公开(公告)号：US12047444B2

公开(公告)日：2024-07-23

申请号：US17837229

申请日：2022-06-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwook Kim ,  Sanghoon Lee ,  Hyunchul Yang ,  Hangil Moon ,  Kali Charangajula

IPC: H04L65/613 ,  H04L65/611 ,  H04L65/80 ,  H04L67/1095

CPC classification number: H04L67/1095 ,  H04L65/611 ,  H04L65/613 ,  H04L65/80

Abstract: An electronic device and a method are provided for recording audio data acquired from multiple devices. The electronic device includes a microphone, a communication module, a memory, and a processor configured to establish a first communication link with a first external electronic device through the communication module, establish a second communication link with a second external electronic device through the communication module, acquire a microphone input signal by operating the microphone based on receiving a recording request from the first external electronic device, monitor a transmission environment with the communication module or the second external electronic device, determine a bit rate of audio, based on the transmission environment, encode the audio, based on the determined bit rate, and transmit the encoded audio data to the first external electronic device.

公开(公告)号：US11763703B2

公开(公告)日：2023-09-19

申请号：US17967547

申请日：2022-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonmyung Woo ,  Jeongil Kang ,  Kangmoon Seo ,  Sanghoon Lee

IPC: G06F3/041 ,  G09F9/30 ,  G06F1/16

CPC classification number: G09F9/301 ,  G06F1/1652

Abstract: An electronic apparatus is provided. The electronic apparatus includes: a main body; and a power supply device configured to be electrically connected to the main body. The power supply device includes: a first housing comprising a first circuit configured to receive alternating current (AC) power; a second housing comprising a second circuit configured to supply direct current (DC) power to the main body; a hinge connected to the first housing and the second housing, and configured to be folded; and a flexible conductive structure electrically connecting the first circuit and the second circuit.

公开(公告)号：US11705521B2

公开(公告)日：2023-07-18

申请号：US17560804

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghoon Lee ,  Krishna Bhuwalka ,  Myunggil Kang ,  Kyoungmin Choi

IPC: H01L29/423 ,  H01L29/786 ,  H01L29/06 ,  H01L29/10 ,  H01L27/088 ,  H01L21/8234 ,  H01L29/78

CPC classification number: H01L29/7851 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/0673 ,  H01L29/1054 ,  H01L29/42392 ,  H01L29/78696

Abstract: Semiconductor devices are provided. A semiconductor device includes a fin structure having a plurality of first semiconductor patterns and a plurality of second semiconductor patterns alternately stacked on a substrate, and extending in a first direction. The semiconductor device includes a semiconductor cap layer on an upper surface of the fin structure, and extending along opposite side surfaces of the fin structure in a second direction crossing the first direction. The semiconductor device includes a gate electrode on the semiconductor cap layer, and extending in the second direction. The semiconductor device includes a gate insulating film between the semiconductor cap layer and the gate electrode. Moreover, the semiconductor device includes a source/drain region connected to the fin structure. The plurality of first semiconductor patterns include silicon germanium (SiGe) having a germanium (Ge) content in a range of 25% to 35%, and the plurality of second semiconductor patterns include silicon (Si).

公开(公告)号：US11694996B2

公开(公告)日：2023-07-04

申请号：US17245913

申请日：2021-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuekjae Lee ,  Un-Byoung Kang ,  Sang Cheon Park ,  Jinkyeong Seol ,  Sanghoon Lee

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L24/13 ,  H01L24/20 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/1302 ,  H01L2224/214 ,  H01L2225/06541

Abstract: A semiconductor package is provided. The semiconductor package may include a first semiconductor die, a second semiconductor die stacked on the first semiconductor die, the second semiconductor die having a width smaller than a width of the first semiconductor die, a third semiconductor die stacked on the second semiconductor die, the third semiconductor die having a width smaller than the width of the first semiconductor die, and a mold layer covering side surfaces of the second and third semiconductor dies and a top surface of the first semiconductor die. The second semiconductor die may include a second through via, and the third semiconductor die may include a third conductive pad in contact with the second through via.

公开(公告)号：US20230152874A1

公开(公告)日：2023-05-18

申请号：US18096993

申请日：2023-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duhee Jang ,  Kangmoon Seo ,  Sanghoon Lee ,  Jungho Lee

IPC: G06F1/3218 ,  G10L15/22 ,  G06F1/3296

CPC classification number: G06F1/3218 ,  G10L15/22 ,  G06F1/3296 ,  G10L2015/223

Abstract: An electronic device comprising: a power supply apparatus including a first converter configured to generate driving power and a second converter configured to generate first standby voltage and second standby voltage; and a main body operated based on the driving power and the second standby power received from the power supply apparatus. The second converter is configured to: during a normal mode operation and a standby mode operation, obtain the first standby voltage and adjust the first standby power based on the obtained standby power; and during the standby mode operation, obtain the second standby voltage; and in response to the obtained second standby voltage being equal to or less than a reference level, perform the normal mode operation to control the first standby voltage to be maintained at a first voltage level and control the second standby voltage to be maintained at a second voltage level.

