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公开(公告)号:US20100252814A1
公开(公告)日:2010-10-07
申请号:US12417796
申请日:2009-04-03
IPC分类号: H01L29/12 , H01L21/782
CPC分类号: H01L29/0665 , B82Y10/00 , B82Y30/00 , H01L29/0673 , H01L29/125 , H01L29/42392 , H01L29/78696
摘要: Prototype semiconductor structures each including a semiconductor link portion and two adjoined pad portions are formed by lithographic patterning of a semiconductor layer on a dielectric material layer. The sidewalls of the semiconductor link portions are oriented to maximize hole mobility for a first-type semiconductor structures, and to maximize electron mobility for a second-type semiconductor structures. Thinning by oxidation of the semiconductor structures reduces the width of the semiconductor link portions at different rates for different crystallographic orientations. The widths of the semiconductor link portions are predetermined so that the different amount of thinning on the sidewalls of the semiconductor link portions result in target sublithographic dimensions for the resulting semiconductor nanowires after thinning. By compensating for different thinning rates for different crystallographic surfaces, semiconductor nanowires having optimal sublithographic widths may be formed for different crystallographic orientations without excessive thinning or insufficient thinning.
摘要翻译: 通过在电介质材料层上的半导体层进行平版印刷图案,形成各自包括半导体连接部分和两个邻接焊盘部分的原型半导体结构。 半导体连接部分的侧壁被定向为使第一类型半导体结构的空穴迁移率最大化,并使第二类型半导体结构的电子迁移率最大化。 通过半导体结构的氧化来减薄半导体连接部分的宽度,以不同的速率降低不同的晶体取向。 半导体连接部分的宽度是预定的,使得在半导体连接部分的侧壁上的不同量的薄化导致在变薄后得到的半导体纳米线的目标亚光刻尺寸。 通过补偿不同晶面的不同稀释速率,可以为不同的晶体取向形成具有最佳亚光刻宽度的半导体纳米线,而不会过度稀化或不充分变薄。
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公开(公告)号:US20080014534A1
公开(公告)日:2008-01-17
申请号:US11776419
申请日:2007-07-11
申请人: Tymon Barwicz , Milos Popovic
发明人: Tymon Barwicz , Milos Popovic
CPC分类号: G03F7/70383
摘要: A maskless lithography system and method to expose a pattern on a wafer by propagating a photon beam through a waveguide on a substrate in a plane parallel to a top surface of the wafer.
摘要翻译: 一种无掩模光刻系统和方法,通过在平行于晶片顶表面的平面内传播光子束通过衬底上的波导而暴露晶片上的图案。
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公开(公告)号:US09364925B2
公开(公告)日:2016-06-14
申请号:US13459460
申请日:2012-04-30
申请人: Tymon Barwicz , Bing Dang
发明人: Tymon Barwicz , Bing Dang
CPC分类号: B23P11/00 , B25B11/02 , H05K13/0404 , H05K13/0408 , H05K13/0409 , Y10T29/49126 , Y10T29/49133 , Y10T29/49826 , Y10T29/49895 , Y10T29/49901 , Y10T29/53174 , Y10T29/53191 , Y10T29/53974
摘要: An assembly tool apparatus includes a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, a jig having an assembly surface operative to move from a first orientation relative to the axis to a second orientation relative to the axis, a first tool tip operative to engage with and be positioned by the manipulator, and a second tool tip operative to engage with and be positioned by the manipulator.
