公开(公告)号：US07851886B2

公开(公告)日：2010-12-14

申请号：US11812813

申请日：2007-06-21

申请人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Eiji Sugiyama ,  Kaori Ogita ,  Naoto Kusumoto

发明人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Eiji Sugiyama ,  Kaori Ogita ,  Naoto Kusumoto

IPC分类号： H01L29/06

CPC分类号： H01L23/293 ,  H01L23/49855 ,  H01L23/66 ,  H01L27/1248 ,  H01L27/1266 ,  H01L27/13 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. In addition, a substrate covering an element formation layer side is a substrate having a support on its surface is used in the manufacturing process.

摘要翻译： 本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。 半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。 在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值 在导电层上形成的绝缘层与导电层的厚度比为至少0.2。 此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。 此外，在制造过程中使用覆盖元件形成层侧的基板是其表面上具有支撑体的基板。

公开(公告)号：US08039353B2

公开(公告)日：2011-10-18

申请号：US12854060

申请日：2010-08-10

申请人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Eiji Sugiyama ,  Kaori Ogita ,  Naoto Kusumoto

发明人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Eiji Sugiyama ,  Kaori Ogita ,  Naoto Kusumoto

IPC分类号： H01L21/027 ,  H01L21/033 ,  H01L21/78

CPC分类号： H01L23/293 ,  H01L23/49855 ,  H01L23/66 ,  H01L27/1248 ,  H01L27/1266 ,  H01L27/13 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. In addition, a substrate covering an element formation layer side is a substrate having a support on its surface is used in the manufacturing process.

摘要翻译： 本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。 半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。 在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值 在导电层上形成的绝缘层与导电层的厚度比为至少0.2。 此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。 此外，在制造过程中使用覆盖元件形成层侧的基板是其表面上具有支撑体的基板。

公开(公告)号：US20080012126A1

公开(公告)日：2008-01-17

申请号：US11819157

申请日：2007-06-25

申请人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Kaori Ogita ,  Naoto Kusumoto

发明人： Yoshitaka Dozen ,  Tomoyuki Aoki ,  Hidekazu Takahashi ,  Daiki Yamada ,  Kaori Ogita ,  Naoto Kusumoto

IPC分类号： H01L23/06 ,  D21F13/00

CPC分类号： D21H21/48 ,  B32B29/00 ,  D21H27/32 ,  G06K19/07749 ,  H01L23/49855 ,  H01L27/1214 ,  H01L27/1255 ,  H01L27/1266 ,  H01L29/78603 ,  H01L2924/0002 ,  H01L2924/00

摘要： Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.

摘要翻译： 实现了能够无线通信的半导体器件的纸张，其中包括半导体器件的部分的不均匀性不突出，并且纸薄，厚度小于或等于130μm。 半导体器件设置有电路部分和天线，并且电路部分包括薄膜晶体管。 电路部分和天线与在制造期间使用的基板分离，并且被插入在柔性基底和密封层之间并被保护。 半导体器件可以弯曲，并且半导体器件本身的厚度小于或等于30μm。 半导体器件以造纸工艺嵌入纸中。

公开(公告)号：US08227886B2

公开(公告)日：2012-07-24

申请号：US12358449

申请日：2009-01-23

申请人： Hidekazu Takahashi ,  Yohei Monma ,  Daiki Yamada ,  Takahiro Iguchi ,  Kazuo Nishi

发明人： Hidekazu Takahashi ,  Yohei Monma ,  Daiki Yamada ,  Takahiro Iguchi ,  Kazuo Nishi

IPC分类号： H01L31/09

CPC分类号： H01L31/02162 ,  H01L25/0655 ,  H01L27/14621 ,  H01L27/14643 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object is to reduce the breakage of appearance such as a crack, a split and a chip by external stress of a semiconductor device. Another object is that manufacturing yield of a thin semiconductor device increases. The semiconductor device includes a plurality of semiconductor integrated circuits mounted on the interposer. Each of the plurality of semiconductor integrated circuits includes a light transmitting substrate which have a step on the side surface and in which the width of one section of the light transmitting substrate is narrower than that of the other section of the light transmitting substrate when the light transmitting substrate is divided at a plane including the step, a semiconductor element layer including a photoelectric conversion element provided on one surface of the light transmitting substrate, and a chromatic color light transmitting resin layer which covers the other surface of the light transmitting substrate and a part of the side surface. The colors of the chromatic color light transmitting resin layers are different in each of the plurality of semiconductor integrated circuits.

