公开(公告)号：US20060066309A1

公开(公告)日：2006-03-30

申请号：US10955635

申请日：2004-09-30

申请人： Mehmet Arik ,  Bulent Aksel ,  William Gerstler ,  Cherik Bulkes ,  Douglas Kelley ,  Steven Brzozowski

发明人： Mehmet Arik ,  Bulent Aksel ,  William Gerstler ,  Cherik Bulkes ,  Douglas Kelley ,  Steven Brzozowski

IPC分类号： G01V3/00

CPC分类号： G01R33/3856

摘要： A thermal management system and method for cooling Magnetic Resonance Imaging gradient coils. The system includes least one first header tube positioned adjacent to said gradient coils and configured to transport a coolant fluid; at least one set of cooling tubes connected to said header tube at inlet ends and configured to transport said coolant fluid, wherein said cooling tubes are parallel to each other and at least one second header tube positioned adjacent to said gradient coils, connected to said at least one set of cooling tubes at outlet ends of said at least one set of cooling tubes and configured to transport said coolant fluid.

摘要翻译： 一种用于冷却磁共振成像梯度线圈的热管理系统和方法。 该系统包括邻近所述梯度线圈定位的至少一个第一集管，并且构造成输送冷却剂流体; 至少一组冷却管在入口端处连接到所述集管，并且构造成输送所述冷却剂流体，其中所述冷却管彼此平行并且与所述梯度线圈相邻定位的至少一个第二集管， 在所述至少一组冷却管的出口端处的至少一组冷却管，并且构造成输送所述冷却剂流体。

公开(公告)号：US07135863B2

公开(公告)日：2006-11-14

申请号：US10955635

申请日：2004-09-30

申请人： Mehmet Arik ,  Bulent Aksel ,  William Dwight Gerstler ,  Cherik Bulkes ,  Douglas Arthur Kelley ,  Steven Joseph Brzozowski

发明人： Mehmet Arik ,  Bulent Aksel ,  William Dwight Gerstler ,  Cherik Bulkes ,  Douglas Arthur Kelley ,  Steven Joseph Brzozowski

IPC分类号： G01V3/00

CPC分类号： G01R33/3856

摘要： A thermal management system and method for cooling Magnetic Resonance Imaging gradient coils. The system includes least one first header tube positioned adjacent to said gradient coils and configured to transport a coolant fluid; at least one set of cooling tubes connected to said header tube at inlet ends and configured to transport said coolant fluid, wherein said cooling tubes are parallel to each other and at least one second header tube positioned adjacent to said gradient coils, connected to said at least one set of cooling tubes at outlet ends of said at least one set of cooling tubes and configured to transport said coolant fluid.

公开(公告)号：US07077566B2

公开(公告)日：2006-07-18

申请号：US10733141

申请日：2003-12-11

申请人： Veera Palanivelu Rajendran ,  Mehmet Arik ,  Bulent Aksel

发明人： Veera Palanivelu Rajendran ,  Mehmet Arik ,  Bulent Aksel

IPC分类号： G01K11/00 ,  G01J5/00

CPC分类号： G01K11/3206 ,  G01K11/00

摘要： A method for monitoring temperature in at least one location of an electromagnetic coil assembly having at least one electrical winding. The method includes passing a light through a non-magnetic optical fiber inserted into a sheath that is wound with the electrical winding. The sheath is wound and cast with the electromagnetic coil assembly, and the optical fiber is slidably inserted therein. The optical fiber has a core containing at least a first Bragg grating etched therein. The method further includes detecting a wavelength of light reflected from the first Bragg grating and determining a temperature of the electromagnetic coil assembly at a location of the first Bragg grating utilizing the detected wavelength of the light reflected from the first Bragg grating.

摘要翻译： 一种用于监测具有至少一个电绕组的电磁线圈组件的至少一个位置中的温度的方法。 该方法包括使光通过插入到与电绕组缠绕的护套中的非磁性光纤。 护套用电磁线圈组件缠绕并铸造，并且光纤可滑动地插入其中。 光纤具有至少包含蚀刻在其中的第一布拉格光栅的芯。 该方法还包括检测从第一布拉格光栅反射的光的波长，并利用从第一布拉格光栅反射的光的检测波长来确定第一布拉格光栅的位置处的电磁线圈组件的温度。

公开(公告)号：US20050129088A1

公开(公告)日：2005-06-16

申请号：US10733141

申请日：2003-12-11

申请人： Veera Rajendran ,  Mehmet Arik ,  Bulent Aksel

发明人： Veera Rajendran ,  Mehmet Arik ,  Bulent Aksel

IPC分类号： G01J3/12 ,  G01J5/00 ,  G01K11/00 ,  G01K11/32

CPC分类号： G01K11/3206 ,  G01K11/00

摘要： A method for monitoring temperature in at least one location of an electromagnetic coil assembly having at least one electrical winding. The method includes passing a light through a non-magnetic optical fiber inserted into a sheath that is wound with the electrical winding. The sheath is wound and cast with the electromagnetic coil assembly, and the optical fiber is slidably inserted therein. The optical fiber has a core containing at least a first Bragg grating etched therein. The method further includes detecting a wavelength of light reflected from the first Bragg grating and determining a temperature of the electromagnetic coil assembly at a location of the first Bragg grating utilizing the detected wavelength of the light reflected from the first Bragg grating.

