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    Biosensing well array with protective layer
    36.
    发明授权
    Biosensing well array with protective layer 有权
    具有保护层的Biosensing井阵列

    公开(公告)号：US09023674B2

    公开(公告)日：2015-05-05

    申请号：US14033089

    申请日：2013-09-20

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Wei-Cheng Shen ,  Yi-Hsien Chang ,  Shih-Wei Lin ,  Chun-Ren Cheng

    IPC: H01L21/00 ,  G01N27/414

    CPC classification number: G01N27/4145 ,  G01N27/4148

    Abstract: The present disclosure provides a biological field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET includes a microwells having a sensing layer, a top metal stack under the sensing layer, and a multi-layer interconnect (MLI) under the top metal stack. The top metal stack includes a top metal and a protective layer over and peripherally surrounding the top metal.

    Abstract translation: 本公开提供了生物场效应晶体管（BioFET）和制造BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET包括具有感测层的微孔，感测层下的顶部金属堆叠，以及在顶部金属堆叠下的多层互连（MLI）。 顶部金属堆叠包括顶部金属和保护层，并且围绕顶部金属周围。

    BIOMEMS AND PLANAR LIGHT CIRCUIT WITH INTEGRATED PACKAGE
    38.
    发明申请
    BIOMEMS AND PLANAR LIGHT CIRCUIT WITH INTEGRATED PACKAGE 有权
    具有集成封装的生物和平面光电路

    公开(公告)号：US20140335640A1

    公开(公告)日：2014-11-13

    申请号：US14444586

    申请日：2014-07-28

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Allen Timothy Chang ,  Yi-Shao Liu ,  Ching-Ray Chen ,  Chun-Ren Cheng

    IPC: G01N21/64

    CPC classification number: G01N21/648 ,  G01N21/6454 ,  H01L23/02 ,  H01L24/80 ,  H01L2924/12042 ,  H01L2924/12043 ,  Y10T156/10 ,  H01L2924/00

    Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

    Abstract translation: 公开了一种BioMEMS微机电装置及其制造方法。 衬底上设置有形成在衬底上的至少一个信号导管。 牺牲材料的牺牲层可以沉积在信号导管上，并且可选地被图案化以从包装覆盖区域的外部去除牺牲材料。 当包括的时候，粘结层可沉积在信号导管的至少一部分上和牺牲层上。 结合层可以被平坦化和图案化以形成一个或多个帽接合焊盘并限定包装覆盖区域。 帽可以结合在盖接合垫上以限定封盖区域，并且使得信号导管从封盖区域的外部延伸到封盖区域的内部。 此外，可以在封盖区域内设置诸如流体的测试材料。

    BIOSENSING WELL ARRAY BY SELF-ALIGNMENT AND SELECTIVE ETCHING
    39.
    发明申请
    BIOSENSING WELL ARRAY BY SELF-ALIGNMENT AND SELECTIVE ETCHING 有权
    通过自对准和选择性蚀刻生成树脂

    公开(公告)号：US20140308752A1

    公开(公告)日：2014-10-16

    申请号：US13946782

    申请日：2013-07-19

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Yi-Hsien Chang ,  Wei-Cheng Shen ,  Shih-Wei Lin ,  Chun-Ren Cheng

    IPC: G01N27/414

    CPC classification number: G01N27/4145 ,  Y10T436/143333

    Abstract: The present disclosure provides a biological field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a plurality of microwells having a bio-sensing layer and a number of stacked well portions over a multi-layer interconnect (MLI). A bottom surface area of a well portion is different from a top surface area of a well portion directly below. The microwells are formed by removing a top metal plate on a topmost level of the MLI.

    Abstract translation: 本公开提供了生物场效应晶体管（BioFET）和制造BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET器件包括在多层互连（MLI）上具有生物感测层和多个堆叠阱部分的多个微孔。 井部的底面积与直接在下方的井口部的顶面积不同。 通过去除MLI的最上层的顶部金属板来形成微孔。

    Scalable Biochip and Method for Making
    40.
    发明申请
    Scalable Biochip and Method for Making 有权
    可扩展生物芯片和制造方法

    公开(公告)号：US20140256030A1

    公开(公告)日：2014-09-11

    申请号：US13790828

    申请日：2013-03-08

    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING, COMPANY, LTD.

    Inventor： Wei-Cheng Shen ,  Yi-Shao Liu ,  Yi-Hsien Chang ,  Chun-Ren Cheng

    IPC: B29C65/72

    CPC classification number: B29C65/72 ,  B01L3/502707 ,  B01L2300/0636 ,  B01L2300/0887 ,  G01N27/4145

    Abstract: The present disclosure provides a biochip and methods of fabricating. The biochip includes a fluidic part and a sensing part bonded together using a polymer. The fluidic part has microfluidic channel pattern on one side and fluidic inlet and fluidic outlet on the other side that are fluidly connected to the microfluidic channel pattern. The fluidic inlet and fluidic outlet are formed by laser drilling after protecting the microfluidic channel pattern with a sacrificial protective layer. The polymer bonding is performed at low temperature without damaging patterned surface chemistry on a sensing surface of the sensing part.

    Abstract translation: 本公开提供了一种生物芯片和制造方法。 生物芯片包括流体部分和使用聚合物粘合在一起的感测部件。 流体部分在一侧具有微流体通道图案，在另一侧具有流体连接到微流体通道图案的流体入口和流体出口。 在用牺牲保护层保护微流体通道图案之后，通过激光钻孔形成流体入口和流体出口。 聚合物键合在低温下进行，而不损害感测部件的感测表面上的图案化表面化学性质。

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