摘要翻译： 目的是通过半导体器件的外部应力来减少裂纹，裂纹和芯片的外观破损。 另一个目的是提高薄半导体器件的制造成品率。 半导体器件包括安装在插入器上的多个半导体集成电路。 所述多个半导体集成电路中的每一个都包括透光基板，所述透光基板在所述侧表面具有台阶，并且所述透光基板的一部分的宽度比所述透光基板的另一部分的宽度窄，当所述光 发送基板在包括该台阶的平面处被分割，包括设置在透光基板的一个表面上的光电转换元件的半导体元件层和覆盖透光基板的另一个表面的彩色透光树脂层和 侧面的一部分。 多色半导体集成电路中的彩色透光树脂层的颜色不同。

公开(公告)号：US20050285231A1

公开(公告)日：2005-12-29

申请号：US11157166

申请日：2005-06-21

申请人： Tatsuya Arao ,  Yoshitaka Dozen ,  Daiki Yamada ,  Eiji Sugiyama ,  Tomoko Tamura ,  Junya Maruyama ,  Nozomi Horikoshi ,  Yuugo Goto

发明人： Tatsuya Arao ,  Yoshitaka Dozen ,  Daiki Yamada ,  Eiji Sugiyama ,  Tomoko Tamura ,  Junya Maruyama ,  Nozomi Horikoshi ,  Yuugo Goto

IPC分类号： H01L21/461 ,  H01L21/68 ,  H01L21/77 ,  H01L23/58

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1255 ,  H01L2221/68363 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/00

摘要： An efficient mass-production method of very small devices that can receive or transmit data in touch, preferably, out of touch is provided by forming an integrated circuit made of a thin film over a large glass substrate and transferring the integrated circuit to another backing to be divided. Especially, the integrated circuit made of a thin film is difficult to use since there is a threat that the integrated circuit is flied in all directions as the integrated circuit is extremely thin. According to the present invention, multiple holes or grooves reaching the peel layer are provided, and a material body having a pattern shape that does not cover the holes (or grooves) and the device portion is provided, then, gas or liquid containing fluorine halide is introduced to remove selectively the peel layer.

摘要翻译： 通过在大玻璃基板上形成由薄膜制成的集成电路并将集成电路传送到另一个背衬来提供可以接收或传输触摸数据，优选不接触的非常小的器件的有效批量生产方法 被分割 特别是，由于集成电路非常薄，因此存在集成电路在各个方向上飞行的威胁，因此难以使用由薄膜制成的集成电路。 根据本发明，提供到达剥离层的多个孔或槽，并且设置具有不覆盖孔（或沟槽）和器件部分的图案形状的材料体，然后将含有卤化物的气体或液体 被引入以选择性地去除剥离层。

公开(公告)号：US07534702B2

公开(公告)日：2009-05-19

申请号：US11157166

申请日：2005-06-21

申请人： Tatsuya Arao ,  Yoshitaka Dozen ,  Daiki Yamada ,  Eiji Sugiyama ,  Tomoko Tamura ,  Junya Maruyama ,  Nozomi Horikoshi ,  Yuugo Goto

发明人： Tatsuya Arao ,  Yoshitaka Dozen ,  Daiki Yamada ,  Eiji Sugiyama ,  Tomoko Tamura ,  Junya Maruyama ,  Nozomi Horikoshi ,  Yuugo Goto

IPC分类号： H01L21/00

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1255 ,  H01L2221/68363 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/00

摘要： An efficient mass-production method of very small devices that can receive or transmit data in touch, preferably, out of touch is provided by forming an integrated circuit made of a thin film over a large glass substrate and transferring the integrated circuit to another backing to be divided. Especially, the integrated circuit made of a thin film is difficult to use since there is a threat that the integrated circuit is scattered in the handling of the integrated circuit since the integrated circuit is extremely thin. According to the present invention, multiple openings reaching a peel layer are provided, a material body having a pattern shape that does not cover regions (the openings and a device portion) is provided, and then, a gas or liquid containing fluorine halide is introduced to partially remove the peel layer.

摘要翻译： 通过在大玻璃基板上形成由薄膜制成的集成电路并将集成电路传送到另一个背衬来提供可以接收或传输触摸数据，优选不接触的非常小的器件的有效批量生产方法 被分割 特别是，由于集成电路非常薄，因为集成电路在集成电路的处理中存在散射的威胁，因此难以使用由薄膜制成的集成电路。 根据本发明，提供到达剥离层的多个开口，设置具有不覆盖区域（开口和器件部分）的图案形状的材料体，然后引入含有氟化卤的气体或液体 以部分地去除剥离层。

公开(公告)号：US08153511B2

公开(公告)日：2012-04-10

申请号：US11420889

申请日：2006-05-30

申请人： Daiki Yamada ,  Naoto Kusumoto

发明人： Daiki Yamada ,  Naoto Kusumoto

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2103/172 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1288 ,  H01L27/13

摘要： It is an object to improve a yield of a step of cutting off a substrate. A substrate is cut off by using an ablation process. An ablation process uses a phenomenon in which a molecular bond in a portion irradiated with a laser beam, that is, a portion which absorbs the laser beam is cut off, photodegraded, and evaporated. In other words, a substrate is irradiated with a laser beam, a molecular bond in a portion of the substrate is cut off, photodegraded, and evaporated; accordingly, a groove is formed in the substrate. A method for cutting the substrate has steps of selectively emitting a laser beam and forming a groove in the substrate, and selectively emitting a laser beam to the groove and cutting off the substrate. Methods for manufacturing a groove in a substrate and cutting off a substrate are used for manufacturing a semiconductor device.

