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公开(公告)号：US11896830B2
公开(公告)日：2024-02-13
申请号：US17164998
申请日：2021-02-02
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
CPC classification number: A61N1/37223 , A61N1/3754 , A61N1/3758 , A61N1/37518 , H02J7/00034 , H02J50/10 , H02J50/005
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US11872405B2
公开(公告)日：2024-01-16
申请号：US17343467
申请日：2021-06-09
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Andrew J. Thom
IPC: A61N1/37 , A61N1/375 , C03C3/064 , C03C3/068 , C03C3/066 , C03C8/24 , C03C8/04 , H01B3/08 , H01B17/22 , C03C8/02
CPC classification number: A61N1/3754 , C03C3/064 , C03C3/066 , C03C3/068 , C03C8/02 , C03C8/04 , C03C8/24 , H01B3/087 , H01B17/22 , C03C2205/00
Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.
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公开(公告)号：US11872392B2
公开(公告)日：2024-01-16
申请号：US17536360
申请日：2021-11-29
Applicant: Medtronic, Inc.
Inventor： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
IPC: A61N1/05 , H01R13/187 , H01R24/58 , A61N1/375 , B23K26/21 , B23K20/02 , C23C14/10 , C23C14/18 , C23C14/34 , H01R43/02 , B23K101/38 , B23K103/00 , B23K103/16 , H01R107/00
CPC classification number: A61N1/05 , A61N1/3752 , B23K20/026 , B23K26/21 , C23C14/10 , C23C14/18 , C23C14/34 , H01R13/187 , H01R24/58 , H01R43/0221 , A61B2562/227 , B23K2101/38 , B23K2103/172 , B23K2103/52 , B23K2103/54 , H01R2107/00 , H01R2201/12 , Y10T156/10
Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
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公开(公告)号：US11213673B2
公开(公告)日：2022-01-04
申请号：US15363178
申请日：2016-11-29
Applicant: Medtronic, Inc.
Inventor： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
IPC: A61N1/05 , H01R13/187 , H01R24/58 , A61N1/375 , B23K26/21 , B23K20/02 , C23C14/10 , C23C14/18 , C23C14/34 , H01R43/02 , B23K101/38 , B23K103/00 , B23K103/16 , H01R107/00
Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
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公开(公告)号：US20210154484A1
公开(公告)日：2021-05-27
申请号：US17164998
申请日：2021-02-02
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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Patent Agency Ranking
公开(公告)号：US10918874B2
公开(公告)日：2021-02-16
申请号：US16021177
申请日：2018-06-28
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US20200001093A1
公开(公告)日：2020-01-02
申请号：US16021177
申请日：2018-06-28
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US10413747B2
公开(公告)日：2019-09-17
申请号：US14694095
申请日：2015-04-23
Applicant: Medtronic, Inc.
Inventor： Christian S. Nielsen , Kunal J. Paralikar , Brad C. Tischendorf , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Gordon O. Munns
Abstract: An implantable active medical device includes a housing defining a hermetic cavity, a lead connector receptacle extending into the implantable active medical device, and a solid state light source disposed within the hermetic cavity and optically coupled to the lead connector receptacle.
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公开(公告)号：US09138821B2
公开(公告)日：2015-09-22
申请号：US14260401
申请日：2014-04-24
Applicant: Medtronic, Inc.
Inventor： William M. Brosnan , Rajesh V. Iyer , George C. Johnstone , Susan A. Tettemer , Andrew J. Thom
CPC classification number: B23K1/0016 , B23K1/008 , B23K3/0623 , B23K37/0426 , B23K37/0435 , B23K2101/38 , H01G4/35 , H01R4/027 , H01R43/0249 , H01R43/20
Abstract: A lead pin fixture is used to align and hold lead pins in place for brazing lead pins to metal contact pads of a ceramic insulator and brazing a ferrule to the ceramic insulator in a single step.
Abstract translation: 引脚固定装置用于将引脚对准并保持在适当位置，以将引脚焊接到陶瓷绝缘体的金属接触焊盘，并在一个步骤中将套圈钎焊到陶瓷绝缘体上。
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40.发明申请公开(公告)号：US20130230424A1
公开(公告)日：2013-09-05
申请号：US13866359
申请日：2013-04-19
Applicant: MEDTRONIC, INC.
Inventor： Markus W. Reiterer , Brad C. Tischendorf , Andrew J. Thom
IPC: H01B19/00
CPC classification number: H01B19/00 , A61N1/3754 , B22F3/225 , B22F5/10 , B22F7/062 , B22F7/08 , C04B37/021 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/62 , C22C14/00 , C22C19/007 , C22C19/03
Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.
Abstract translation: 提供馈通组件和制造馈通组件的方法。 方法包括使用金属注射成型模制包含钛的套圈，并且将套圈围绕绝缘体的至少一部分定位，所述绝缘体包括氧化铝。 方法还包括使用金属注射成型将套圈围绕绝缘体的至少一部分进行包覆模制，所述套圈包括钛，绝缘体包括氧化铝。 烧结使套圈密实，并在套圈和绝缘体之间提供密封。 绝缘体可以在烧结之前被烧制或未烧结。
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