公开(公告)号：US20090175606A1

公开(公告)日：2009-07-09

申请号：US11970693

申请日：2008-01-08

申请人： Raschid J. Bezama ,  Lewis S. Goldmann ,  Donald R. Wall

发明人： Raschid J. Bezama ,  Lewis S. Goldmann ,  Donald R. Wall

IPC分类号： H01L21/67

CPC分类号： H01L21/6875 ,  H01L21/67103

摘要： An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.

摘要翻译： 物品在热处理过程中支撑工件。 至少三个细长的支撑构件，例如支撑销，从诸如用于支撑工件的支撑臂的元件向上延伸。 每个支撑构件包括与工件相邻的第一部分。 第二部分从第一部分向下延伸。 第一部分可以具有比工件的热响应更快的热响应，并且第二部分可以具有较慢的热响应。 可移动元件可以安装到支撑构件上，以调节支撑构件的热响应。 使用可移除元件，可以调节支撑构件，使得不会向工件或从工件传出热量的净传递。

公开(公告)号：US20090095444A1

公开(公告)日：2009-04-16

申请号：US12338092

申请日：2008-12-18

申请人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Kamal K. Sikka ,  Hilton T. Toy

发明人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Kamal K. Sikka ,  Hilton T. Toy

IPC分类号： F28F7/00

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体，并在垂直于目标表面的方向上去除废热流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。

公开(公告)号：US20080284994A1

公开(公告)日：2008-11-20

申请号：US12182282

申请日：2008-07-30

申请人： Dmitriy Shneyder ,  Raschid J. Bezama ,  Dario L. Goldfarb ,  Kafal Lai

发明人： Dmitriy Shneyder ,  Raschid J. Bezama ,  Dario L. Goldfarb ,  Kafal Lai

IPC分类号： G03B27/52

CPC分类号： G03D3/02 ,  G03F7/70341 ,  G03F7/70716 ,  G03F7/70916 ,  H01L21/68735

摘要： A method for reducing contamination in immersion lithography includes retaining a semiconductor wafer on a support surface of a wafer chuck, the wafer chuck having a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein; and providing a fluid circulation path within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.

摘要翻译： 一种用于减少浸没式光刻中的污染的方法，包括将半导体晶片保持在晶片卡盘的支撑表面上，晶片卡盘在其中具有间隙，位于晶片的外边缘附近的间隙，以及包含一定量的浸没光刻 流体; 并且在晶片卡盘内提供流体循环路径，以便于浸没式光刻流体在间隙中的径向向外移动，从而将浸没式光刻流体的弯月面相对于半导体晶片的顶表面保持在选定的高度 。

公开(公告)号：US20080284993A1

公开(公告)日：2008-11-20

申请号：US12182278

申请日：2008-07-30

申请人： Dmitriy Shneyder ,  Raschid J. Bezama ,  Dario L. Goldfarb ,  Kafal Lai

发明人： Dmitriy Shneyder ,  Raschid J. Bezama ,  Dario L. Goldfarb ,  Kafal Lai

IPC分类号： G03B27/52

CPC分类号： G03D3/02 ,  G03F7/70341 ,  G03F7/70716 ,  G03F7/70916 ,  H01L21/68735

摘要： A wafer chuck assembly includes a first chuck section configured to hold a semiconductor wafer on a support surface thereof, and a second chuck section removably attached to the first chuck section. The first chuck section has a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein. A fluid circulation path is configured within the first chuck section so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.

摘要翻译： 晶片卡盘组件包括配置成将半导体晶片保持在其支撑表面上的第一卡盘部分和可移除地附接到第一卡盘部分的第二卡盘部分。 第一卡盘部分在其中具有间隙，间隙位于晶片的外边缘附近，并且间隙包含一定量的浸没光刻流体。 流体循环路径被构造在第一卡盘部分内，以便于浸没式光刻流体在间隙中的径向向外移动，从而将浸没式光刻流体的弯液面保持在相对于半导体的顶表面的选定高度 晶圆。

公开(公告)号：US06900073B2

公开(公告)日：2005-05-31

申请号：US10249429

申请日：2003-04-08

申请人： Raschid J. Bezama ,  Renee L. Weisman

发明人： Raschid J. Bezama ,  Renee L. Weisman

IPC分类号： H05K3/22 ,  H01L21/48 ,  H01L23/12 ,  H01L21/44

CPC分类号： H01L21/4807

摘要： An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.

公开(公告)号：US06395337B1

公开(公告)日：2002-05-28

申请号：US09364845

申请日：1999-07-30

申请人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

发明人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

IPC分类号： B05D302

CPC分类号： B32B18/00 ,  C04B35/10 ,  C04B35/581 ,  C04B41/009 ,  C04B41/5022 ,  C04B41/86 ,  C04B2111/00844 ,  C04B2237/064 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/564 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/4629 ,  C04B41/4539 ,  C04B41/4578

摘要： A multilayer ceramic substrate contains a ceramic coating which is different in composition than the main body of the multilayer ceramic substrate to control camber of the multilayer ceramic substrate during sintering. The primary component of the ceramic coating is a secondary component of the main body of the multilayer ceramic substrate.

摘要翻译： 多层陶瓷基板包含与多层陶瓷基板的主体不同的陶瓷涂层，以在烧结期间控制多层陶瓷基板的弯度。 陶瓷涂层的主要成分是多层陶瓷基体的主体的次要成分。

公开(公告)号：US06330157B1

公开(公告)日：2001-12-11

申请号：US09469158

申请日：1999-12-21

申请人： Raschid J. Bezama ,  Raed A. Sherif

发明人： Raschid J. Bezama ,  Raed A. Sherif

IPC分类号： H05K720

CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.