摘要翻译: 装配工具装置包括具有由平面限定的运动范围和基本上垂直于该平面的轴线的运动范围的操纵器,具有可相对于轴线从第一方向相对于轴线移动到第二取向的组装表面的夹具 所述轴线,操作成与所述操纵器接合并由所述操纵器定位的第一工具尖端以及与所述操纵器接合并由所述操纵器定位的第二工具尖端。
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公开(公告)号:US08724937B2
公开(公告)日:2014-05-13
申请号:US13331164
申请日:2011-12-20
申请人: Tymon Barwicz , Darrell R. Childers , Dan Kurtz
发明人: Tymon Barwicz , Darrell R. Childers , Dan Kurtz
IPC分类号: G02B6/12
CPC分类号: G02B6/30 , G02B6/1228 , G02B6/125 , G02B6/138
摘要: An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
摘要翻译: 接口装置包括具有单模波导部分的主体部分,其包括基本上光学透明的材料,由与波导部分接触的通道限定的包层部分,包层部分包括基本上光学透明的聚合物材料,接合特征可操作以接合 晶片的一部分,以及可操作地接合光纤套圈的一部分的引导部。
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公开(公告)号:US20130283591A1
公开(公告)日:2013-10-31
申请号:US13486573
申请日:2012-06-01
申请人: Tymon Barwicz , Bing Dang
发明人: Tymon Barwicz , Bing Dang
IPC分类号: B23P11/00
CPC分类号: B23P11/00 , B25B11/02 , H05K13/0404 , H05K13/0408 , H05K13/0409 , Y10T29/49126 , Y10T29/49133 , Y10T29/49826 , Y10T29/49895 , Y10T29/49901 , Y10T29/53174 , Y10T29/53191 , Y10T29/53974
摘要: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.
摘要翻译: 一种用于操作组装工具的方法包括:在装配表面上拆卸第一部件,其中操纵器的第一工具尖端具有由平面和基本垂直于该平面的轴限定的运动范围, 组装表面,使组装表面相对于轴线从第一方向改变到第二方向,使第一部件从组装表面用操纵器的第二工具尖端提升,并将第一部件放置在第二部件上。
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公开(公告)号:US20130283584A1
公开(公告)日:2013-10-31
申请号:US13459460
申请日:2012-04-30
申请人: Tymon Barwicz , Bing Dang
发明人: Tymon Barwicz , Bing Dang
CPC分类号: B23P11/00 , B25B11/02 , H05K13/0404 , H05K13/0408 , H05K13/0409 , Y10T29/49126 , Y10T29/49133 , Y10T29/49826 , Y10T29/49895 , Y10T29/49901 , Y10T29/53174 , Y10T29/53191 , Y10T29/53974
摘要: An assembly tool apparatus includes a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, a jig having an assembly surface operative to move from a first orientation relative to the axis to a second orientation relative to the axis, a first tool tip operative to engage with and be positioned by the manipulator, and a second tool tip operative to engage with and be positioned by the manipulator.
摘要翻译: 装配工具装置包括具有由平面限定的运动范围和基本上垂直于该平面的轴线的运动范围的操纵器,具有可相对于轴线从第一方向相对于轴线移动到第二取向的组装表面的夹具 所述轴线,操作成与所述操纵器接合并由所述操纵器定位的第一工具尖端以及与所述操纵器接合并由所述操纵器定位的第二工具尖端。
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公开(公告)号:US08546269B2
公开(公告)日:2013-10-01
申请号:US12417936
申请日:2009-04-03
申请人: Tymon Barwicz , Guy Cohen , Lidija Sekaric , Jeffrey Sleight
发明人: Tymon Barwicz , Guy Cohen , Lidija Sekaric , Jeffrey Sleight
IPC分类号: H01L21/302 , H01L21/461 , H01L29/06
CPC分类号: H01L21/02238 , B82Y10/00 , B82Y30/00 , H01L21/02255 , H01L21/30604 , H01L29/0665 , H01L29/0676 , H01L29/42392 , H01L29/775 , H01L29/78696
摘要: Techniques for fabricating nanowire-based devices are provided. In one aspect, a method for fabricating a semiconductor device is provided comprising the following steps. A wafer is provided having a silicon-on-insulator (SOI) layer over a buried oxide (BOX) layer. Nanowires and pads are etched into the SOI layer to form a ladder-like structure wherein the pads are attached at opposite ends of the nanowires. The BOX layer is undercut beneath the nanowires. The nanowires and pads are contacted with an oxidizing gas to oxidize the silicon in the nanowires and pads under conditions that produce a ratio of a silicon consumption rate by oxidation on the nanowires to a silicon consumption rate by oxidation on the pads of from about 0.75 to about 1.25. An aspect ratio of width to thickness among all of the nanowires may be unified prior to contacting the nanowires and pads with the oxidizing gas.