摘要翻译： 一种用于监测具有至少一个电绕组的电磁线圈组件的至少一个位置中的温度的方法。 该方法包括使光通过插入到与电绕组缠绕的护套中的非磁性光纤。 护套用电磁线圈组件缠绕并铸造，并且光纤可滑动地插入其中。 光纤具有至少包含蚀刻在其中的第一布拉格光栅的芯。 该方法还包括检测从第一布拉格光栅反射的光的波长，并利用从第一布拉格光栅反射的光的检测波长来确定第一布拉格光栅的位置处的电磁线圈组件的温度。

公开(公告)号：US20050006754A1

公开(公告)日：2005-01-13

申请号：US10614497

申请日：2003-07-07

申请人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

发明人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

IPC分类号： F28F13/18 ,  H01L23/373 ,  H01L23/473 ,  H01L23/485 ,  H01L33/62 ,  H01L33/64 ,  H01L23/10

CPC分类号： F28F13/185 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/473 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

摘要翻译： 半导体器件管芯（10,116）设置在散热支撑结构（30,100）上。 纳米管区域（52,120）包含纳米管（54,126）布置在散热支撑结构（30,100）的表面上或散热支撑结构（30,100）中。 纳米管区域（52,120）被布置成有助于从半导体器件管芯（10,116）到散热支撑结构（30,100）的热传递。 在一个实施例中，半导体器件管芯（10）包括管芯电极（20,22），并且支撑结构（30）包括由至少一些纳米管区域（52）限定的接触焊盘（40,42）。 接触焊盘（40,42）与管芯电极（20,22）电接触和机械接触。 在另一个实施例中，散热支撑结构（100）包括在支撑结构（100）中侧向设置的微通道（120）。 至少一些纳米管区域设置在微通道（100）的内部。

公开(公告)号：US07010930B2

公开(公告)日：2006-03-14

申请号：US10670533

申请日：2003-09-24

申请人： Mehmet Arik ,  Warren Bessler ,  Michael Bowman ,  Charles Byrd ,  William Gerstler ,  Daniel P. Smith ,  Todd Wetzel

发明人： Mehmet Arik ,  Warren Bessler ,  Michael Bowman ,  Charles Byrd ,  William Gerstler ,  Daniel P. Smith ,  Todd Wetzel

IPC分类号： F25D23/12

CPC分类号： H05K7/208 ,  F04D25/06 ,  F25B1/04 ,  F25B31/006 ,  F25B39/02 ,  F25B2341/0014 ,  F25B2500/01 ,  F28F3/04 ,  F28F13/12 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A turbomachinery system for cooling a high power density device includes a turbomachine configured to deliver a high flux cooling medium toward the high power density device, a housing containing a motor, a compressor, or both, of the turbomachine, a heat exchanger in fluid communication with the turbomachine and arranged for being thermally coupled to the high power density device, and a transition duct arranged intermediate the heat exchanger and turbomachine.

摘要翻译： 一种用于冷却高功率密度装置的涡轮机械系统包括涡轮机构，其构造成向高功率密度装置输送高通量冷却介质，包含涡轮机的电动机，压缩机或两者的壳体，流体连通的热交换器 并且布置成与高功率密度装置热耦合，以及布置在热交换器和涡轮机之间的过渡管。

公开(公告)号：US09464802B2

公开(公告)日：2016-10-11

申请号：US14183931

申请日：2014-02-19

申请人： Muhammed Nasir Inan ,  Mehmet Arik

发明人： Muhammed Nasir Inan ,  Mehmet Arik

IPC分类号： F21V29/00 ,  F21V29/83 ,  F21K99/00 ,  F21V23/00 ,  F21V29/503 ,  F21V9/16 ,  F21V29/77 ,  F21Y101/02 ,  F21Y101/00

CPC分类号： F21V29/83 ,  F21K9/232 ,  F21K9/64 ,  F21V9/30 ,  F21V23/006 ,  F21V23/009 ,  F21V29/503 ,  F21V29/77 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10

摘要： A lighting system has a heat sink for removing the heat released by LED chips by means of natural convection and thermal radiation. A center opening formed between air and heat sink fins enables the transfer of heat generated by LEDs, electronic driver circuit and phosphor on said heat sink fins to the flowing air inside and removing from the system, and increases the contact surface of heat sink fins with the air that enables to transfer the heat effectively from heat sink fins to flowing air and also with effective radiative heat transfer. The heat sink has a chimney inlet where air enters into said center opening, on which the PCB and said LED package are positioned, and which interconnects LED package and heat sink, which has an optimized structure and base angle, that maximize the heat removal by natural convection and thermal radiation.

