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Patent Agency Ranking
公开(公告)号：US20180341152A1
公开(公告)日：2018-11-29
申请号：US15986738
申请日：2018-05-22
Applicant: NICHIA CORPORATION
Inventor： Ryohei YAMASHITA , Shimpei SASAOKA , Toshiyuki HASHIMOTO
IPC: G02F1/1335 , H01L25/075 , H01L33/50 , H01L33/60 , H01L33/62
CPC classification number: G02F1/133611 , G02F1/133603 , G02F1/133605 , G02F1/133606 , G02F2001/133607 , H01L25/0753 , H01L33/502 , H01L33/60 , H01L33/62
Abstract: A light-emitting device includes: a base having an upper surface; a plurality of light sources located on the upper surface of the base; a first lenticular lens sheet disposed to face the base with the light sources between the first lenticular lens sheet and the base, the first lenticular lens sheet including a first plurality of grooves; a half mirror located on an upper surface side of the first lenticular lens sheet; and a second lenticular lens sheet disposed on an upper surface side of the half mirror, wherein the second lenticular lens sheet includes a second plurality of grooves extending in a direction that intersects a direction in which the first plurality of grooves of the first lenticular lens sheet extend.
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公开(公告)号：US20180315914A1
公开(公告)日：2018-11-01
申请号：US16028331
申请日：2018-07-05
Applicant: NICHIA CORPORATION
Inventor： Shimpei SASAOKA , Takuya NAKABAYASHI
CPC classification number: H01L33/62 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/18301 , H05K1/0313 , H01L2924/00014
Abstract: A method of manufacturing a light emitting device includes providing molded packages each of which has a recess. A light emitting component is mounted on a bottom surface of the recess. At least one sealing member covering the light emitting component is formed within the recess. A lead frame including a first lead and a second lead is provided, the first lead having a first groove on an upper surface of the first lead the second lead having a second groove on an upper surface of the second lead. Spaces are formed, each of the spaces being surrounded with an upper metal mold, a lower metal mold, and the lead frame by cooperatively holding the lead frame with the upper metal mold and the lower metal mold. The spaces and the first groove and the second groove are filled with a resin.
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公开(公告)号：US20170345986A1
公开(公告)日：2017-11-30
申请号：US15610524
申请日：2017-05-31
Applicant: NICHIA CORPORATION
Inventor： Shimpei SASAOKA
CPC classification number: H01L33/62 , H01L25/167 , H01L33/483 , H01L33/56 , H01L33/647 , H01L2224/16245 , H01L2924/181 , H01L2924/00012
Abstract: A light-emitting device includes: a resin package including: a first lead, a second lead, and a resin portion, wherein each of the first lead and the second lead has a top surface and a bottom surface and comprises a metal layer formed at least at the top surfaces; a light-emitting element electrically connected to the first lead and the second lead; and a protection element located on a first surface portion of the top surface of the first lead. The first lead includes: a first lateral portion and at least one second lateral portion. A second surface portion is formed at the top surface of the first lead between the protection element and at least one of the first lateral portion and the at least one second lateral portion, the second surface portion being embedded in the resin portion and extending in a height direction.
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公开(公告)号：US20160056357A1
公开(公告)日：2016-02-25
申请号：US14928550
申请日：2015-10-30
Applicant: NICHIA CORPORATION
Inventor： Hirofumi ICHIKAWA , Masaki HAYASHI , Shimpei SASAOKA , Tomohide MIKI
CPC classification number: H01L33/486 , B29C45/0055 , B29C45/14655 , B29C2793/009 , H01L24/97 , H01L33/0095 , H01L33/504 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
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公开(公告)号：US20130187188A1
公开(公告)日：2013-07-25
申请号：US13744586
申请日：2013-01-18
Applicant: NICHIA CORPORATION
Inventor： Shimpei SASAOKA , Takuya NAKABAYASHI
CPC classification number: H01L33/62 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/18301 , H05K1/0313 , H01L2924/00014
Abstract: A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a light emitting component. The lead is partially exposed from a bottom surface of the recess portion of the molded resin to be electrically connected to the light emitting component and extends below a side wall of the recess portion. The lead has a groove formed on a surface of the lead at least partially along the side wall. The groove has an inside upper edge and an outside upper edge and is filled with the molded resin so that the inside upper edge is exposed from the bottom surface of the recess portion and the outside upper edge is embedded within the molded resin.
Abstract translation: 模制包装包括模制树脂和铅。 模制树脂具有设置在模制树脂的上表面上以容纳发光部件的凹部。 引线部分地从模塑树脂的凹部的底表面暴露以与发光部件电连接并且在凹部的侧壁下方延伸。 引线具有至少部分地沿着侧壁形成在引线的表面上的凹槽。 该槽具有内上边缘和外上边缘，并且填充有模制树脂，使得内侧上边缘从凹部的底面露出，外侧上边缘嵌入模制树脂内。
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