公开(公告)号：US20230081977A1

公开(公告)日：2023-03-16

申请号：US17932780

申请日：2022-09-16

Applicant: Raytheon Company

Inventor： Andrew J. Pitts ,  James E. Benedict

IPC: H01M10/659 ,  H01M10/617 ,  H01M10/653

Abstract: An apparatus includes multiple thermal actuator switches configured to control a transfer of thermal energy. The thermal actuator switches are arranged in a stacked configuration. Each switch includes first and second plates and a piston movable between the plates. Each switch also includes a phase change material configured to (i) expand to move a surface of the piston into a first position and (ii) contract to allow the surface of the piston to move into a second position. The surface of the piston thermally contacts the first plate and increases thermal energy transfer between the plates when in one of the first and second positions. The surface of the piston is spaced apart from the first plate and decreases thermal energy transfer between the plates when in another of the first and second positions. Different ones of the switches include different phase change materials that expand or contract at different temperatures.

公开(公告)号：US11581652B2

公开(公告)日：2023-02-14

申请号：US17578034

申请日：2022-01-18

Applicant: RAYTHEON COMPANY

Inventor： Peter J. Adams ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict

IPC: H01Q9/27 ,  H05K1/02 ,  H05K3/42 ,  H05K3/40 ,  H01Q1/38

Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

公开(公告)号：US20210368629A1

公开(公告)日：2021-11-25

申请号：US17395977

申请日：2021-08-06

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US20210305187A1

公开(公告)日：2021-09-30

申请号：US16836470

申请日：2020-03-31

Applicant: RAYTHEON COMPANY

Inventor： James E. Benedict ,  Paul A. Danello ,  Mikhail Pevzner ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H01L23/00

Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.

公开(公告)号：US11121474B2

公开(公告)日：2021-09-14

申请号：US16180936

申请日：2018-11-05

Applicant: RAYTHEON COMPANY

Inventor： John P. Haven ,  Thomas V. Sikina ,  Peter J. Adams ,  James E. Benedict

IPC: H01Q1/24 ,  H01Q21/00 ,  H01P1/04 ,  H01Q13/10 ,  H01Q13/18 ,  H05K1/02 ,  H05K3/40 ,  H01P5/02 ,  H01Q1/52 ,  H01Q17/00 ,  H01Q1/42 ,  H01Q1/44 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.

公开(公告)号：US11089687B2

公开(公告)日：2021-08-10

申请号：US16287260

申请日：2019-02-27

Applicant: RAYTHEON COMPANY

Inventor： Jonathan E. Nufio-Molina ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K1/02 ,  H05K1/16 ,  H01P5/16 ,  H01C7/00 ,  B33Y80/00

Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.

公开(公告)号：US20210144892A1

公开(公告)日：2021-05-13

申请号：US16678211

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Wade A. Schwanda

IPC: H05K13/04 ,  H05K3/38 ,  H05K3/46

Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

公开(公告)号：US20190315501A1

公开(公告)日：2019-10-17

申请号：US16386968

申请日：2019-04-17

Applicant: Raytheon Company ,  ThermAvant Technologies, LLC

Inventor： Tuan L. Duong ,  Adam D. Leeds ,  James E. Benedict ,  Joseph A. Boswell ,  Daniel A. Pounds

IPC: B64G1/58 ,  B64G1/10 ,  F03G7/06 ,  F28D15/02 ,  F28F3/12

Abstract: An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

公开(公告)号：US11470725B2

公开(公告)日：2022-10-11

申请号：US17395977

申请日：2021-08-06

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US11432408B2

公开(公告)日：2022-08-30

申请号：US16414112

申请日：2019-05-16

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Peter J. Adams ,  James E. Benedict ,  Carolyn R. Reistad

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/09 ,  H05K3/22 ,  B33Y10/00 ,  B33Y80/00

Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.