公开(公告)号：US08796756B2

公开(公告)日：2014-08-05

申请号：US13755348

申请日：2013-01-31

申请人： Kenichi Akita ,  Daisuke Okada ,  Keisuke Kuwahara ,  Yasafumi Morimoto ,  Yasuhiro Shimamoto ,  Kan Yasui ,  Tsuyoshi Arigane ,  Tetsuya Ishimaru

发明人： Kenichi Akita ,  Daisuke Okada ,  Keisuke Kuwahara ,  Yasafumi Morimoto ,  Yasuhiro Shimamoto ,  Kan Yasui ,  Tsuyoshi Arigane ,  Tetsuya Ishimaru

IPC分类号： H01L29/792

CPC分类号： H01L29/66833 ,  H01L27/115 ,  H01L27/11563 ,  H01L27/11568 ,  H01L29/792

摘要： A charge storage layer interposed between a memory gate electrode and a semiconductor substrate is formed shorter than a gate length of the memory gate electrode or a length of insulating films so as to make the overlapping amount of the charge storage layer and a source region to be less than 40 nm. Therefore, in the write state, since the movement in the transverse direction of the electrons and the holes locally existing in the charge storage layer decreases, the variation of the threshold voltage when holding a high temperature can be reduced. In addition, the effective channel length is made to be 30 nm or less so as to reduce an apparent amount of holes so that coupling of the electrons with the holes in the charge storage layer decreases; therefore, the variation of the threshold voltage when holding at room temperature can be reduced.

摘要翻译： 插入在存储栅电极和半导体衬底之间的电荷存储层形成为比存储栅电极的栅极长度或绝缘膜的长度短，以使电荷存储层和源极区域的重叠量成为 小于40nm。 因此，在写入状态下，由于在电荷存储层中局部存在的电子和空穴的横向的移动减少，因此可以降低保持高温时的阈值电压的变化。 此外，有效沟道长度为30nm以下，以减少空穴的表观量，使得电子与电荷存储层中的空穴的耦合减小; 因此，可以降低在室温下保持时的阈值电压的变化。

公开(公告)号：US08472258B2

公开(公告)日：2013-06-25

申请号：US13269425

申请日：2011-10-07

申请人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C11/34 ,  G11C16/04 ,  G11C16/06

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US20120026798A1

公开(公告)日：2012-02-02

申请号：US13269425

申请日：2011-10-07

申请人： Digh HISAMOTO ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh HISAMOTO ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C16/10

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US08064261B2

公开(公告)日：2011-11-22

申请号：US12787158

申请日：2010-05-25

申请人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C11/34 ,  G11C16/04 ,  G11C16/06

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅结构的半导体非易失性存储器件中进行热孔注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US20110014783A1

公开(公告)日：2011-01-20

申请号：US12888995

申请日：2010-09-23

申请人： Tsutomu OKAZAKI ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

发明人： Tsutomu OKAZAKI ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

IPC分类号： H01L21/283

CPC分类号： H01L21/28282 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/4234 ,  H01L29/66833 ,  H01L29/792

摘要： A manufacturing method of a semiconductor device includes a first electrode formation step of forming a control gate electrode above a surface of a semiconductor substrate with a control gate insulating film interposed between the control gate electrode and the semiconductor substrate, a step of forming a storage node insulating film on the surface of the semiconductor substrate, and a second electrode formation step of forming a memory gate electrode on a surface of the storage node insulating film. The second electrode formation step includes a step of forming a memory gate electrode layer on the surface of the storage node insulating film, a step of forming an auxiliary film, having an etching rate slower than that of the memory gate electrode layer, on a surface of the memory gate electrode layer, and a step of performing anisotropic etching on the memory gate electrode layer and the auxiliary film.

