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31.发明申请Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 有权形成具有减小的应力和/或曲率的三维结构的方法公开(公告)号：US20140238865A1
公开(公告)日：2014-08-28
申请号：US14194564
申请日：2014-02-28
申请人： Microfabrica Inc.
发明人： Ananda H. Kumar , Jorge S. Alberron , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译： 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。
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32.发明申请Method for Fabricating Miniature Structures or Devices such as RF and Microwave Components 有权用于制造微型结构或诸如RF和微波组件的设备的方法公开(公告)号：US20140197904A1
公开(公告)日：2014-07-17
申请号：US14194592
申请日：2014-02-28
申请人： Microfabrica Inc.
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
CPC分类号： H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
摘要： Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
摘要翻译： 多层多材料制造方法包括在形成多个层期间沉积至少一种结构材料和至少一种牺牲材料，其中每层的沉积材料被平坦化以设定各层的边界水平， 其中在形成至少一个层期间，沉积至少三种材料，其中在沉积最终材料之前发生的平坦化操作，以将平坦化水平设置在层边界水平之上，并且其中在沉积层上方的最后材料层之后发生平坦化 并且其中在沉积最后的材料之后发生平坦化，由此设置该层的边界水平。 一些形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平面化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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公开(公告)号：US20140197145A1
公开(公告)日：2014-07-17
申请号：US14156437
申请日：2014-01-15
申请人： Microfabrica Inc.
发明人： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , G01R1/06738 , G01R1/06744 , G01R3/00
摘要： Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
摘要翻译： 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。
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公开(公告)号：US20240094258A1
公开(公告)日：2024-03-21
申请号：US17968638
申请日：2022-10-18
申请人： Microfabrica Inc.
CPC分类号： G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
摘要： Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20230243870A1
公开(公告)日：2023-08-03
申请号：US18295712
申请日：2023-04-04
申请人： Microfabrica Inc.
CPC分类号： G01R1/06722 , G01R1/07314 , G01R1/06733
摘要： Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in the lower array plate and an upper retention feature undergoing lateral displacement relative to the upper plate probe hole such that it can no longer longitudinally pass through the extension of the upper plate probe hole in the upper array plate.
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公开(公告)号：US10788512B2
公开(公告)日：2020-09-29
申请号：US16373500
申请日：2019-04-02
申请人： Microfabrica Inc.
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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公开(公告)号：US20200227805A1
公开(公告)日：2020-07-16
申请号：US16711116
申请日：2019-12-11
申请人： Microfabrica Inc.
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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38.发明授权公开(公告)号：US10676836B2
公开(公告)日：2020-06-09
申请号：US16118267
申请日：2018-08-30
申请人： Microfabrica Inc.
发明人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
摘要： Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
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公开(公告)号：US10416192B2
公开(公告)日：2019-09-17
申请号：US14927350
申请日：2015-10-29
申请人： Microfabrica Inc.
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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公开(公告)号：US20190227099A1
公开(公告)日：2019-07-25
申请号：US16373500
申请日：2019-04-02
申请人： Microfabrica Inc.
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/067
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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