公开(公告)号：US20070241078A1

公开(公告)日：2007-10-18

申请号：US11374750

申请日：2006-03-14

Applicant: David Pratt ,  David Hembree

Inventor： David Pratt ,  David Hembree

IPC: H01B13/00 ,  B44C1/22

CPC classification number: H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract translation: 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。

公开(公告)号：US08674522B1

公开(公告)日：2014-03-18

申请号：US13649125

申请日：2012-10-11

Applicant: David Pratt ,  Richard Housley

Inventor： David Pratt ,  Richard Housley

IPC: H01L47/00

CPC classification number: H01L21/0337 ,  H01L21/32139 ,  H01L27/10885 ,  H01L27/10888 ,  H01L27/10891

Abstract: The present invention provides a castle-like shaped protect or a periphery protect or a DC chop mask for forming staggered data line patterns in semiconductor devices so as to shift the adjacent data lines from one another so as to print contacts with larger areas at one end of each data line.

Abstract translation: 本发明提供一种城堡状保护或周边保护或DC斩波掩模，用于在半导体器件中形成交错的数据线图案，以便相邻的数据线彼此移动，以便在一端打印与较大区域的触点 的每条数据线。

公开(公告)号：US20130210213A1

公开(公告)日：2013-08-15

申请号：US13372515

申请日：2012-02-14

Applicant: Vinay Nair ,  David Pratt ,  Christopher Hawk ,  Richard Housley

Inventor： Vinay Nair ,  David Pratt ,  Christopher Hawk ,  Richard Housley

IPC: H01L21/311

CPC classification number: G03F7/70633

Abstract: A method for forming a self-aligned overlay mark is disclosed. First, a first region, a second region and a main feature which is disposed between the first region and the second region all disposed on the substrate are provided. The first region defines a first edge and the second region defines a second edge. Second, a cut mask layer is formed to respectively cover the first region and the second region to expose the main feature. Next, the cut mask layer is determined if it is self-aligned with the second edge or the first edge, and creates a self-aligned overlay mark. Later, a main feature etching step is carried out to transfer the main feature into the substrate when the cut mask layer is determined to be self-aligned with the second edge or the first edge.

Abstract translation: 公开了一种形成自对准覆盖标记的方法。 首先，设置设置在基板上的第一区域和第二区域之间的第一区域，第二区域和主要特征。 第一区域限定第一边缘，第二区域限定第二边缘。 第二，形成切割掩模层以分别覆盖第一区域和第二区域以暴露主要特征。 接下来，确定切割掩模层是否与第二边缘或第一边缘自对准，并且产生自对准覆盖标记。 然后，当切割掩模层被确定为与第二边缘或第一边缘自对准时，执行主要特征蚀刻步骤以将主要特征传递到基底中。

公开(公告)号：US07951709B2

公开(公告)日：2011-05-31

申请号：US12879465

申请日：2010-09-10

Applicant: David Pratt

Inventor： David Pratt

IPC: H01L21/44

CPC classification number: H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

Abstract translation: 制造半导体管芯的方法包括在从衬底的第一侧延伸到第二侧的导电柱体周围形成沟槽，以暴露螺柱的一部分，然后在沟槽内形成导电层并与螺柱电接触 。

公开(公告)号：US20080234448A1

公开(公告)日：2008-09-25

申请号：US11795564

申请日：2006-01-06

Applicant: David Pratt

Inventor： David Pratt

IPC: C08F2/01 ,  B01J19/00

CPC classification number: C08F6/00 ,  B01J2219/00286 ,  B01J2219/00414 ,  B01J2219/00423 ,  B01J2219/00691 ,  B01J2219/00707 ,  B01J2219/00736 ,  C08F6/28 ,  C08F210/16 ,  G01N1/38 ,  C08F210/14

Abstract: The present invention relates to a recovery and washing process for polymer materials, in particular to an automated process for recovery and washing of a polymer sample from a high throughput reaction vessel, said process comprising: i) rinsing a polymer sample from a high throughput reaction vessel into a filtration vessel using a rinse liquid comprising a C5 to C8 paraffinic hydrocarbon, and providing in said filtration vessel a mixture comprising the polymer sample, rinse liquid and an oxygenate, ii) removing the rinse liquid and oxygenate from the polymer sample in said filtration vessel by filtration, and iii) subsequently washing said polymer sample in said filtration vessel to remove any residual rinse liquid comprising C5 to C8 paraffinic hydrocarbon.

