HBM RAS CACHE ARCHITECTURE
    31.
    发明申请

    公开(公告)号:US20200004652A1

    公开(公告)日:2020-01-02

    申请号:US16150239

    申请日:2018-10-02

    Abstract: According to one general aspect, an apparatus may include a plurality of stacked integrated circuit dies that include a memory cell die and a logic die. The memory cell die may be configured to store data at a memory address. The logic die may include an interface to the stacked integrated circuit dies and configured to communicate memory accesses between the memory cell die and at least one external device. The logic die may include a reliability circuit configured to ameliorate data errors within the memory cell die. The reliability circuit may include a spare memory configured to store data, and an address table configured to map a memory address associated with an error to the spare memory. The reliability circuit may be configured to determine if the memory access is associated with an error, and if so completing the memory access with the spare memory.

    SMART IN-MODULE REFRESH FOR DRAM
    38.
    发明申请
    SMART IN-MODULE REFRESH FOR DRAM 有权
    用于DRAM的SMART IN-MODULE刷新

    公开(公告)号:US20170040050A1

    公开(公告)日:2017-02-09

    申请号:US15299445

    申请日:2016-10-20

    Abstract: A memory (1205) is disclosed. The memory (1205) can includes a stack of dynamic Random Access Memory (DRAM) cores (1210, 1215, 1220, 1225) in a three-dimensional stacked memory architecture (1230). Each of the DRAM cores (1210, 1215, 1220, 1225) can include a plurality of banks (205-1, 205-2, 205-3, 205-4) to store data. The memory (1205) can also include logic layer (1235) which can include an interface (1305) to connect the memory (1205) with a processor (120). The logic layer (1235) can also include a refresh engine (115) that can be used to refresh one of the plurality of banks (205-1, 205-2, 205-3, 205-4) and a Smart Refresh Component (305) that can advise the refresh engine (115) which bank to refresh using an out-of-order per-bank refresh. The Smart Refresh Component (305) can use a logic (415) to identify a farthest bank in the pending transactions in the transaction queue (430) at the time of refresh.

    Abstract translation: 公开了一种存储器(1205)。 存储器(1205)可以包括三维堆叠存储器架构(1230)中的动态随机存取存储器(DRAM)核心(1210,1215,1220,1225)堆叠。 每个DRAM内核(1210,1215,1220,1225)可以包括用于存储数据的多个存储体(205-1,205-2,205-3,205-4)。 存储器(1205)还可以包括逻辑层(1235),其可以包括将存储器(1205)与处理器(120)连接的接口(1305)。 逻辑层(1235)还可以包括刷新引擎(115),其可用于刷新多个存储体(205-1,205-2,205-3,205-4)中的一个和一个智能刷新组件( 305),其可以建议刷新引擎(115)哪个存储体使用无序刷新每次刷新刷新。 在刷新时,智能刷新组件(305)可以使用逻辑(415)来识别事务队列(430)中的待处理事务中的最远存储体。

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