THERMOELECTRIC DEVICE
    32.
    发明申请
    THERMOELECTRIC DEVICE 审中-公开
    热电装置

    公开(公告)号:US20130000688A1

    公开(公告)日:2013-01-03

    申请号:US13387015

    申请日:2010-03-23

    IPC分类号: H01L35/28 H01L35/34 B82Y99/00

    CPC分类号: H01L35/32 H01L35/34

    摘要: A thermoelectric device (100) includes a pair of spaced apart oppositely doped structures (110, 120) connecting between a common electrode (140) at a first end and different ones of a pair (150) of separate electrodes (150a, 150b) at a second end of the structures. Each oppositely doped structure includes a first material (112, 122) of a respectively doped semiconductor bounded by a second material (114, 124, 116, 126). Boundaries (111, 121) between the respective first and second materials are parallel to a charge carrier conduction path between the common electrode and the separate electrodes. The respectively doped semiconductor has a thickness configured to be less than a phonon scattering length.

    摘要翻译: 热电装置(100)包括一对间隔开的相对掺杂的结构(110,120),其连接在第一端的公共电极(140)和一对(150)分离电极(150a,150b)中的不同电极 结构的第二端。 每个相对掺杂的结构包括由第二材料(114,124,116,126)界定的分别掺杂的半导体的第一材料(112,122)。 各个第一和第二材料之间的边界(111,121)平行于公共电极和单独电极之间的电荷载流子传导路径。 分别掺杂的半导体具有被配置为小于声子散射长度的厚度。

    OPTICAL SENSOR NETWORKS AND METHODS FOR FABRICATING THE SAME
    33.
    发明申请
    OPTICAL SENSOR NETWORKS AND METHODS FOR FABRICATING THE SAME 审中-公开
    光传感器网络及其制作方法

    公开(公告)号:US20120281980A1

    公开(公告)日:2012-11-08

    申请号:US13384943

    申请日:2010-01-29

    IPC分类号: H04B10/08

    摘要: Various embodiments of the present invention are directed to sensor networks and to methods for fabricating sensor networks. In one aspect, a sensor network includes a processing node (110, 310), and one or more sensor lines (102,202,302) optically coupled to the processing node. Each sensor line comprises a waveguide (116,216,316), and one or more sensor nodes (112,210). Each sensor node is optically coupled to the waveguide and configured to measure one or more physical conditions and, encode measurement results in one or more wavelengths of light carried by the waveguide to the processing node.

    摘要翻译: 本发明的各种实施例涉及传感器网络以及用于制造传感器网络的方法。 在一个方面,传感器网络包括处理节点(110,310)以及光耦合到处理节点的一个或多个传感器线(102,202,302)。 每个传感器线包括波导(116,216,316)和一个或多个传感器节点(112,210)。 每个传感器节点光学耦合到波导并且被配置成测量一个或多个物理条件,并将波导携带的一个或多个波长的测量结果编码到处理节点。

    PHOTONIC DEVICE AND METHOD OF MAKING THE SAME
    35.
    发明申请
    PHOTONIC DEVICE AND METHOD OF MAKING THE SAME 失效
    光电装置及其制造方法

    公开(公告)号:US20120032168A1

    公开(公告)日:2012-02-09

    申请号:US13258404

    申请日:2009-04-30

    IPC分类号: H01L31/0368 H01L31/18

    摘要: A photonic device (200) and method (100) of making the photonic device (200) employs preferential etching of grain boundaries of a polycrystalline semiconductor material layer (210). The method (100) includes growing (110) the polycrystalline layer (210) on a substrate (201). The polycrystalline layer includes a transition region (212) of variously oriented grains and a region (214) of columnar grain boundaries (215) adjacent to the transition region. The method further includes preferentially etching (120) the colunmar grain boundaries to provide tapered structures (220) of the semiconductor material that are continuous (217) with respective aligned grains (213) of the transition region. The tapered structures are predominantly single crystal. The method further includes forming (140) a conformal semiconductor junction (240) on the tapered structures and providing (160) first and second electrodes. The first electrode (201, 262) is adjacent to the transition region and the second electrode (260) is adjacent to a surface layer of the conformal semiconductor junction.

