Pattern inspection method using pattern model

    公开(公告)号:US12205267B2

    公开(公告)日:2025-01-21

    申请号:US17737494

    申请日:2022-05-05

    Abstract: A pattern inspection method includes converting sample patterns of a sample image into training images, extracting feature values of the training patterns, setting feature vectors of the training patterns on the basis of the feature values, converting the feature vectors into Gaussian vectors, clustering the Gaussian vectors, thereby sorting the Gaussian vectors into clusters, selecting a select vector from each of the clusters, storing, as a pattern model, the training pattern corresponding to the select vector in a database, converting a target pattern of a target image into an inspection pattern on the basis of the pattern model, and inspecting the inspection pattern.

    Wireless charging transmitter and wireless power transfer method

    公开(公告)号:US11482886B2

    公开(公告)日:2022-10-25

    申请号:US16784432

    申请日:2020-02-07

    Abstract: One or more disclosed embodiments relate to a wireless charging transmitter and a wireless power transfer method. The wireless charging transmitter includes a first charging pad including a first wireless power circuit, a second charging pad including a second wireless power circuit, and a controller configured to, in response to detection of a first electronic device being placed on the first charging pad, transfer power at a first designated wireless power level via the first wireless power circuit, in response to detection of a second electronic device being placed on the second charging pad, transmit a first command for decreasing power transferred to the first electronic device, and transfer, upon receipt of a first request for power at a second designated wireless power level from the first electronic device in response to the first command, the power at the second designated wireless power level via the first and second wireless power circuits. The disclosure may further include other various embodiments.

    INSPECTION METHOD, INSPECTION SYSTEM, AND SEMICONDUCTOR FABRICATION USING THE SAME

    公开(公告)号:US20220197149A1

    公开(公告)日:2022-06-23

    申请号:US17406529

    申请日:2021-08-19

    Inventor: Kihyun Kim

    Abstract: Provided is an inspection method including providing a pattern layout including measurement points, generating a first measurement map including first measurement regions that overlap the measurement points and do not overlap each other in a two-dimensional plan view, providing preliminary measurement regions on the measurement points, producing a polygon by grouping ones of the preliminary measurement regions that overlap each other in the two-dimensional plan view, providing a second measurement region on a center of the polygon, selecting the second measurement region when all of the measurement points in the polygon overlap the second measurement region in the two-dimensional plan view, generating a second measurement map including the selected second measurement region, generating a third measurement map by using the first and second measurement maps, and inspecting patterns on a semiconductor substrate by using the third measurement map. The third measurement map includes the selected second measurement region and ones of the first measurement regions that do not overlap the selected second measurement region in the two-dimensional plan view.

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