摘要翻译： 照明系统具有用于通过自然对流和热辐射去除由LED芯片释放的热量的散热器。 形成在空气和散热鳍片之间的中心开口使得能够将LED，电子驱动器电路和所述散热片上的荧光体产生的热量传递到内部的流动空气并从系统中移除，并且增加散热鳍片的接触表面 能够有效地将热量从散热片转移到流动的空气中并且还具有有效的辐射热传递的空气。 散热器具有烟道入口，空气进入所述中心开口，PCB和所述LED封装定位在所述中心开口上，并且其互连LED封装和散热器，其具有优化的结构和底角，从而最大限度地减少热量 自然对流和热辐射。

公开(公告)号：US08776871B2

公开(公告)日：2014-07-15

申请号：US12759899

申请日：2010-04-14

申请人： Mehmet Arik ,  William Dwight Gerstler ,  Ri Li ,  Earl Ross Nicewarner ,  Christina Clyde Schroeder ,  Benjamin Jon Vander Ploeg ,  Bryan Patrick Whalen

发明人： Mehmet Arik ,  William Dwight Gerstler ,  Ri Li ,  Earl Ross Nicewarner ,  Christina Clyde Schroeder ,  Benjamin Jon Vander Ploeg ,  Bryan Patrick Whalen

IPC分类号： H01L23/467 ,  F28F7/00

CPC分类号： H05K7/20009 ,  F24F13/02 ,  H01L2924/0002 ,  H05K7/20172 ,  H05K7/20209 ,  H01L2924/00

摘要： A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.

摘要翻译： 提供分布式喷射冷却的底盘。 底盘包括限定体积的一个或多个侧壁，所述体积被配置为基本上围绕定位在体积内的一个或多个发热组件。 底盘还包括至少一个热耦合到一个或多个侧壁中的一个或多个侧壁的翅片阵列，以及至少一个合成射流组件，其包括多孔合成射流或多个单孔合成射流， 相应的翅片阵列之一。 底盘还包括至少一个连接装置，用于将至少一个合成射流组件中的相应一个连接到一个或多个侧壁中的相应一个。

公开(公告)号：US08752775B2

公开(公告)日：2014-06-17

申请号：US12198257

申请日：2008-08-26

申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

IPC分类号： B05B1/08

CPC分类号： F15D1/0095 ,  F04B43/095 ,  H01L23/467 ,  H01L2223/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A synthetic jet includes a first backer structure, one and only one actuator, a wall member coupled to and positioned between the first backer structure and the one and only one actuator to form a cavity, and wherein the wall member has an orifice formed therethrough, and wherein the orifice fluidically couples the cavity to an environment external to the cavity.

摘要翻译： 合成射流包括第一支撑结构，仅一个致动器;壁构件，其联接到第一支撑结构和仅一个致动器之间并且位于第一支撑结构之间并形成空腔，并且其中壁构件具有通过其形成的孔， 并且其中所述孔口将所述空腔流体耦合到所述空腔外部的环境。

公开(公告)号：US20120097377A1

公开(公告)日：2012-04-26

申请号：US12911995

申请日：2010-10-26

申请人： Mehmet Arik ,  William Dwight Gerstler ,  Ri Li ,  Pradeep Chandra Babu Salapakkam ,  Bryan Patrick Whalen

发明人： Mehmet Arik ,  William Dwight Gerstler ,  Ri Li ,  Pradeep Chandra Babu Salapakkam ,  Bryan Patrick Whalen

IPC分类号： F28F3/08 ,  F28F7/00 ,  B21D53/02

CPC分类号： H01L23/467 ,  B23P15/26 ,  B23P2700/10 ,  H01L21/4882 ,  H01L23/4735 ,  H01L2924/0002 ,  H05K7/20172 ,  Y10T29/4935 ,  H01L2924/00

摘要： A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.

摘要翻译： 提供热管理系统。 热管理系统包括至少一个散热器，其包括一个或多个相应的散热片，其中所述一个或多个散热片包括一个或多个相应的空腔。 热管理系统还包括合成射流堆叠，其包括安装在每个相应空腔内的至少一个合成喷射器，其采用至少一个接合结构，以提供合成射流堆叠在翅片内的刚性定位，其中合成射流至少包括 一个孔，喷射流体。