摘要翻译： 半导体器件的制造方法包括：第一电极形成步骤，在控制栅电极和半导体衬底之间形成控制栅极电极，该控制栅电极在半导体衬底的表面上方，控制栅绝缘膜，形成存储节点 绝缘膜，以及在存储节点绝缘膜的表面上形成存储栅电极的第二电极形成步骤。 第二电极形成步骤包括在存储节点绝缘膜的表面上形成存储栅极电极层的步骤，在表面上形成蚀刻速率慢于存储栅电极层的蚀刻速率的辅助膜的步骤 的存储栅电极层和对存储栅电极层和辅助膜进行各向异性蚀刻的步骤。

公开(公告)号：US20100159687A1

公开(公告)日：2010-06-24

申请号：US12719524

申请日：2010-03-08

申请人： Tsutomu OKAZAKI ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

发明人： Tsutomu OKAZAKI ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

IPC分类号： H01L21/28

CPC分类号： H01L21/28282 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/4234 ,  H01L29/66833 ,  H01L29/792

摘要： A manufacturing method of a semiconductor device includes a first electrode formation step of forming a control gate electrode above a surface of a semiconductor substrate with a control gate insulating film interposed between the control gate electrode and the semiconductor substrate, a step of forming a storage node insulating film on the surface of the semiconductor substrate, and a second electrode formation step of forming a memory gate electrode on a surface of the storage node insulating film. The second electrode formation step includes a step of forming a memory gate electrode layer on the surface of the storage node insulating film, a step of forming an auxiliary film, having an etching rate slower than that of the memory gate electrode layer, on a surface of the memory gate electrode layer, and a step of performing anisotropic etching on the memory gate electrode layer and the auxiliary film.

摘要翻译： 半导体器件的制造方法包括：第一电极形成步骤，在控制栅电极和半导体衬底之间形成控制栅极电极，该控制栅电极在半导体衬底的表面上方，控制栅绝缘膜，形成存储节点 绝缘膜，以及在存储节点绝缘膜的表面上形成存储栅电极的第二电极形成步骤。 第二电极形成步骤包括在存储节点绝缘膜的表面上形成存储栅极电极层的步骤，在表面上形成蚀刻速率慢于存储栅电极层的蚀刻速率的辅助膜的步骤 的存储栅电极层和对存储栅电极层和辅助膜进行各向异性蚀刻的步骤。

公开(公告)号：US07636253B2

公开(公告)日：2009-12-22

申请号：US12354867

申请日：2009-01-16

申请人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

发明人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

IPC分类号： G11C11/34

CPC分类号： H01L27/1157 ,  G11C16/0425 ,  H01L21/28282 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/0649 ,  H01L29/4234 ,  H01L29/42344 ,  H01L29/518 ,  H01L29/66833 ,  H01L29/792

摘要： A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.

摘要翻译： 半导体存储器阵列包括具有第一电荷存储层和第一非易失性存储单元的第一非易失性存储单元，第一非易失性存储单元与第一存储单元相邻，具有第二电荷存储层和第二栅电极 。 第一电极和第二电极在垂直于第一方向的第二方向上延伸，第一电极具有在第一方向上朝向第二电极延伸的第一接触部分，并且第二电极具有朝向第一电极的第二接触部分 第一个方向 第一和第二接触位置分别沿第二方向移动，第一电极和第一接触部分与第二电极和第二接触部分电气分离。

公开(公告)号：US20070201272A1

公开(公告)日：2007-08-30

申请号：US11797164

申请日：2007-05-01

申请人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

发明人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

IPC分类号： G11C16/04

CPC分类号： H01L27/1157 ,  G11C16/0425 ,  H01L21/28282 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/0649 ,  H01L29/4234 ,  H01L29/42344 ,  H01L29/518 ,  H01L29/66833 ,  H01L29/792

摘要： A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.

