给流体的同时，对基板（W）进行处理的基板处理装置（1）具备用于保持和旋转基板（W）的基板支架（11），以及用于 从基板支架（11）吸入流体。 基板保持装置包括与基板（W）的边缘部分接触以便​​保持和旋转基板（W）的多个辊（20），以及至少一个移动机构（303a），用于 移动辊子（20）。