    摘要翻译: 制造光子器件(200)的光子器件(200)和方法(100)采用对多晶半导体材料层(210)的晶界的优先蚀刻。 方法(100)包括在衬底(201)上生长(110)多晶层(210)。 多晶层包括不同取向晶粒的过渡区域(212)和与过渡区域相邻的柱状晶界(215)的区域(214)。 该方法还包括优先蚀刻(120)晶体晶粒边界以提供与过渡区域的相应对准晶粒(213)连续(217)的半导体材料的锥形结构(220)。 锥形结构主要是单晶。 该方法还包括在锥形结构上形成(140)共形半导体结(240)并提供(160)第一和第二电极。 第一电极(201,262)与过渡区域相邻,第二电极(260)与保形半导体结的表面层相邻。

    Semiconductor device and methods thereof
    36.
    发明授权
    Semiconductor device and methods thereof 有权
    半导体器件及其方法

    公开(公告)号:US08097499B2

    公开(公告)日:2012-01-17

    申请号:US11702624

    申请日:2007-02-06

    IPC分类号: H01L21/00 H01L21/84

    摘要: A semiconductor device and method thereof. The example method may include forming a semiconductor device, including forming a first layer on a substrate, the first layer including aluminum nitride (AlN), forming a second layer by oxidizing a surface of the first layer and forming a third layer on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes. The example semiconductor device may include a substrate including a first layer, the first layer including aluminum nitride (AlN), a second layer formed by oxidizing a surface of the first layer and a third layer formed on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes.

    摘要翻译: 半导体器件及其方法。 示例性方法可以包括形成半导体器件,包括在衬底上形成第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面并在第二层上形成第三层来形成第二层 ,第一层,第二层和第三层各自相对于多个晶面之一高度取向。 示例性半导体器件可以包括:衬底,其包括第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面形成的第二层和形成在第二层上的第三层,第一层,第二层和第二层 第三层各自相对于多个晶面之一高度取向。

    Memristor Having a Nanostructure Forming An Active Region
    37.
    发明申请
    Memristor Having a Nanostructure Forming An Active Region 审中-公开
    具有形成活跃区域的纳米结构的忆阻器

    公开(公告)号:US20110227022A1

    公开(公告)日:2011-09-22

    申请号:US13130829

    申请日:2009-01-15

    申请人: Hans S. Cho

    发明人: Hans S. Cho

    IPC分类号: H01L45/00 H01L21/62

    摘要: A memristor having an active region having a first electrode, a second electrode, and a nanostructure connecting the first electrode with the second electrode. The nanostructure includes a generally insulating material configured to have an electrically conductive channel formed in the material. The nanostructure forms the active region and has a length and a thickness, where the length is substantially equivalent to a distance extending from the first electrode to the second electrode along the nanostructure and the thickness is a distance across the nanostructure substantially perpendicular to the length of the nanostructure. The length of the nanostructure is substantially greater than the thickness of the nanostructure.

    摘要翻译: 具有活性区域的忆阻器具有第一电极,第二电极和将第一电极与第二电极连接的纳米结构。 纳米结构包括被配置为具有在材料中形成的导电通道的通常绝缘材料。 纳米结构形成有源区并且具有长度和厚度,其中长度基本上等于沿着纳米结构从第一电极延伸到第二电极的距离,并且厚度是穿过纳米结构的距离,基本上垂直于纳米结构的长度 纳米结构。 纳米结构的长度实质上大于纳米结构的厚度。

    PHOTONIC STRUCTURE
    38.
    发明申请
    PHOTONIC STRUCTURE 有权
    光电结构

    公开(公告)号:US20110006284A1

    公开(公告)日:2011-01-13

    申请号:US12501844

    申请日:2009-07-13

    IPC分类号: H01L29/06 H01L21/306

    摘要: A photonic structure includes a plurality of annealed, substantially smooth-surfaced ellipsoids arranged in a matrix. Additionally, a method of producing a photonic structure is provided. The method includes providing a semiconductor material, providing an etch mask comprising a two-dimensional hole array, and disposing the etch mask on at least one surface of the semiconductor material. The semiconductor material is then etched through the hole array of the etch mask to produce holes in the semiconductor material and thereafter applying a passivation layer to surfaces of the holes. Additionally, the method includes repeating the etching and passivation-layer application to produce a photonic crystal structure that contains ellipsoids within the semiconductor material and annealing the photonic crystal structure to smooth the surfaces of the ellipsoids.