摘要翻译： 半导体存储器阵列包括具有第一电荷存储层和第一非易失性存储单元的第一非易失性存储单元，第一非易失性存储单元与第一存储单元相邻，具有第二电荷存储层和第二栅电极 。 第一电极和第二电极在垂直于第一方向的第二方向上延伸，第一电极具有在第一方向上朝向第二电极延伸的第一接触部分，并且第二电极具有朝向第一电极的第二接触部分 第一个方向 第一和第二接触位置分别沿第二方向移动，第一电极和第一接触部分与第二电极和第二接触部分电气分离。

公开(公告)号：US20070155153A1

公开(公告)日：2007-07-05

申请号：US11649208

申请日：2007-01-04

申请人： Tsutomu Okazaki ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

发明人： Tsutomu Okazaki ,  Motoi Ashida ,  Hiroji Ozaki ,  Tsuyoshi Koga ,  Daisuke Okada

IPC分类号： H01L21/44

CPC分类号： H01L21/28282 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/4234 ,  H01L29/66833 ,  H01L29/792

摘要： A manufacturing method of a semiconductor device includes a first electrode formation step of forming a control gate electrode above a surface of a semiconductor substrate with a control gate insulating film interposed between the control gate electrode and the semiconductor substrate, a step of forming a storage node insulating film on the surface of the semiconductor substrate, and a second electrode formation step of forming a memory gate electrode on a surface of the storage node insulating film. The second electrode formation step includes a step of forming a memory gate electrode layer on the surface of the storage node insulating film, a step of forming an auxiliary film, having an etching rate slower than that of the memory gate electrode layer, on a surface of the memory gate electrode layer, and a step of performing anisotropic etching on the memory gate electrode layer and the auxiliary film.

摘要翻译： 半导体器件的制造方法包括：第一电极形成步骤，在控制栅电极和半导体衬底之间形成控制栅极电极，该控制栅电极在半导体衬底的表面上方，控制栅绝缘膜，形成存储节点 绝缘膜，以及在存储节点绝缘膜的表面上形成存储栅电极的第二电极形成步骤。 第二电极形成步骤包括在存储节点绝缘膜的表面上形成存储栅极电极层的步骤，在表面上形成蚀刻速率慢于存储栅电极层的蚀刻速率的辅助膜的步骤 的存储栅电极层和对存储栅电极层和辅助膜进行各向异性蚀刻的步骤。

公开(公告)号：US07015090B2

公开(公告)日：2006-03-21

申请号：US10408353

申请日：2003-04-08

申请人： Tsutomu Okazaki ,  Daisuke Okada ,  Yoshihiro Ikeda ,  Keisuke Tsukamoto ,  Tatsuya Fukumura ,  Shoji Shukuri ,  Keiichi Haraguchi ,  Koji Kishi

发明人： Tsutomu Okazaki ,  Daisuke Okada ,  Yoshihiro Ikeda ,  Keisuke Tsukamoto ,  Tatsuya Fukumura ,  Shoji Shukuri ,  Keiichi Haraguchi ,  Koji Kishi

IPC分类号： H01L21/8248

CPC分类号： H01L27/11536 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11526 ,  H01L29/66181 ,  H01L29/7833

摘要： At least not less than one capacitor formation trench providing an uneven surface is formed on the surface of a capacitor formation region. Thus, the surface area of a capacitor is increased, which enables improvement of the capacitance of the capacitor per unit area. Further, by forming the capacitor formation trench and an element formation trench that are formed in the surface of the semiconductor substrate by the same step, it is possible to simplify the manufacturing process. Whereas, a dielectric film of the capacitor in the capacitor formation region and a high-voltage gate insulating film in a MISFET formation region are formed by the same step; alternatively, the dielectric film of the capacitor in the capacitor formation region and a memory gate interlayer film between a polysilicon layer and a polysilicon layer in the memory cell formation region are formed by the same step.

摘要翻译： 在电容器形成区域的表面上形成至少不少于一个形成凹凸表面的电容器形成沟槽。 因此，电容器的表面积增加，这能够提高每单位面积的电容器的电容。 此外，通过形成通过相同的步骤形成在半导体衬底的表面中的电容器形成沟槽和元件形成沟槽，可以简化制造工艺。 而电容器形成区域中的电容器的电介质膜和MISFET形成区域中的高压栅极绝缘膜通过相同的步骤形成; 或者，电容器形成区域中的电容器的电介质膜和存储单元形成区域中的多晶硅层和多晶硅层之间的存储器栅极层间膜通过相同的步骤形成。