公开(公告)号：US20200066559A1

公开(公告)日：2020-02-27

申请号：US16669965

申请日：2019-10-31

Applicant: Tokyo Electron Limited

Inventor： Kenichi Shigetomi ,  Takeshi Saikusa ,  Eiichi Sekimoto ,  Takayuki Fukudome ,  Kousuke Yoshihara ,  Suguru Enokida ,  Kazuhiro Takeshita ,  Kazuto Umeki

IPC: H01L21/67 ,  H05B1/02

Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.

公开(公告)号：US10289004B2

公开(公告)日：2019-05-14

申请号：US15338638

申请日：2016-10-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi

IPC: G03F7/30 ,  B05D3/12 ,  B05C11/08 ,  B05D1/00 ,  H01L21/67 ,  B05C5/02 ,  B05D1/26

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

公开(公告)号：US10268116B2

公开(公告)日：2019-04-23

申请号：US15816088

申请日：2017-11-17

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa ,  Daisuke Ishimaru

IPC: G03F7/16 ,  H01L21/67

Abstract: A processing liquid supplying apparatus performs an ejecting step in which a processing liquid suctioned into a pump passes through a filter device and is ejected from an ejecting part without returning the processing liquid back to the pump; a returning step in which the processing liquid suctioned into the pump is returned to a processing liquid source side of a mixing section; and a replenishing step in which the processing liquid returned to the processing liquid source side is suctioned into the pump together with the processing liquid replenished from the processing liquid source. The processing liquid passes through the filter device in at least one of the returning step and the replenishing step. The amount of the processing liquid returned to the processing liquid source side in the returning step is larger than the amount of the processing liquid ejected from the ejecting part in the ejecting step.

公开(公告)号：US10022652B2

公开(公告)日：2018-07-17

申请号：US15818855

申请日：2017-11-21

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Katsunori Ichino ,  Toshinobu Furusho ,  Takashi Sasa ,  Katsuhiro Tsuchiya ,  Yuichi Terashita ,  Hirofumi Takeguchi

IPC: B01D46/46 ,  B01D53/30 ,  B01D19/00 ,  G03F7/30 ,  H01L21/67 ,  G03F7/16

Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.

公开(公告)号：US09846363B2

公开(公告)日：2017-12-19

申请号：US14528290

申请日：2014-10-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa ,  Daisuke Ishimaru

IPC: G03F7/16 ,  H01L21/67

CPC classification number: G03F7/16 ,  H01L21/67017

Abstract: A processing liquid supplying apparatus performs an ejecting step in which a processing liquid suctioned into a pump passes through a filter device and is ejected from an ejecting part without returning the processing liquid back to the pump; a returning step in which the processing liquid suctioned into the pump is returned to a processing liquid source side of a mixing section; and a replenishing step in which the processing liquid returned to the processing liquid source side is suctioned into the pump together with the processing liquid replenished from the processing liquid source. The processing liquid passes through the filter device in at least one of the returning step and the replenishing step. The amount of the processing liquid returned to the processing liquid source side in the returning step is larger than the amount of the processing liquid ejected from the ejecting part in the ejecting step.

公开(公告)号：US09704730B2

公开(公告)日：2017-07-11

申请号：US14283331

申请日：2014-05-21

Applicant: Tokyo Electron Limited

Inventor： Atsushi Ookouchi ,  Kousuke Yoshihara ,  Hiroshi Ichinomiya ,  Hirosi Nisihata

IPC: H01L21/67 ,  B08B3/00 ,  B08B7/00

CPC classification number: H01L21/67051

Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.

公开(公告)号：US09627232B2

公开(公告)日：2017-04-18

申请号：US14246714

申请日：2014-04-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Keiichi Tanaka ,  Kousuke Yoshihara ,  Tomohiro Iseki

IPC: B08B3/02 ,  B08B5/00 ,  B08B5/02 ,  H01L21/67 ,  G03F7/30

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B5/00 ,  G03F7/3021 ,  H01L21/67028 ,  H01L21/67034

Abstract: There is provided a substrate processing method including: supplying a developing liquid to a surface of an exposed substrate to form a resist pattern; supplying a cleaning liquid to the surface of the substrate to remove a residue generated in the developing step from the substrate; supplying a replacing liquid to the surface of the substrate to replace the cleaning liquid existing on the substrate with the replacing liquid, the replacing liquid having a surface tension of 50 mN/m or less and containing a percolation inhibitor for restraining the replacing liquid from percolating into a resist wall portion constituting the resist pattern; and forming a dry region by supplying a gas to a central portion of the substrate while rotating the substrate so as to dry the surface of the substrate by expanding the dry region to a peripheral edge portion of the substrate with a centrifugal force.

公开(公告)号：US09568829B2

公开(公告)日：2017-02-14

申请号：US14449419

申请日：2014-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi ,  Masahiro Fukuda

IPC: B05D3/12 ,  G03F7/30 ,  B05C5/02 ,  B05D1/00 ,  B05C11/08 ,  B05D1/26 ,  H01L21/67

CPC classification number: G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

Abstract translation: 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。

公开(公告)号：US20140235070A1

公开(公告)日：2014-08-21

申请号：US13770771

申请日：2013-02-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Derek W. Bassett ,  Wallace P. Printz ,  Joshua S. Hooge ,  Katsunori Ichino ,  Yuichi Terashita ,  Kousuke Yoshihara

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/6715 ,  B05C11/08 ,  G03F7/162 ,  H01L21/67034

Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.

Abstract translation: 本文公开的技术提供了一种旋转涂覆的装置和方法，其抑制风标记和其他缺陷从湍流流体流动的形成，从而在保持膜均匀性的同时实现更高的旋转速度和降低的干燥时间。 本文公开的技术包括定位或悬浮在晶片或其他基底的表面上方的流体流动构件，例如环或盖。 流体流动构件具有在涂覆和旋转干燥过程期间在晶片旋转期间防止风标的径向曲率。

公开(公告)号：US08678684B2

公开(公告)日：2014-03-25

申请号：US13760399

申请日：2013-02-06

Applicant: Tokyo Electron Limited

Inventor： Taro Yamamoto ,  Kousuke Yoshihara ,  Yuichi Yoshida

IPC: G03D5/00

CPC classification number: H01L21/027 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

Abstract: A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

Abstract translation: 一种显影衬底的方法，包括使衬底旋转并将显影液从显影剂喷嘴的排出口供应到衬底的表面上，同时将位于衬底上方的显影剂喷嘴从中心部分朝向衬底的周边部分移动 并且将第一冲洗液从第一冲洗喷嘴的排出口提供到基板的表面上，同时将设置在基板上方的第一冲洗喷嘴从中心部分朝向基板的周边部分移动。 同时进行显影液和第一漂洗液的供给，第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。