摘要翻译： 本发明涉及一种用于从电子部件或散热器进行热交换的装置或装置及其方法。 更具体地说，本发明涉及散热器，其结合了一种创新的热机械致动装置，其调节散热器散热的能力及其方法。

公开(公告)号：US06284079B1

公开(公告)日：2001-09-04

申请号：US09261344

申请日：1999-03-03

申请人： Raschid J. Bezama ,  Govindarajan Natarajan

发明人： Raschid J. Bezama ,  Govindarajan Natarajan

IPC分类号： B32B3126

CPC分类号： H05K3/381 ,  H01L21/481 ,  H01L21/4853 ,  H05K1/0306 ,  H05K3/4629 ,  Y10T156/1023 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.

摘要翻译： 可以在处理期间控制生片的表面冶金，以在输入 - 输出焊盘结构下提供对金属 - 陶瓷界面的低强度结构故障的增加的阻力，并且增加氧化铝多层陶瓷上的输入 - 输出焊盘的引脚强度 底物。 为了增加生片与输入输出垫之间的接触面积，粗筛在要输出输出垫的区域中的生片上的表面积变粗糙。 金属 - 陶瓷界面之间的机械互锁通过生片和投入产出冶金之间的粘合点数量的增加以及使用不同的筛选材料得到加强。

公开(公告)号：US06276246B1

公开(公告)日：2001-08-21

申请号：US09411575

申请日：1999-10-04

申请人： Raschid J. Bezama ,  Laertis Economikos ,  Mark J. LaPlante ,  David C. Long ,  Keith C. O'Neil

发明人： Raschid J. Bezama ,  Laertis Economikos ,  Mark J. LaPlante ,  David C. Long ,  Keith C. O'Neil

IPC分类号： B26D718

CPC分类号： B26D7/1863 ,  B26D7/1854 ,  B26F2210/08 ,  H05K1/0306 ,  H05K3/005 ,  Y10T83/0453 ,  Y10T83/2066 ,  Y10T83/2068 ,  Y10T83/207

摘要： A punched slug removal system for punching a slug from a workpiece and removing the punched slug. The system includes a punch having a reciprocating travel path with a transition point where the punch changes direction. A die plate has an aperture into which a die bushing may be disposed. The die bushing provides support for the workpiece and has an opening through which the punch and a slug pass. A manifold supports the die plate and (if present) the die bushing and has a distribution channel and an orifice which direct a gas flow onto a slug attached to the punch in a direction perpendicular to the reciprocating travel path of the punch to remove the slug from the punch. The distribution channel is tapered to increase the velocity of the gas flow. The orifice is positioned at the top of the manifold adjacent the transition point of the reciprocating travel path of the punch. The manifold extends into the aperture of the die plate, reducing the cross sectional area of the aperture, and has a step formed under the punch. The system also includes a vacuum, offset relative to the punch and applied to the side of the punch opposite the orifice, to enhance removal of slugs from the punch.

摘要翻译： 一种用于从工件上冲压块塞并且移除冲压块的冲压块塞移除系统。 该系统包括具有往复运动路径的冲头，其具有冲头改变方向的转变点。 模板具有可以设置模具衬套的孔。 模具衬套为工件提供支撑，并且具有穿孔穿过的开口。 歧管支撑模板和（如果存在）模具衬套，并且具有分配通道和孔口，该分配通道和孔口沿着垂直于冲头的往复运动路径的方向将气流引导到附接到冲头的塞子上，以移除塞子 从拳打 分配通道是锥形的，以增加气流的速度。 孔口位于歧管的顶部，与冲头的往复运动路径的过渡点相邻。 歧管延伸到模板的孔中，减小了孔的横截面积，并且具有形成在冲头下方的台阶。 该系统还包括真空，相对于冲头偏移并施加到与孔口相对的冲头侧面，以增强从冲头中移除塞子。

公开(公告)号：US5614440A

公开(公告)日：1997-03-25

申请号：US419778

申请日：1995-04-11

申请人： Raschid J. Bezama ,  Dominic J. Schepis ,  Krishna Seshan

发明人： Raschid J. Bezama ,  Dominic J. Schepis ,  Krishna Seshan

IPC分类号： H01H85/00 ,  H01H85/02 ,  H01H85/046 ,  H01H85/12 ,  H01L23/525 ,  H01L23/58 ,  H01L21/44

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  Y10S148/055

摘要： A method of fabricating a noise immune fuse having sub-micron dimensions which can be programmed by an electrically and thermally synchronized event. The fuse includes a pair of fuse links in close proximity of each other, a layer of thermally conductive and electrically insulating material thermally coupling the two links forming the pair, and means for programming the first link by prompting the second link to gate the energy transfer between the links via the coupling layer. By combining thermal and electrical pulses to perform the programming function, the reliability of the fuse structure is greatly enhanced when compared to that of a single element fuse.

摘要翻译： 一种制造具有亚微米尺寸的噪声免疫熔丝的方法，其可以通过电和热同步事件来编程。 熔丝包括彼此紧密相邻的一对熔丝链，热耦合形成该对的两个连接的导热和电绝缘材料层，以及用于通过提示第二连接件对能量传递进行栅极编程的装置 通过耦合层在链路之间。 通过组合热和电脉冲来执行编程功能，与单个元件熔断器相比，熔丝结构的可靠性大大提高。