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公开(公告)号：USD588031S1
公开(公告)日：2009-03-10
申请号：US29304262
申请日：2008-02-27
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公开(公告)号：USD544384S1
公开(公告)日：2007-06-12
申请号：US29262581
申请日：2006-07-07
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公开(公告)号：US20090264790A1
公开(公告)日：2009-10-22
申请号：US12091674
申请日：2006-10-11
申请人： Tameo Ashida , Tadashi Koike , Takashi Shigeno
发明人： Tameo Ashida , Tadashi Koike , Takashi Shigeno
IPC分类号： A61B5/053
CPC分类号： A61B5/0537 , A61B2560/0406 , A61B2560/0468
摘要： A body composition measuring apparatus includes electrodes for a right hand to be contacted with the right hand of a subject and electrodes for a left hand to be contacted with the left hand of the subject in an apparatus body for measuring an impedance of the body of the subject. The apparatus body includes a right hand grip having electrodes for a right hand and extending like a rod, a left hand grip having electrodes for a left hand and extending like a rod, and a base to which right hand grip and left hand grip are attached. Right hand grip is attached to base in a freely rotatable manner, and the extending direction of right hand grip and the direction along which the rotation axis of right hand grip extends are arranged to be different from each other. Thus, a small-sized, thin body composition measuring apparatus capable of being carried along can be obtained.
摘要翻译： 身体成分测量装置包括用于与受试者的右手接触的右手的电极和用于测量对象的身体的阻抗的装置主体中用于与受试者的左手接触的左手的电极 学科。 装置本体包括右手把手，其具有用于右手的电极并且像棒一样延伸，左手柄具有用于左手的电极并且像棒一样延伸，以及附接有右手把手和左手把手的基座 。 右手把手以可自由旋转的方式安装在基座上，右手把手的延伸方向和右手把手的旋转轴线沿着其延伸的方向彼此不同。 因此，可以获得能够携带的小型，薄体组成测量装置。
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公开(公告)号：USD552499S1
公开(公告)日：2007-10-09
申请号：US29236780
申请日：2005-08-23
申请人： Tameo Ashida , Jin Jiazheng , Satoshi Yamada , Tadashi Koike , Takashi Shigeno , Yoshio Kusumi
设计人： Tameo Ashida , Jin Jiazheng , Satoshi Yamada , Tadashi Koike , Takashi Shigeno , Yoshio Kusumi
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公开(公告)号：USD536631S1
公开(公告)日：2007-02-13
申请号：US29243993
申请日：2005-12-05
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公开(公告)号：USD525547S1
公开(公告)日：2006-07-25
申请号：US29223907
申请日：2005-02-23
申请人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
设计人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
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公开(公告)号：USD532329S1
公开(公告)日：2006-11-21
申请号：US29255835
申请日：2006-03-14
申请人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
设计人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
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公开(公告)号：USD531535S1
公开(公告)日：2006-11-07
申请号：US29255836
申请日：2006-03-14
申请人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
设计人： Satoshi Yamada , Tameo Ashida , Jiazheng Jin , Takashi Shigeno , Yoshio Kusumi
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39.发明授权公开(公告)号：US06372625B1
公开(公告)日：2002-04-16
申请号：US09138616
申请日：1998-08-24
申请人： Takashi Shigeno , Osamu Isaki
发明人： Takashi Shigeno , Osamu Isaki
IPC分类号： H01L2144
CPC分类号： H01L24/85 , H01L23/4952 , H01L23/49562 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/04042 , H01L2224/05552 , H01L2224/05556 , H01L2224/05599 , H01L2224/0603 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49111 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/05042 , H01L2924/13091 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/85399
摘要： A semiconductor device has a semiconductor chip fixedly mounted on an island and a bonding wire connecting a bonding pad on the semiconductor chip to a lead terminal whose end is positioned near the island. The semiconductor chip and the bonding wire are encased by a molded resin. The bonding wire includes a first extension ascending substantially vertically from the bonding pad, a second extension extending substantially horizontally from the first extension, and a third extension descending substantially vertically from the second extension. A bend between the second and third extensions is disposed outwardly of an end of the semiconductor chip.
摘要翻译： 半导体器件具有固定地安装在岛上的半导体芯片和将半导体芯片上的焊盘连接到其端部位于岛附近的引线端子的接合线。 半导体芯片和接合线被模制树脂封装。 所述接合线包括从所述接合焊盘基本垂直地上升的第一延伸部，从所述第一延伸部基本上水平延伸的第二延伸部，以及从所述第二延伸部基本竖直延伸的第三延伸部。 第二和第三延伸部之间的弯曲部设置在半导体芯片的端部的外侧。
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公开(公告)号：USD432103S
公开(公告)日：2000-10-17
申请号：US117004
申请日：2000-01-18
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