ENHANCED HEAT TRANSFER IN MRI GRADIENT COILS WITH PHASE-CHANGE MATERIALS
    33.
    发明申请
    ENHANCED HEAT TRANSFER IN MRI GRADIENT COILS WITH PHASE-CHANGE MATERIALS 有权
    具有相变材料的MRI梯度线圈中的增强热传递

    公开(公告)号:US20080143331A1

    公开(公告)日:2008-06-19

    申请号:US11611432

    申请日:2006-12-15

    IPC分类号: G01R33/31

    CPC分类号: G01R33/3856

    摘要: An MRI apparatus includes a MRI gradient coil and an MRI cooling system. The MRI cooling system is thermally connected to the MRI gradient coil and includes a cooling circuit. A chiller is connected to the cooling circuit and configured to pump a coolant through the cooling circuit and extract heat from the coolant. The coolant includes both a carrier fluid and a phase-change material.

    摘要翻译: MRI装置包括MRI梯度线圈和MRI冷却系统。 MRI冷却系统与MRI梯度线圈热连接并包括冷却回路。 冷却器连接到冷却回路并且构造成将冷却剂泵送通过冷却回路并从冷却剂中提取热量。 冷却剂包括载体流体和相变材料。

    Light emitting diode apparatuses with heat pipes for thermal management
    36.
    发明授权
    Light emitting diode apparatuses with heat pipes for thermal management 有权
    具有用于热管理的热管的发光二极管装置

    公开(公告)号:US07095110B2

    公开(公告)日:2006-08-22

    申请号:US10851273

    申请日:2004-05-21

    IPC分类号: H01L23/10

    摘要: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

    摘要翻译: 发光设备(10,110,210,310,410)包括设置在芯片支撑壁(16,116,216)上的一个或多个发光二极管芯片(12,112,212,312,412),其包括印刷电路 (34,134,234,360,362,460,462),与发光二极管芯片连接。 热管(24,124,224,324,424)具有由包括芯片支撑壁和至少一个附加壁(18,20,28)的壁限定的密封体积(22,122,222,322,422) 120,218)。 热管还包括设置在密封体积中的传热流体(26,226,326,426)。

    Thermal management system and method for MRI gradient coil
    37.
    发明申请
    Thermal management system and method for MRI gradient coil 失效
    MRI梯度线圈的热管理系统和方法

    公开(公告)号:US20060066309A1

    公开(公告)日:2006-03-30

    申请号:US10955635

    申请日:2004-09-30

    IPC分类号: G01V3/00

    CPC分类号: G01R33/3856

    摘要: A thermal management system and method for cooling Magnetic Resonance Imaging gradient coils. The system includes least one first header tube positioned adjacent to said gradient coils and configured to transport a coolant fluid; at least one set of cooling tubes connected to said header tube at inlet ends and configured to transport said coolant fluid, wherein said cooling tubes are parallel to each other and at least one second header tube positioned adjacent to said gradient coils, connected to said at least one set of cooling tubes at outlet ends of said at least one set of cooling tubes and configured to transport said coolant fluid.

    摘要翻译: 一种用于冷却磁共振成像梯度线圈的热管理系统和方法。 该系统包括邻近所述梯度线圈定位的至少一个第一集管,并且构造成输送冷却剂流体; 至少一组冷却管在入口端处连接到所述集管,并且构造成输送所述冷却剂流体,其中所述冷却管彼此平行并且与所述梯度线圈相邻定位的至少一个第二集管, 在所述至少一组冷却管的出口端处的至少一组冷却管,并且构造成输送所述冷却剂流体。

    Light emitting diode apparatuses with heat pipes for thermal management
    38.
    发明申请
    Light emitting diode apparatuses with heat pipes for thermal management 有权
    具有用于热管理的热管的发光二极管装置

    公开(公告)号:US20050258438A1

    公开(公告)日:2005-11-24

    申请号:US10851273

    申请日:2004-05-21

    摘要: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

    摘要翻译: 发光设备(10,110,210,310,410)包括设置在芯片支撑壁(16,116,216)上的一个或多个发光二极管芯片(12,112,212,312,412),其包括印刷电路 (34,134,234,360,362,460,462),与发光二极管芯片连接。 热管(24,124,224,324,424)具有由包括芯片支撑壁和至少一个附加壁(18,20,28)的壁限定的密封体积(22,122,222,322,422) 120,218)。 热管还包括设置在密封体积中的传热流体(26,226,326,426)。

    Method and apparatus for improved cooling of a heat sink using a synthetic jet

    公开(公告)号:US10274263B2

    公开(公告)日:2019-04-30

    申请号:US13074700

    申请日:2011-03-29

    IPC分类号: F28F3/02 H01L23/467

    摘要: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.