公开(公告)号：US20200058629A1

公开(公告)日：2020-02-20

申请号：US16347168

申请日：2017-11-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander F. Pfeuffer ,  Dominik Scholz

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/38 ,  H01L33/06 ,  H01L33/42 ,  H01L33/60

Abstract: A display device is disclosed. In an embodiment a display device having a plurality of pixels separately operable from each other includes a semiconductor layer sequence including a first semiconductor layer, an active layer and a second semiconductor layer, a first contact structure contacting the first semiconductor layer and a second contact structure contacting the second semiconductor layer and at least one separating region extending through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, wherein the semiconductor layer sequence and the first contact structure have at least one first recess laterally adjacent with respect to a respective pixel, the first recess extending through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, and wherein the second contact structure includes second contacts extending through the at least one first recess.

公开(公告)号：US20190252577A1

公开(公告)日：2019-08-15

申请号：US16316973

申请日：2017-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Scholz ,  Alexander F. Pfeuffer

IPC: H01L33/08 ,  H01L27/15 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L33/08 ,  H01L27/156 ,  H01L33/382 ,  H01L33/387 ,  H01L33/62

Abstract: An optoelectronic semiconductor chip and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment, a chip includes a semiconductor body comprising a plurality of emission regions, first and second contact points, a rewiring structure and first and second connection points, wherein each emission region is contacted via the first and second contact points and configured to be operated separately from one another, wherein the rewiring structure electrically conductively connects each first contact point to an associated first connection point, wherein the rewiring structure electrically conductively connects every second contact point to an associated second connection point, wherein at least one of the connection points does not overlap with a contact point which is electrically conductively connected to this connection point in a vertical direction, and wherein each first connection point is disposed laterally directly adjacent to a further first connection point.

公开(公告)号：US10361249B2

公开(公告)日：2019-07-23

申请号：US15578239

申请日：2016-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander F. Pfeuffer ,  Dominik Scholz

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/62 ,  H01L33/24

Abstract: A display device having a plurality of pixels is disclosed. In an embodiment the display includes a semiconductor layer sequence and a first contact structure for contacting a first semiconductor layer and a second contact structure for contacting a second semiconductor layer, wherein the first contact structure has first contacts configured to be operated separately from one another, each first contact extending laterally and uninterrupted along the first semiconductor layer within an associated pixel and each first contact delimits the pixel in a lateral manner with its contour, wherein the semiconductor layer sequence and the first contact structure have at least one recess laterally bordering a respective pixel, which recess extends through the first contact structure, the first semiconductor layer and the active layer into the second semiconductor layer, and wherein the second contact structure has second contacts extending through the at least one recess.

公开(公告)号：US20180358509A1

公开(公告)日：2018-12-13

申请号：US15779251

申请日：2016-11-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sophia Huppmann ,  Simeon Katz ,  Marcus Zenger ,  Dominik Scholz

IPC: H01L33/00 ,  H01L33/22 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L33/0079 ,  H01L33/22 ,  H01L33/382 ,  H01L33/62 ,  H01L2933/0033

Abstract: A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.

公开(公告)号：US20180331251A1

公开(公告)日：2018-11-15

申请号：US15774960

申请日：2016-11-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Scholz ,  Alexander F. Pfeuffer

IPC: H01L33/00 ,  H01L33/42 ,  H01L33/40

CPC classification number: H01L33/0075 ,  H01L27/153 ,  H01L33/382 ,  H01L33/405 ,  H01L33/42 ,  H01L2933/0016

Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, a component includes a semiconductor layer sequence including a first main side, a first layer, an active layer, a second layer and a second main side, a first contact element arranged on the second main side filling a recess in the semiconductor layer sequence, wherein the recess extends from the second main side through the second layer and the active layer and opens out into the first layer and a second contact element arranged on the second main side, the second contact element being arranged laterally next to the recess in a plan view of the second main side, wherein the first contact element comprises a first transparent intermediate layer, a metallic first mirror layer and a metallic injection element.

公开(公告)号：US20180254378A1

公开(公告)日：2018-09-06

申请号：US15759972

申请日：2016-10-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Scholz

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/32 ,  H01L31/18 ,  H01L31/0304 ,  H01L31/0203

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L31/0203 ,  H01L31/03044 ,  H01L31/035209 ,  H01L31/1852 ,  H01L31/1856 ,  H01L31/186 ,  H01L31/1892 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/32 ,  H01L33/54 ,  H01L33/62 ,  H01L2221/68327 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method for fabricating an optoelectronic semiconductor component is disclosed. A semiconductor chip is produced by singularizing a wafer. The semiconductor chip comprises a substrate and a semiconductor layer sequence with an active layer applied to a main side of the substrate. The semiconductor layer sequence has an active region for emission or absorption of radiation and a sacrificial region arranged next to the active region. The sacrificial region in the finished semiconductor component is not intended to emit or absorb radiation. A trench, introduced into the semiconductor layer sequence, penetrates the active layer and separates the active region from the sacrificial region. The semiconductor chip with the semiconductor layer sequence is applied on a carrier. The substrate is detached from the active region of the semiconductor layer sequence. In the sacrificial region, the semiconductor layer sequence remains mechanically connected to the substrate.

公开(公告)号：US09847467B2

公开(公告)日：2017-12-19

申请号：US15030652

申请日：2014-10-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Scholz ,  Norwin von Malm ,  Stefan Illek

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side of the auxiliary carrier; providing a carrier structure having a top side and a rear side situated opposite the top side, wherein an insulation layer is arranged at the rear side of the carrier structure; connecting the sacrificial layer to the insulation layer by an electrically conductive connection layer; creating at least one blind hole extending from the top side of the carrier structure as far as the insulation layer; opening the insulation layer in a region of the at least one blind hole; arranging an electrically conductive material in the at least one blind hole; detaching the auxiliary carrier by separating the sacrificial layer; and patterning the electrically conductive connection layer.

公开(公告)号：US20160247990A1

公开(公告)日：2016-08-25

申请号：US15030652

申请日：2014-10-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Dominik Scholz ,  Norwin von Malm ,  Stefan Illek

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side of the auxiliary carrier; providing a carrier structure having a top side and a rear side situated opposite the top side, wherein an insulation layer is arranged at the rear side of the carrier structure; connecting the sacrificial layer to the insulation layer by an electrically conductive connection layer; creating at least one blind hole extending from the top side of the carrier structure as far as the insulation layer; opening the insulation layer in a region of the at least one blind hole; arranging an electrically conductive material in the at least one blind hole; detaching the auxiliary carrier by separating the sacrificial layer; and patterning the electrically conductive connection layer.

Abstract translation: 一种制造用于光电子部件的接触元件的方法包括提供辅助载体，所述辅助载体具有布置在所述辅助载体的顶侧上的牺牲层; 提供具有与顶侧相对的顶侧和后侧的载体结构，其中绝缘层布置在载体结构的后侧; 通过导电连接层将牺牲层连接到绝缘层; 形成至少一个从所述载体结构的顶侧延伸至所述绝缘层的盲孔; 在所述至少一个盲孔的区域中打开所述绝缘层; 在所述至少一个盲孔中布置导电材料; 通过分离牺牲层来分离辅助载体; 并图案化导电连接层。