摘要翻译: 提供了制造基于纳米线的器件的技术。 一方面,提供一种制造半导体器件的方法,包括以下步骤。 提供了在掩埋氧化物(BOX)层上方具有绝缘体上硅(SOI)层的晶片。 将纳米线和焊盘蚀刻到SOI层中以形成阶梯状结构,其中焊盘附着在纳米线的相对端。 BOX层在纳米线下面被切下。 纳米线和焊盘与氧化气体接触,以在通过氧化在纳米线上产生硅消耗速率与硅消耗速率之比的条件下,在纳米线和焊盘中氧化硅,焊盘上的氧化从约0.75降至 约1.25。 在使纳米线和焊盘与氧化气体接触之前,可以统一所有纳米线中的宽度与厚度的纵横比。
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公开(公告)号:US08534927B1
公开(公告)日:2013-09-17
申请号:US13428277
申请日:2012-03-23
申请人: Tymon Barwicz , Hidetoshi Numata , Yoichi Taira
发明人: Tymon Barwicz , Hidetoshi Numata , Yoichi Taira
IPC分类号: G02B6/38
CPC分类号: G02B6/305 , G02B6/3885 , G02B2006/12173 , G02B2006/12176 , G02B2006/1219
摘要: An interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion of a wafer, and a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule.
摘要翻译: 接口装置包括柔性基板部分,布置在基板部分上的柔性包层部分,布置在包括基本上光学透明材料的包层部分上的柔性单模波导部分,可操作以接合晶片的一部分的第一接合特征 以及与柔性基板部分的第一远端接合的连接器部分,该连接器部分可操作以接合光纤套圈的一部分。
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公开(公告)号:US20120280203A1
公开(公告)日:2012-11-08
申请号:US13099827
申请日:2011-05-03
申请人: Tymon Barwicz
发明人: Tymon Barwicz
IPC分类号: H01L31/0352 , B82Y20/00
CPC分类号: G01J1/42
摘要: A transparent photodetector. The transparent photodetector includes a substrate; a waveguide on the substrate; a displaceable structure that can be displaced with respect to the substrate, the displaceable structure in proximity to the waveguide; and a silicon nanowire array suspended with respect to the substrate and mechanically linked to the displaceable structure, the silicon nanowire array comprising a plurality of silicon nanowires having piezoresistance. In operation, a light source propagating through the waveguide results in an optical force on the displaceable structure which further results in a strain on the nanowires to cause,a change in electrical resistance of the nanowires. The substrate may be a semiconductor on insulator substrate.
摘要翻译: 透明光电探测器。 透明光电检测器包括基板; 衬底上的波导; 可移位的结构,其可相对于衬底移位,靠近波导的位移结构; 以及相对于衬底悬挂并机械地连接到可位移结构的硅纳米线阵列,所述硅纳米线阵列包括具有压阻的多个硅纳米线。 在操作中,通过波导传播的光源导致可移位结构上的光学力,这进一步导致纳米线上的应变导致纳米线的电阻的变化。 衬底可以是绝缘体上半导体衬底上的半导体。
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公开(公告)号:US08068706B2
公开(公告)日:2011-11-29
申请号:US12905461
申请日:2010-10-15
申请人: Milos Popovic , Tymon Barwicz
发明人: Milos Popovic , Tymon Barwicz
CPC分类号: G02B6/1223 , G02B6/107 , G02B6/12007 , G02F1/0147 , G02F1/3133 , G02F2001/212 , G02F2201/063 , G02F2201/125 , G02F2203/15 , G02F2203/585 , H04J14/021 , H04Q2213/1301
摘要: An optical waveguide having a core region with a substantially rectangular cross-section with a selected aspect ratio of width to height. Embodiments include devices incorporating the optical waveguide and methods for using the optical waveguide.
摘要翻译: 一种光波导,其具有具有基本上矩形横截面的芯区域,具有选定的宽度与高度的纵横比。 实施例包括结合光波导的器件和使用光波导的方法。
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