Abstract translation: 本发明涉及一种用于聚合物材料的回收和洗涤方法，特别涉及用于从高通量反应容器中回收和洗涤聚合物样品的自动化方法，所述方法包括：i）从高通量反应中漂洗聚合物样品 使用包含C5至C8链烷烃的冲洗液进入过滤容器，并在所述过滤容器中提供包含聚合物样品，漂洗液体和含氧化合物的混合物，ii）从所述聚合物样品中除去所述漂洗液体和含氧化合物 过滤容器，和iii）随后在所述过滤容器中洗涤所述聚合物样品以除去包含C5至C8链烷烃的任何残余冲洗液。

公开(公告)号：US20060073820A1

公开(公告)日：2006-04-06

申请号：US10538794

申请日：2003-10-10

Applicant: Ronald Craswell ,  David Pratt ,  Paul Klassen

Inventor： Ronald Craswell ,  David Pratt ,  Paul Klassen

IPC: H04M3/00

CPC classification number: H04M3/42178 ,  G06F8/65 ,  H04M1/72525 ,  H04M3/42144 ,  H04W8/22 ,  H04W8/245

Abstract: A method and apparatus are provided to in one aspect update data on a wireless mobile device. Available updates may include both mandatory and discretionary updates, where the mandatory updates are always installed on the wireless mobile device. In another aspect, a method and apparatus for of remotely instructing a wireless mobile device to perform a service is provided. The wireless mobile device receives a ping message that instructs it to retrieve further instruction for performing services actions on the wireless mobile device.

Abstract translation: 在一个方面中提供了一种在无线移动设备上更新数据的方法和装置。 可用的更新可能包括强制性和酌情更新，其中必须更新始终安装在无线移动设备上。 另一方面，提供了一种用于远程指示无线移动设备执行服务的方法和装置。 无线移动设备接收ping消息，该ping消息指示其检索用于在无线移动设备上执行服务动作的进一步指令。

公开(公告)号：US20050099030A1

公开(公告)日：2005-05-12

申请号：US10905856

申请日：2005-01-24

Applicant: David Pratt

Inventor： David Pratt

IPC: G01N1/12 ,  G01N33/18 ,  E21B27/00

CPC classification number: G01N1/12 ,  G01N33/18

Abstract: An upper imperforate cap closes the uppermost end of a bailer and a lower imperforate cap closes the lowermost end of the bailer. In a preferred embodiment, screwthreads are formed in the uppermost and lowermost ends of the bailer and complemental screwthreads are formed in the upper and lower caps. By capping the opposite ends of a bailer, the bailer serves as its own container when the sample contained within it is shipped to a laboratory. This eliminates VOC devices, nozzles, and the concomitant contamination that may result from emptying a bailer in the field.

Abstract translation: 上无孔帽关闭吊坠的最上端，下无孔帽关闭吊坠的最下端。 在优选的实施例中，螺纹形成在吊钩的最上端和最下端，并且互补螺纹形成在上盖和下盖中。 通过封顶侍者的相对端，当其中包含的样品运送到实验室时，该侍酒师作为其自己的容器。 这样可以消除VOC设备，喷嘴以及在现场排空侍者造​​成的伴随污染。

公开(公告)号：US06399532B1

公开(公告)日：2002-06-04

申请号：US09477677

申请日：2000-01-05

Applicant: Birgit Angelika Dorer ,  David Pratt ,  Christopher Sharp

Inventor： Birgit Angelika Dorer ,  David Pratt ,  Christopher Sharp

IPC: B01J3100

CPC classification number: C08F10/00 ,  C08F4/61908 ,  C08F4/61925 ,  C08F110/02 ,  C08F4/61912

Abstract: Catalyst composition for use in the polymerization of olefins comprise neutral metal complexes together with activators comprising non-aromatic boron compounds. Suitable activators are triisobutylboron together with trialkylaluminium compounds. Preferred complexes are metallocenes. The use of such activating systems obviates the need for expensive aluminoxanes or aromatic fluorine containing compounds.

Abstract translation: 用于烯烃聚合的催化剂组合物包括中性金属络合物以及包含非芳族硼化合物的活化剂。 合适的活化剂是三异丁基硼与三烷基铝化合物。 优选的络合物是金属茂。 使用这种激活体系避免了昂贵的铝氧烷或含芳族氟化合物的需要。

公开(公告)号：US09230859B2

公开(公告)日：2016-01-05

申请号：US13236372

申请日：2011-09-19

Applicant: David Pratt

Inventor： David Pratt

IPC: H01L21/44 ,  H01L21/768 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/76868 ,  H01L21/76898 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014

Abstract: Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.

Abstract translation: 公开了用于微特征工件的再分布层，以及相关系统和方法。 用于处理微特征工件系统的一种方法包括将预先形成的再分配层定位为与具有可操作的微特征装置的微特征工件相邻并间隔开的单元。 该方法还可以包括将再分布层附着到微特征工件并将再分布层电耦合到可操作的微特征装置。

公开(公告)号：US08779605B2

公开(公告)日：2014-07-15

申请号：US13605621

申请日：2012-09-06

Applicant: David Pratt

Inventor： David Pratt

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

Abstract translation: 制造半导体管芯的方法包括在从衬底的第一侧延伸到第二侧的导电柱体周围形成沟槽，以暴露螺柱的一部分，然后在沟槽内形成导电层并与螺柱电接触 。