中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

50 records (took 0.02 seconds)

    Package structure and method for forming the same
    31.
    发明授权
    Package structure and method for forming the same 有权

    公开(公告)号：US11062968B2

    公开(公告)日：2021-07-13

    申请号：US16548165

    申请日：2019-08-22

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chih-Hao Chen ,  Chih-Chien Pan ,  Li-Hui Cheng ,  Chin-Fu Kao ,  Szu-Wei Lu

    IPC: H01L23/18 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

    Abstract: A method for forming a package structure is provided. The method for forming a package structure includes bonding a package component to a first surface of a substrate through a plurality of first connectors. The package component includes an interposer, a first semiconductor die and a second semiconductor die over the interposer. The method for forming a package structure also includes forming a dam structure over the first surface of the substrate. The dam structure is around and separated from the package component. The method for forming a package structure further includes forming an underfill layer between the dam structure and the package component, and removing the dam structure after the underfill layer is formed.

    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    32.
    发明申请
    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME 有权

    公开(公告)号：US20210202455A1

    公开(公告)日：2021-07-01

    申请号：US16925326

    申请日：2020-07-09

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Fu Tsai ,  Chin-Fu Kao ,  Pu Wang ,  Szu-Wei Lu

    IPC: H01L25/18 ,  H01L21/50

    Abstract: A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.

    Optical transceiver and manufacturing method thereof
    33.
    发明授权
    Optical transceiver and manufacturing method thereof 有权

    公开(公告)号：US11031381B2

    公开(公告)日：2021-06-08

    申请号：US16198858

    申请日：2018-11-22

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chih-Hao Chen ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

    IPC: H01L25/18 ,  G02B6/12 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

    Abstract: An optical transceiver including a photonic integrated circuit component, an electric integrated circuit component and an insulating encapsulant is provided. The photonic integrated circuit component includes at least one optical input/output portion and at least one groove located in proximity of the at least one optical input/output portion. The electric integrated circuit component is disposed on and electrically connected to the photonic integrated circuit component.
    The insulating encapsulant is disposed on the photonic integrated circuit component and laterally encapsulating the electric integrated circuit component. The at least one groove of the photonic integrated circuit component is revealed by the insulating encapsulant and is adapted for insertion of a photonic device.

    Package structure and method of fabricating the same
    35.
    发明授权
    Package structure and method of fabricating the same 有权

    公开(公告)号：US10522470B1

    公开(公告)日：2019-12-31

    申请号：US16035693

    申请日：2018-07-15

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jung-Hua Chang ,  Chin-Fu Kao

    IPC: H01L21/768 ,  H01L23/522 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

    Abstract: A package structure including a first semiconductor die, a second semiconductor die, a molding compound, an interconnect structure, first conductive features, through insulator vias, an insulating encapsulant and a redistribution layer is provided. The molding compound is encapsulating the first semiconductor die and the second semiconductor die. The interconnect structure is disposed on the molding compound and electrically connecting the first semiconductor die to the second semiconductor die. The first conductive features are electrically connected to the first semiconductor die and the second semiconductor die, wherein each of the first conductive features has a recessed portion. The through insulator vias are disposed on the recessed portion of the first conductive features and electrically connected to the first and second semiconductor die. The insulating encapsulant is encapsulating the interconnect structure and the through insulator vias. The redistribution layer is disposed on the insulating encapsulant and over the interconnect structure.

    Semiconductor package and manufacturing method thereof
    40.
    发明授权
    Semiconductor package and manufacturing method thereof 有权

    公开(公告)号：US11456268B2

    公开(公告)日：2022-09-27

    申请号：US16252734

    申请日：2019-01-21

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jung-Hua Chang ,  Chin-Fu Kao

    IPC: H01L23/00 ,  H01L25/00

    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die, and a redistribution structure disposed on the first semiconductor die and the insulating encapsulation. The first semiconductor die includes a first contact region and a first non-contact region in proximity to the first contact region. The first semiconductor die includes a first electrical connector disposed on the first contact region and a first dummy conductor disposed on the first non-contact region, and the first electrical connector is electrically connected to a first integrated circuit (IC) component in the first semiconductor die. The first electrical connector is electrically connected to the redistribution structure, and the first dummy conductor is electrically insulated from the first IC component in the first semiconductor die and the redistribution structure.

Patent Agency Ranking