公开(公告)号：US20250040206A1

公开(公告)日：2025-01-30

申请号：US18583500

申请日：2024-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dahye Kim ,  Jinchan Yun ,  Daihong Huh ,  Jaehyun Park

IPC: H01L29/08 ,  H01L29/06 ,  H01L29/78

Abstract: A semiconductor device is described. The device includes lower and upper channel layers over an active region on a substrate. The device further includes a middle insulating structure disposed between the lower and the upper channels. The device includes gate structures surrounding the channel layers, lower and upper source/drain regions disposed on the active region on at least one side of the gate structures. Between the lower and upper source/drain regions is a barrier structure. The lower and upper source/drain regions may each fill a lower recess region or an upper recess region, respectively. These recess regions are defined by the respective channel layers, the gate structures, and by the barrier structure. The side surface slopes within the upper and the lower recess regions may vary and the side surface slopes of each of the recess regions may be different from each other.

公开(公告)号：US20240258399A1

公开(公告)日：2024-08-01

申请号：US18471260

申请日：2023-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chaeho Na ,  Sangkoo Kang ,  Donghyun Roh ,  Dahye Kim

IPC: H01L29/49 ,  H01L21/02 ,  H01L29/06 ,  H01L29/40 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

CPC classification number: H01L29/4983 ,  H01L21/02126 ,  H01L29/0673 ,  H01L29/401 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/775

Abstract: An integrated circuit device includes a gate line disposed on a fin-type active region, a source/drain region disposed on the fin-type active region, and an insulating spacer structure that covers the gate line and the source/drain region. The insulating spacer structure includes a first spacer portion that covers the sidewall of the gate line, a second spacer portion integrally connected to the first spacer portion, where the second spacer portion protrudes in a first lateral direction and covers a partial region of a sidewall of the source/drain region, and a spacer corner portion that fills a corner space defined by the gate line and the source/drain region between the first spacer portion and the second spacer portion. The insulating spacer structure has a single film structure that includes a SiOC film doped with about 0 at % to about 5 at % of nitrogen atoms.

公开(公告)号：US11888028B2

公开(公告)日：2024-01-30

申请号：US17862453

申请日：2022-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinbum Kim ,  Dahye Kim ,  Seokhoon Kim ,  Jaemun Kim ,  Ilgyou Shin ,  Haejun Yu ,  Kyungin Choi ,  Kihyun Hwang ,  Sangmoon Lee ,  Seung Hun Lee ,  Keun Hwi Cho

IPC: H01L29/08 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/165 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/786 ,  H01L29/161 ,  H01L21/8234 ,  H01L29/06

CPC classification number: H01L29/0847 ,  H01L21/823814 ,  H01L21/823828 ,  H01L27/092 ,  H01L29/165 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/78 ,  H01L29/7848 ,  H01L29/78696

Abstract: A semiconductor device includes an active pattern on a substrate, a pair of source/drain patterns on the active pattern, a channel pattern between the pair of source/drain patterns, the channel pattern including semiconductor patterns stacked to be spaced apart from each other, and a gate electrode crossing the channel pattern and extending in a first direction. One of the pair of source/drain patterns includes a first semiconductor layer and a second semiconductor layer thereon. The first semiconductor layer is in contact with a first semiconductor pattern, which is one of the stacked semiconductor patterns. The largest widths of the first semiconductor pattern, the first semiconductor layer, and the second semiconductor layer in the first direction are a first width, a second width, a third width, respectively, and the second width is larger than the first width and smaller than the third width.

公开(公告)号：US11532620B2

公开(公告)日：2022-12-20

申请号：US17524128

申请日：2021-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungin Choi ,  Dahye Kim ,  Jaemun Kim ,  Jinbum Kim ,  Seunghun Lee

IPC: H01L27/088 ,  H01L29/165 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/02 ,  H01L29/66 ,  H01L21/306 ,  H01L21/762

Abstract: Integrated circuit devices may include a fin-type active area, a semiconductor liner contacting a side wall of the fin-type active area and including a protrusion portion protruding outward from the fin-type active area in the vicinity of an edge of an upper surface of the fin-type active area, and an isolation layer spaced apart from the fin-type active area with the semiconductor liner therebetween. To manufacture the integrated circuit devices, a crystalline semiconductor layer covering the fin-type active area with a first thickness and an amorphous semiconductor layer covering the mask pattern with a second thickness may be formed, an extended crystalline semiconductor layer covering the mask pattern may be formed by crystalizing the amorphous semiconductor layer, and a semiconductor liner including a protrusion portion may be formed from the extended crystalline semiconductor layer and the crystalline semiconductor layer.

公开(公告)号：US11201087B2

公开(公告)日：2021-12-14

申请号：US16838089

申请日：2020-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaemun Kim ,  Gyeom Kim ,  Seung Hun Lee ,  Dahye Kim ,  Ilgyou Shin ,  Sangmoon Lee ,  Kyungin Choi

IPC: H01L21/8234 ,  H01L21/02 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L29/66 ,  H01L21/306 ,  H01L21/762

Abstract: A method includes forming an active pattern on a substrate, the active pattern comprising first semiconductor patterns and second semiconductor patterns, which are alternately stacked, forming a capping pattern on a top surface and a sidewall of the active pattern, performing a deposition process on the capping pattern to form an insulating layer, and forming a sacrificial gate pattern intersecting the active pattern on the insulating layer. The capping pattern has a crystalline structure and is in physical contact with sidewalls of the first semiconductor patterns and sidewalls of the second semiconductor patterns.

公开(公告)号：US20210125983A1

公开(公告)日：2021-04-29

申请号：US16946060

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungin Choi ,  Dahye Kim ,  Jaemun Kim ,  Jinbum Kim ,  Seunghun Lee

IPC: H01L27/088 ,  H01L29/165 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/02 ,  H01L21/306 ,  H01L21/762 ,  H01L29/66

Abstract: Integrated circuit devices may include a fin-type active area, a semiconductor liner contacting a side wall of the fin-type active area and including a protrusion portion protruding outward from the fin-type active area in the vicinity of an edge of an upper surface of the fin-type active area, and an isolation layer spaced apart from the fin-type active area with the semiconductor liner therebetween. To manufacture the integrated circuit devices, a crystalline semiconductor layer covering the fin-type active area with a first thickness and an amorphous semiconductor layer covering the mask pattern with a second thickness may be formed, an extended crystalline semiconductor layer covering the mask pattern may be formed by crystalizing the amorphous semiconductor layer, and a semiconductor liner including a protrusion portion may be formed from the extended crystalline semiconductor layer and the crystalline semiconductor layer.