Pocket counterdoping for gate-edge diode leakage reduction
    32.
    发明授权
    Pocket counterdoping for gate-edge diode leakage reduction 有权
    用于门极二极管泄漏减少的袖珍反渗透

    公开(公告)号:US08753944B2

    公开(公告)日:2014-06-17

    申请号:US13766847

    申请日:2013-02-14

    Abstract: A method of fabricating a Metal-Oxide Semiconductor (MOS) transistor includes providing a substrate having a substrate surface doped with a second dopant type and a gate stack over the substrate surface, and a masking pattern on the substrate surface which exposes a portion of the substrate surface for ion implantation. A first pocket implantation uses the second dopant type with the masking pattern on the substrate surface. At least one retrograde gate edge diode leakage (GDL) reduction pocket implantation uses the first dopant type with the masking pattern on the substrate surface. The first pocket implant and retrograde GDL reduction pocket implant are annealed. After annealing, the first pocket implant provides first pocket regions and the retrograde GDL reduction pocket implant provides an overlap with the first pocket regions to form a first counterdoped pocket portion within the first pocket regions.

    Abstract translation: 制造金属氧化物半导体(MOS)晶体管的方法包括提供具有掺杂有第二掺杂剂类型的衬底表面的衬底和在衬底表面上的栅极堆叠,以及在衬底表面上的掩模图案,其暴露部分 用于离子注入的衬底表面。 第一种口袋植入使用具有衬底表面上的掩模图案的第二掺杂剂类型。 至少一个逆向栅极边缘二极管漏极(GDL)还原袋注入在衬底表面上使用具有掩模图案的第一掺杂剂类型。 第一口袋植入物和逆行GDL还原袋植入物进行退火。 在退火之后,第一口袋植入件提供第一袋区域,并且逆行GDL减少袋植入物提供与第一袋区域的重叠,以在第一袋区域内形成第一反向袋部分。

    DECMOS FORMED WITH A THROUGH GATE IMPLANT
    39.
    发明申请
    DECMOS FORMED WITH A THROUGH GATE IMPLANT 有权
    DECMOS通过门盖植入物形成

    公开(公告)号:US20140183630A1

    公开(公告)日:2014-07-03

    申请号:US14142006

    申请日:2013-12-27

    CPC classification number: H01L21/823412 H01L21/823418 H01L21/823456

    Abstract: An integrated circuit containing a MOS transistor and a DEMOS transistor of a same polarity may be formed by implanting dopants of a same conductivity type as source/drain regions of the MOS transistor and the DEMOS transistor through a gate of the MOS transistor and through a gate of the DEMOS transistor. The implanted dopants are blocked from a drain-side edge of the DEMOS transistor gate. The implanted dopants form a drain enhancement region under the DEMOS transistor gate in a drift region of an extended drain of the DEMOS transistor.

    Abstract translation: 可以通过将MOS晶体管和DEMOS晶体管的源/漏区相同的导电类型的掺杂剂通过MOS晶体管的栅极并通过栅极形成包含具有相同极性的MOS晶体管和DEMOS晶体管的集成电路 的DEMOS晶体管。 注入的掺杂剂从DEMOS晶体管栅极的漏极侧边缘封闭。 注入的掺杂剂在DEMOS晶体管栅极的DEMOS晶体管的扩展漏极的漂移区域内形成漏极增强区域。

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