公开(公告)号：US07886267B2

公开(公告)日：2011-02-08

申请号：US11528497

申请日：2006-09-27

申请人： David Pratt ,  David Stones ,  Adam Friedman ,  Clinton De Young ,  Stephen Gibbon ,  Edwin Ho ,  Michael E. Sainsbury

发明人： David Pratt ,  David Stones ,  Adam Friedman ,  Clinton De Young ,  Stephen Gibbon ,  Edwin Ho ,  Michael E. Sainsbury

IPC分类号： G06F9/45

CPC分类号： G06F9/454

摘要： Disclosed herein are systems and methods providing for autonomous extraction of original natural language strings from source code and insertion of translated strings therein. Some of the examples described herein additionally utilize a database suitable for containing translations of user -viewable material and for accessing that material from developer project sandboxes. Individual developer projects may provide for the extraction of natural-language strings from source code to a shared translations database. Detailed information on various example embodiments of the inventions are provided in the Detailed Description below, and the inventions are defined by the appended claims.

摘要翻译： 本文公开了提供从源代码自动提取原始自然语言字符串并将翻译的字符串插入其中的系统和方法。 本文所描述的一些示例另外使用适合于包含用户可浏览材料的翻译并且用于从开发者项目沙箱访问该材料的数据库。 单独的开发者项目可以提供从源代码到共享翻译数据库的自然语言字符串的提取。 在下面的详细描述中提供了关于本发明的各种示例性实施例的详细信息，并且本发明由所附权利要求限定。

公开(公告)号：US07749349B2

公开(公告)日：2010-07-06

申请号：US11374750

申请日：2006-03-14

申请人： David Pratt ,  David R. Hembree

发明人： David Pratt ,  David R. Hembree

IPC分类号： B29C65/48 ,  B29C65/56 ,  B32B37/02 ,  B32B37/14 ,  H01L21/301 ,  H01L21/328 ,  B29C65/02 ,  B32B37/10 ,  B32B38/18 ,  C09J5/02

CPC分类号： H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

摘要： Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

摘要翻译： 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。

公开(公告)号：US20080237849A1

公开(公告)日：2008-10-02

申请号：US11727553

申请日：2007-03-27

申请人： David Pratt

发明人： David Pratt

IPC分类号： H01L23/485 ,  H01L21/3205

CPC分类号： H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

摘要翻译： 制造半导体管芯的方法包括在从衬底的第一侧延伸到第二侧的导电柱体周围形成沟槽，以暴露螺柱的一部分，然后在沟槽内形成导电层并与螺柱电接触 。

公开(公告)号：US20080057620A1

公开(公告)日：2008-03-06

申请号：US11513661

申请日：2006-08-30

申请人： David Pratt

发明人： David Pratt

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L21/486 ,  H01L21/76868 ,  H01L21/76898 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014

摘要： Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a preformed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.

摘要翻译： 公开了用于微特征工件的再分布层，以及相关系统和方法。 用于处理微特征工件系统的一种方法包括将预先形成的再分布层定位为靠近并与具有可操作的微特征装置的微特征工件间隔开的单元。 该方法还可以包括将再分布层附着到微特征工件并将再分布层电耦合到可操作的微特征装置。

公开(公告)号：US20070241078A1

公开(公告)日：2007-10-18

申请号：US11374750

申请日：2006-03-14

申请人： David Pratt ,  David Hembree

发明人： David Pratt ,  David Hembree

IPC分类号： H01B13/00 ,  B44C1/22

CPC分类号： H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

摘要： Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

摘要翻译： 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。

公开(公告)号：US20050128020A1

公开(公告)日：2005-06-16

申请号：US11045212

申请日：2005-01-27

申请人： Agoston Agoston ,  John Ebner ,  Steven Pepper ,  David Pratt

发明人： Agoston Agoston ,  John Ebner ,  Steven Pepper ,  David Pratt

IPC分类号： H03K17/74 ,  G01R1/24 ,  G01R19/00 ,  G01R19/25 ,  G01R31/28 ,  H01P3/00 ,  H01P5/08 ,  H03K17/00 ,  H04L25/00 ,  H01P1/00

CPC分类号： G01R1/24 ,  G01R19/0053 ,  G01R19/2509 ,  G01R31/2822 ,  H01P5/085 ,  H04L25/00

摘要： An ultrafast sampling system includes an interposer and a sampler that include series of Schottky diodes configured with a non-parallel waveguide to form shocklines or nonlinear transmission line (NLTLs) that produce a differential strobe pulse. The shocklines are defined by non-parallel conductors that are configured as, for example, triangular, dentate, arcuate, or other shapes, or as conductors that have edges that are triangular, dentate, arcuate, or the like. The conductors are defined with respect to a substrate, and are airbridged so that at least some portions of the conductors are displaced from the substrate to reduce waveguide capacitance. Electrical connection to the sampler is made with airline having a inner conductor that is deformable to contact an input pad defined on the sampler.