    摘要翻译: 光子结构包括排列成矩阵的多个退火的基本上平滑的表面的椭圆体。 另外,提供了一种制造光子结构的方法。 该方法包括提供半导体材料,提供包括二维孔阵列的蚀刻掩模,并将蚀刻掩模设置在半导体材料的至少一个表面上。 然后通过蚀刻掩模的孔阵列蚀刻半导体材料,以在半导体材料中产生孔,然后将钝化层施加到孔的表面。 此外,该方法包括重复蚀刻和钝化层应用以产生在半导体材料内包含椭圆体的光子晶体结构,并退火光子晶体结构以平滑椭圆体的表面。

    Plasmon-enhanced electromagnetic-radiation-emitting devices and methods for fabricating the same
    39.
    发明授权
    Plasmon-enhanced electromagnetic-radiation-emitting devices and methods for fabricating the same 有权
    等离子体增强型电磁辐射发射装置及其制造方法

    公开(公告)号:US07781853B2

    公开(公告)日:2010-08-24

    申请号:US11881266

    申请日:2007-07-26

    摘要: Various embodiments of the present invention are directed to surface-plasmon-enhanced electromagnetic-radiation-emitting devices and to methods of fabricating these devices. In one embodiment of the present invention, an electromagnetic-radiation-emitting device comprises a multilayer core, a metallic device layer, and a substrate. The multilayer core has an inner layer and an outer layer, wherein the outer layer is configured to surround at least a portion of the inner layer. The metallic device layer is configured to surround at least a portion of the outer layer. The substrate has a bottom conducting layer in electrical communication with the inner layer and a top conducting layer in electrical communication with the metallic device layer such that the exposed portion emits surface-plasmon-enhanced electromagnetic radiation when an appropriate voltage is applied between the bottom conducting layer and the top conducting layer.

    摘要翻译: 本发明的各种实施例涉及表面等离子体增强的电磁辐射发射装置以及制造这些装置的方法。 在本发明的一个实施例中,电磁辐射发射装置包括多层芯,金属器件层和衬底。 多层芯具有内层和外层,其中外层被构造成围绕内层的至少一部分。 金属器件层被配置为围绕外层的至少一部分。 衬底具有与内层电连通的底部导电层和与金属器件层电连通的顶部导电层,使得当在底部导电之间施加适当的电压时,暴露部分发射表面等离子体增强的电磁辐射 层和顶部导电层。

    Semiconductor device including single crystal silicon layer
    40.
    发明授权
    Semiconductor device including single crystal silicon layer 有权
    半导体器件包括单晶硅层

    公开(公告)号:US07772711B2

    公开(公告)日:2010-08-10

    申请号:US11430117

    申请日:2006-05-09

    IPC分类号: H01L27/11

    摘要: A semiconductor device including a substrate, a P-MOS single crystal TFT formed on the substrate, and an N-MOS single crystal TFT formed on the P-MOS single crystal TFT. The source region of the P-MOS single crystal TFT and the source region of the N-MOS single crystal TFT may be connected to each other. The P-MOS single crystal TFT and the N-MOS single crystal TFT may share a common gate. Also, the P-MOS single crystal TFT may include a single crystal silicon layer with a crystal plane of (100) and a crystal direction of . The N-MOS single crystal TFT may include a single crystal silicon layer having the same crystal direction as the single crystal silicon layer of the P-MOS single crystal TFT and having a tensile stress greater than the single crystal silicon layer of the P-MOS single crystal TFT.

    摘要翻译: 包括基板,形成在基板上的P-MOS单晶TFT的半导体器件和形成在P-MOS单晶TFT上的N-MOS单晶TFT。 P-MOS单晶TFT的源极区域和N-MOS单晶TFT的源极区域可以彼此连接。 P-MOS单晶TFT和N-MOS单晶TFT可以共用公共栅极。 此外,P-MOS单晶TFT可以包括具有(100)的晶面并且晶体方向<100的单晶硅层。 N-MOS单晶TFT可以包括与P-MOS单晶TFT的单晶硅层相同的晶体方向的单晶硅层,其拉应力大于P-MOS的单晶硅层 单晶TFT。