Power amplification module
    32.
    发明授权

    公开(公告)号:US10985712B2

    公开(公告)日:2021-04-20

    申请号:US16351916

    申请日:2019-03-13

    Abstract: Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.

    Power amplification circuit
    33.
    发明授权

    公开(公告)号:US10027291B2

    公开(公告)日:2018-07-17

    申请号:US15430890

    申请日:2017-02-13

    Inventor: Satoshi Goto

    Abstract: A power amplification circuit that includes: a capacitor element in which a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a third metal layer are sequentially stacked, the capacitor element including a first capacitor in which the first metal layer serves as one electrode thereof and the second metal layer serves as another electrode thereof, and a second capacitor in which the second metal layer serves as one electrode thereof and the third metal layer serves as another electrode thereof; and a transistor that amplifies a radio-frequency signal. The radio-frequency signal is supplied to the one electrode of the first capacitor. The other electrode of the first capacitor and the one electrode of the second capacitor are connected to a base of the transistor, and the other electrode of the second capacitor is connected to the emitter of the transistor.

    Semiconductor device
    34.
    发明授权

    公开(公告)号:US12243836B2

    公开(公告)日:2025-03-04

    申请号:US17548679

    申请日:2021-12-13

    Abstract: In a semiconductor device, a first member having a first surface includes a plurality of circuit blocks disposed in an inner region of the first surface when the first surface is viewed in plan. The second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes a plurality of first transistors that are connected in parallel to each other and form a first amplifier circuit. A conductive protrusion protrudes from the second member on an opposite side to the first member. The first transistors are disposed in a region not overlapping any of the circuit blocks in the first member in a plan view.

    Power amplification module
    35.
    发明授权

    公开(公告)号:US11569787B2

    公开(公告)日:2023-01-31

    申请号:US17211072

    申请日:2021-03-24

    Abstract: Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.

    Radio frequency module and communication device

    公开(公告)号:US11489547B2

    公开(公告)日:2022-11-01

    申请号:US17066492

    申请日:2020-10-09

    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.

    Power amplifier circuit
    37.
    发明授权

    公开(公告)号:US11190154B2

    公开(公告)日:2021-11-30

    申请号:US16898907

    申请日:2020-06-11

    Abstract: A power amplifier circuit includes a power splitter, a first amplifier configured to output a first amplified signal from a first output terminal, and a second amplifier configured to output a second amplified signal from a second output terminal. The power amplifier circuit further includes a first termination circuit connected between the first output terminal and the second output terminal, a first transmission line, a second transmission line, a second termination circuit connected between another end of the first transmission line and another end of the second transmission line, and a power combiner.

    Power amplifier module
    38.
    发明授权

    公开(公告)号:US10666201B2

    公开(公告)日:2020-05-26

    申请号:US16154861

    申请日:2018-10-09

    Abstract: A power amplifier module includes a first power amplifier circuit configured to output a first amplified signal obtained by amplifying an input signal; a second power amplifier circuit configured to output a second amplified signal obtained by amplifying the first amplified signal; and a matching network connected between the first power amplifier circuit and the second power amplifier circuit. The matching network includes a first capacitor connected in series between the first power amplifier circuit and the second power amplifier circuit, a second capacitor connected in series between the first capacitor and the second power amplifier circuit, a first inductor connected between a point between the first capacitor and the second capacitor and a ground, and a second inductor connected in series between the first power amplifier circuit and the first capacitor.

    POWER AMPLIFICATION MODULE
    40.
    发明申请
    POWER AMPLIFICATION MODULE 有权
    功率放大模块

    公开(公告)号:US20160315594A1

    公开(公告)日:2016-10-27

    申请号:US15092362

    申请日:2016-04-06

    Abstract: Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.

    Abstract translation: 提供了一种功率放大模块,其包括:第一晶体管,输入到其基极的第一信号; 第二晶体管,第一信号被输入到其基极,其集电极连接到第一晶体管的集电极; 第一电阻器,第一偏置电流被提供给其一端,另一端连接到第一晶体管的基极; 第二电阻器,其一端连接到第一电阻器的一端,另一端连接到第二晶体管的基极; 和第三电阻器,第二偏置电流被提供给其一端,另一端连接到第二晶体管的基极。

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