公开(公告)号：US11645915B2

公开(公告)日：2023-05-09

申请号：US17183467

申请日：2021-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsuk Jo ,  Hyunsik Ki ,  Youngil Kim ,  Junhong Kim ,  Sanghoon Lee ,  Honghoon Jang ,  Hyeonhun Jung

IPC: G08G1/16 ,  H04W4/44 ,  G08G1/01

CPC classification number: G08G1/164 ,  G08G1/0112 ,  G08G1/0133 ,  H04W4/44

Abstract: According to an embodiment of the disclosure, a method of determining a vehicle accident comprises: receiving, from a vehicle, first information including a speed and a location of the vehicle for a communication period having variable value; obtaining second information including environment information of a trail of the vehicle; updating the communication period based on the first information and the second information such that a moving range of the vehicle during the communication period corresponds to a reference value; determining whether an accident involving the vehicle has occurred based on whether updated first information is received from the vehicle for the updated communication period; and transmitting a notification, responsive to determining an accident involving the vehicle.

公开(公告)号：US11606026B2

公开(公告)日：2023-03-14

申请号：US16997475

申请日：2020-08-19

Applicant: Samsung Electronics Co., Ltd. ,  Kookmin University Industry Academy Cooperation Foundation

Inventor： Duhee Jang ,  Sangkyoo Han ,  Jeongil Kang ,  Kasan Ha ,  Sanghoon Lee

IPC: H02M1/42 ,  H04N5/63 ,  H02M1/08 ,  H02M3/00 ,  H02M3/335 ,  H02M1/44

Abstract: Disclosed are a display apparatus and an electronic apparatus, the display apparatus including: a main body including a display and a connector; and an adapter connectable to the main body and configured to supply power to the connected main body, the adapter including: a transformer configured to boost an input first alternating current (AC) voltage, a switch including a switching device configured to switch a current flowing in the transformer, a controller configured to control the switching device to output a second AC voltage boosted by the transformer, and the main body including a power factor correction (PFC) converter configured to correct a power factor of the second AC voltage output from the adapter and output a direct current (DC) voltage.

公开(公告)号：US11574905B2

公开(公告)日：2023-02-07

申请号：US17371494

申请日：2021-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woocheol Shin ,  Myunggil Kang ,  Minyi Kim ,  Sanghoon Lee

IPC: H01L21/00 ,  H01L27/06 ,  H01L21/8234

Abstract: A resistor including a device isolation layer is described that includes a first active region and a second active region, a buried insulating layer, and an N well region. The N well region surrounds the first active region, the second active region, the device isolation layer and the buried insulating layer. A first doped region and a second doped region are disposed on the first active region and the second active region. The first doped region and the second doped region are in contact with the N well region and include n type impurities.

公开(公告)号：US11527509B2

公开(公告)日：2022-12-13

申请号：US17364541

申请日：2021-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghoon Lee ,  Hyuekjae Lee

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor package including a first semiconductor chip including a first semiconductor layer having a first forward surface having a first integrated circuit thereon and a first rear surface and a plurality of first through vias electrically connected to the first integrated circuit and including at least first and second groups of first through vias, a second semiconductor chip including a second integrated circuit electrically connected to the first group of first through vias, and a third semiconductor chip including third through vias electrically connected to the second group of first through vias, wherein the first group of first through vias transfer input/output signals of the first integrated circuit, and the second group of first through vias transfer power to the first integrated circuit, may be provided.

公开(公告)号：US11487497B2

公开(公告)日：2022-11-01

申请号：US17148694

申请日：2021-01-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwook Kim ,  Sangsoo Park ,  Hangil Moon ,  Hyunchul Yang ,  Sanghoon Lee ,  Kalicharan Gajula

IPC: G06F3/16

Abstract: An audio output device according to an embodiment may include: a short-range communication module configured to perform short-range wireless communication; a memory configured to buffer audio data received from an external electronic device through the short-range communication module; an audio output unit configured to output the audio data; and a processor. The processor may be configured to: receive operation mode information related to a function being executed in the external electronic device from the external electronic device through the short-range communication module; configure a reference period corresponding to an amount of the audio data buffered in the memory based on the operation mode information; and determine a playback speed of the audio data to be output through the audio output unit by comparing the amount of the buffered audio data with the configured reference period. In addition, various other embodiments may be possible.