摘要翻译： 本发明的目的是提高切割基板的步骤的产量。 通过使用消融工艺来切断衬底。 消融处理使用这样的现象，其中用激光束照射的部分中的分子键即吸收激光束的部分被切断，光降解和蒸发。 换句话说，用激光束照射基板，将基板的一部分中的分子键切断，光降解并蒸发; 因此，在基板中形成槽。 用于切割基板的方法具有选择性地发射激光束并在基板中形成凹槽的步骤，并且选择性地将激光束发射到凹槽并切断基板。 用于制造衬底中的沟槽并切断衬底的方法用于制造半导体器件。

公开(公告)号：US20060270195A1

公开(公告)日：2006-11-30

申请号：US11420889

申请日：2006-05-30

申请人： Daiki Yamada ,  Naoto Kusumoto

发明人： Daiki Yamada ,  Naoto Kusumoto

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2103/172 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1288 ,  H01L27/13

摘要： It is an object to improve a yield of a step of cutting off a substrate. A substrate is cut off by using an ablation process. An ablation process uses a phenomenon in which a molecular bond in a portion irradiated with a laser beam, that is, a portion which absorbs the laser beam is cut off, photodegraded, and evaporated. In other words, a substrate is irradiated with a laser beam, a molecular bond in a portion of the substrate is cut off, photodegraded, and evaporated; accordingly, a groove is formed in the substrate. A method for cutting the substrate has steps of selectively emitting a laser beam and forming a groove in the substrate, and selectively emitting a laser beam to the groove and cutting off the substrate. Methods for manufacturing a groove in a substrate and cutting off a substrate are used for manufacturing a semiconductor device.

摘要翻译： 本发明的目的是提高切割基板的步骤的产量。 通过使用消融工艺来切断衬底。 消融处理使用这样的现象，其中用激光束照射的部分中的分子键即吸收激光束的部分被切断，光降解和蒸发。 换句话说，用激光束照射基板，将基板的一部分中的分子键切断，光降解并蒸发; 因此，在基板中形成槽。 用于切割基板的方法具有选择性地发射激光束并在基板中形成凹槽的步骤，并且选择性地将激光束发射到凹槽并切断基板。 用于制造衬底中的沟槽并切断衬底的方法用于制造半导体器件。

公开(公告)号：US20070069340A1

公开(公告)日：2007-03-29

申请号：US11524071

申请日：2006-09-20

申请人： Daiki Yamada ,  Naoto Kusumoto

发明人： Daiki Yamada ,  Naoto Kusumoto

IPC分类号： H01L29/40

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/81192

摘要： It is an object of the present invention to provide a device which can pick up a chip from an adhesive film while preventing damage to the chip. In addition, a device which can pick up a chip over an adhesive film with a high yield is provided. A pickup device includes: a frame for holding a film to which a chip is attached, which is fixed to a support; a pressing jig which presses a surface of the film, to which a chip is not attached, while rotated or moved; a holding jig which holds the chip simultaneously with or after the pressing jig pressing the film; and a moving unit which moves the holding jig.

摘要翻译： 本发明的目的是提供一种能够从粘合膜拾取芯片同时防止损坏芯片的装置。 此外，提供了一种可以以高产率在粘合膜上拾取芯片的装置。 拾取装置包括：固定在支撑体上的用于保持安装了芯片的胶片的框架; 在旋转或移动的同时按压未安装芯片的膜的表面的按压夹具; 保持夹具，其与压制夹具同时或者在压制膜之后保持芯片; 以及使保持夹具移动的移动单元。

公开(公告)号：US08137050B2

公开(公告)日：2012-03-20

申请号：US11524071

申请日：2006-09-20

申请人： Daiki Yamada ,  Naoto Kusumoto

发明人： Daiki Yamada ,  Naoto Kusumoto

IPC分类号： H01L29/40

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/81192

摘要： It is an object of the present invention to provide a device which can pick up a chip from an adhesive film while preventing damage to the chip. In addition, a device which can pick up a chip over an adhesive film with a high yield is provided. A pickup device includes: a frame for holding a film to which a chip is attached, which is fixed to a support; a pressing jig which presses a surface of the film, to which a chip is not attached, while rotated or moved; a holding jig which holds the chip simultaneously with or after the pressing jig pressing the film; and a moving unit which moves the holding jig.

摘要翻译： 本发明的目的是提供一种能够从粘合膜拾取芯片同时防止损坏芯片的装置。 此外，提供了一种可以以高产率在粘合膜上拾取芯片的装置。 拾取装置包括：固定在支撑体上的用于保持安装了芯片的胶片的框架; 在旋转或移动的同时按压未安装芯片的膜的表面的按压夹具; 保持夹具，其与压制夹具同时或者在压制膜之后保持芯片; 以及使保持夹具移动的移动单元。