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公开(公告)号：US08877553B2
公开(公告)日：2014-11-04
申请号：US13195592
申请日：2011-08-01
CPC分类号： F16K51/02 , Y10S438/905 , Y10T29/49412
摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。
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公开(公告)号：US20080258091A1
公开(公告)日：2008-10-23
申请号：US12040291
申请日：2008-02-29
CPC分类号： F16K51/02 , Y10S438/905 , Y10T29/49412
摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。
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公开(公告)号：US20110287374A1
公开(公告)日：2011-11-24
申请号：US13195592
申请日：2011-08-01
IPC分类号： F26B11/00
CPC分类号： F16K51/02 , Y10S438/905 , Y10T29/49412
摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。
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公开(公告)号：US07988129B2
公开(公告)日：2011-08-02
申请号：US12040291
申请日：2008-02-29
IPC分类号： F16K3/00
CPC分类号： F16K51/02 , Y10S438/905 , Y10T29/49412
摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。
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公开(公告)号：USD701329S1
公开(公告)日：2014-03-18
申请号：US29413676
申请日：2012-02-17
申请人： Robin L. Tiner , Shinichi Kurita
设计人： Robin L. Tiner , Shinichi Kurita
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公开(公告)号：US08070408B2
公开(公告)日：2011-12-06
申请号：US12199341
申请日：2008-08-27
申请人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
发明人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译： 本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。 负载锁定室可以具有一个或多个单独的环境隔离环境。 每个处理环境可以具有用于抽真空的多个排气口。 排气口可以位于处理环境的拐角处。 当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。 由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。 因此，可能降低衬底污染。
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公开(公告)号：US07665951B2
公开(公告)日：2010-02-23
申请号：US11421793
申请日：2006-06-02
申请人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
发明人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
IPC分类号： B65G49/07
CPC分类号： H01L21/67201 , C23C14/566 , H01L21/67109 , H01L21/67126 , H01L21/67167 , H01L21/67178 , H01L21/6719 , H01L21/67742 , H01L21/67751 , Y10S414/139
摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
摘要翻译： 本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。 在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
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公开(公告)号：US20050251990A1
公开(公告)日：2005-11-17
申请号：US10889683
申请日：2004-07-12
申请人： Soo Young Choi , John White , Qunhua Wang , Li Hou , Ki Kim , Shinichi Kurita , Tae Won , Suhail Anwar , Beom Park , Robin Tiner
发明人： Soo Young Choi , John White , Qunhua Wang , Li Hou , Ki Kim , Shinichi Kurita , Tae Won , Suhail Anwar , Beom Park , Robin Tiner
IPC分类号： H01L21/02 , C23C16/00 , C23C16/34 , C23C16/44 , C23C16/455 , C23C16/505 , C23C16/509 , C23F1/00 , H01J37/32 , H01L21/205
CPC分类号： H01J37/3244 , C23C16/345 , C23C16/455 , C23C16/45565 , C23C16/5096 , H01J37/32082 , H01J37/32091 , H01J37/32541 , H01J37/32596 , H01J2237/327 , H01J2237/3321 , H01J2237/3323 , H01J2237/3325 , Y10T29/49885 , Y10T29/49996
摘要： Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.
摘要翻译： 提供了用于在处理室中分配气体的气体扩散板的实施例。 气体分配板包括具有上游侧和下游侧的扩散板，以及在扩散板的上游侧和下游侧之间通过的多个气体通路。 气体通道包括在下游侧的中空阴极腔，以增强等离子体电离。 延伸到下游端的气体通道的空心阴极腔的深度，直径，表面积和密度可以从扩散板的中心到边缘逐渐增加，以改善衬底上的膜厚度和性能均匀性 。 从扩散板的中心到边缘的直径，深度和表面积的增加可以通过向下游侧弯曲扩散板，然后在凸出的下游侧加工出来。 扩散板的弯曲可以通过热处理或真空工艺来实现。 从扩散板的中心到边缘的直径，深度和表面积的增加也可以用计算机数字控制加工。 具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加，深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。
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公开(公告)号：US20100139889A1
公开(公告)日：2010-06-10
申请号：US12709713
申请日：2010-02-22
申请人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
发明人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
IPC分类号： H01L21/677 , F28F13/00
CPC分类号： H01L21/67201 , C23C14/566 , H01L21/67109 , H01L21/67126 , H01L21/67167 , H01L21/67178 , H01L21/6719 , H01L21/67742 , H01L21/67751 , Y10S414/139
摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
摘要翻译： 本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。 在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
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公开(公告)号：US20080118236A1
公开(公告)日：2008-05-22
申请号：US11782290
申请日：2007-07-24
申请人： Suhail Anwar , Jae-Chull Lee , Shinichi Kurita
发明人： Suhail Anwar , Jae-Chull Lee , Shinichi Kurita
CPC分类号： H01L21/67115 , C23C16/54 , H01L21/67201
摘要： Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
摘要翻译： 本发明的实施例包括加热的负载锁定室。 在一个实施例中，加热的负载锁定室包括具有至少部分地设置在其中的多个灯组件的室主体。 每个灯组件包括容纳灯的透射管。 透射管延伸到室主体中并提供将灯隔离到负载锁定室的内部空间的压力屏障。 在另一个实施例中，透射管的开口端延伸穿过腔体的侧壁。 透射管的封闭端被室主体的内部空间包围，并以间隔的关系支撑在腔室主体的顶部下方。 管的开口端被密封到腔体的侧壁，使得管的内部对大气敞开。
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