公开(公告)号：US09763140B2

公开(公告)日：2017-09-12

申请号：US12917846

申请日：2010-11-02

Applicant: Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

Inventor： Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

IPC: H04W28/24 ,  H04W28/26

CPC classification number: H04W28/24 ,  H04W28/26

Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.

公开(公告)号：US08444043B1

公开(公告)日：2013-05-21

申请号：US13362228

申请日：2012-01-31

Applicant: William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

Inventor： William E. Bernier ,  Marcus E. Interrante ,  Rajneesh Kumar ,  Chenzhou Lian ,  Janak G. Patel ,  Peter Slota, Jr.

IPC: B23K31/00 ,  B23K31/02

CPC classification number: H01L23/49816 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75101 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.

Abstract translation: 一组焊球附着到第一衬底和第二衬底之一的焊盘上。 在相对于第一基板和第二基板中的另一个的焊盘对准焊球的阵列之后，将热质量增加的夹具放置在第二基板的表面上以形成第一基板的组件，第二基板 基板以及它们之间的焊球的阵列，以及热质量增加夹具。 热质量增加夹具与第二基板的周边的至少一个表面物理接触。 热质量增加夹具降低了回流步骤后外围焊球的冷却速率，从而增加了冷却期间外围焊球变形的时间，并降低了冷却后焊锡球上的机械应力 。

公开(公告)号：US08381966B2

公开(公告)日：2013-02-26

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  H01L21/44

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。

公开(公告)号：US08165021B2

公开(公告)日：2012-04-24

申请号：US11899935

申请日：2007-09-05

Applicant: Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

Inventor： Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

IPC: G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H04L12/28 ,  H04L12/56

CPC classification number: H04L47/824 ,  H04L47/10 ,  H04L47/70 ,  H04L47/805 ,  H04L47/822

Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.

Abstract translation: 在一个实施例中，网络设备从连接中接收来自客户端的请求，其中请求指示被请求支持连接的一个或多个资源的量。 网络设备确定资源的数量是否可用。 然后，网络设备可以根据资源的数量是否可用来向该连接分配一个资源级别。

公开(公告)号：US08129230B2

公开(公告)日：2012-03-06

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20110037181A1

公开(公告)日：2011-02-17

申请号：US12538965

申请日：2009-08-11

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US07486658B2

公开(公告)日：2009-02-03

申请号：US11192706

申请日：2005-07-29

Applicant: Rajneesh Kumar

Inventor： Rajneesh Kumar

IPC: H04J3/06

CPC classification number: H04N21/6437 ,  H04J3/0638 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2416 ,  H04L47/286 ,  H04N21/4305 ,  H04N21/64322 ,  H04W28/10 ,  H04W56/00 ,  H04W84/12

Abstract: A method and system directed to negotiating and triggering media stream synchronization at the link layer in a QoS-enabled 802.11 WLAN, or other wireless, network. In one implementation, the present invention allows for improved performance of streaming network applications, such as video conferencing, over wireless links. In one implementation, the present invention also provides an optional mechanism whereby a mobile station can signal a need for on-the-fly throttling, if an application on the mobile detects that there is a need for better synchronization of two streams, such as a lower priority stream to a higher priority stream.

Abstract translation: 一种用于在启用QoS的802.11 WLAN或其他无线网络中的链路层协商和触发媒体流同步的方法和系统。 在一个实现中，本发明允许通过无线链路改进诸如视频会议之类的流媒体网络应用的性能。 在一个实施方式中，本发明还提供了一种可选的机构，其中移动台可以发出对即时节流的需要，如果移动台上的应用检测到需要两个流的更好的同步，诸如 较低优先级流到较高优先级流。

公开(公告)号：US20070242649A1

公开(公告)日：2007-10-18

申请号：US11405319

申请日：2006-04-17

Applicant: Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

Inventor： Rajneesh Kumar ,  Ashish Chotai ,  Aseem Asthana ,  Sravan Vadlakonda ,  Girish Variyath ,  Vikram Jayaraman ,  Pradeep Bheda

IPC: H04Q7/28

CPC classification number: H04W72/0406 ,  H04W4/16 ,  H04W84/16

Abstract: In one embodiment, a method for requesting wireless network resources includes transmitting a network resource request to a wireless network in response to a session initiation message from a session signaling node and, responsive to an indication that the wireless network lacks sufficient resources, conditionally transmitting a camp-on information message to the session signaling node.

Abstract translation: 在一个实施例中，用于请求无线网络资源的方法包括响应于来自会话信令节点的会话发起消息向无线网络发送网络资源请求，并且响应于无线网络缺少足够资源的指示，有条件地发送 驻留信息消息发送到会话信令节点。

公开(公告)号：US08492910B2

公开(公告)日：2013-07-23

申请号：US13358910

申请日：2012-01-26

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20120217287A1

公开(公告)日：2012-08-30

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。