公开(公告)号：US11134159B2

公开(公告)日：2021-09-28

申请号：US16442716

申请日：2019-06-17

申请人： Yoichi Kubota ,  Yusuke Taneda ,  Kohei Shimbo

发明人： Yoichi Kubota ,  Yusuke Taneda ,  Kohei Shimbo

IPC分类号： G01J3/50 ,  G01J3/28 ,  H04N1/00 ,  G01J3/10 ,  G01J3/02 ,  G01J3/52 ,  G01J3/24

摘要： A spectral characteristic acquisition device according to one aspect of the disclosed technique includes: a color data acquirer comprising a plurality of spectral sensors receiving light reflected from an object irradiated with light and acquiring color data of the object; circuitry configured to estimate a spectral characteristic of the object on a basis of the color data and calibrate the spectral characteristic calculator on a basis of the color data obtained from a calibration color mark having a color mark of a known spectral characteristic; a first conveyer configured to convey the object in a predetermined conveyance direction and conveying the color data acquirer in a direction intersecting the predetermined conveyance direction; and a second conveyer configured to convey the calibration color mark in the predetermined conveyance direction.

公开(公告)号：US08964176B2

公开(公告)日：2015-02-24

申请号：US13785436

申请日：2013-03-05

申请人： Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota ,  Manabu Seo

发明人： Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota ,  Manabu Seo

IPC分类号： G01J3/28 ,  G01J3/40 ,  G01J3/42 ,  G01J3/02 ,  G01J3/18 ,  G01J3/50 ,  G03G15/00

CPC分类号： G01J3/42 ,  G01J3/0208 ,  G01J3/0229 ,  G01J3/024 ,  G01J3/0262 ,  G01J3/0297 ,  G01J3/18 ,  G01J3/24 ,  G01J3/2823 ,  G01J3/50 ,  G01J2003/503 ,  G03G15/00 ,  G03G15/5062

摘要： A spectrometer includes a light source to project a light beam to a target object, an optical element including a plurality of apertures through which the light beam reflected by the target object transmits, a diffraction element to form diffracted images from a plurality of light beams having transmitted through the optical element, and a light receiving element to receive the diffracted images formed by the diffraction element and including an optical shield to block a diffracted image other than a certain-order diffracted image.

摘要翻译： 光谱仪包括将光束投射到目标物体的光源，包括由目标物体反射的光束透过的多个孔的光学元件，衍射元件，以从具有多个光束的多个光束形成衍射图像，所述多个光束具有 通过光学元件透射的光接收元件和用于接收由衍射元件形成的衍射图像的光接收元件，并且包括光学屏蔽件以阻挡除一定级衍射图像之外的衍射图像。

公开(公告)号：US08559005B2

公开(公告)日：2013-10-15

申请号：US13737157

申请日：2013-01-09

申请人： Kohei Shimbo ,  Naohiro Kamijo ,  Manabu Seo ,  Yoichi Kubota

发明人： Kohei Shimbo ,  Naohiro Kamijo ,  Manabu Seo ,  Yoichi Kubota

IPC分类号： G01J3/28

CPC分类号： G01J3/0208 ,  G01J3/0205 ,  G01J3/0229 ,  G01J3/0248 ,  G01J3/1804 ,  G01J3/2803

摘要： A spectral characteristic measuring device includes an illuminating unit that illuminates a medium; a light dividing unit that divides reflection light from the medium into reflection light beams; a first imaging unit that includes first lenses and second lenses arranged alternately in a staggered pattern and focuses the respective reflection light beams; a diffraction unit that includes a first diffraction region and a second diffraction region and diffracts the focused reflection light beams to form diffraction images; and a light receiving unit that includes plural pixels for receiving the diffraction images. The reflection light beams focused by the first lenses enter the first diffraction region to form first diffraction images, the reflection light beams focused by the second lenses enter the second diffraction region to form second diffraction images, and the first and second diffraction images are arranged alternately on the light receiving unit in a pixel arrangement direction.

摘要翻译： 光谱特性测量装置包括照亮介质的照明单元; 将来自介质的反射光分成反射光束的光分割单元; 第一成像单元，其包括以交错图案交替布置的第一透镜和第二透镜，并且对各个反射光束进行聚焦; 衍射单元，其包括第一衍射区域和第二衍射区域，并衍射聚焦反射光束以形成衍射图像; 以及包括用于接收衍射图像的多个像素的光接收单元。 由第一透镜聚焦的反射光束进入第一衍射区域以形成第一衍射图像，由第二透镜聚焦的反射光束进入第二衍射区域以形成第二衍射图像，并且第一和第二衍射图像交替布置 在像素排列方向上的光接收单元上。

公开(公告)号：US20100120187A1

公开(公告)日：2010-05-13

申请号：US12451641

申请日：2008-05-22

申请人： Takashi Taniguchi ,  Kenji Watanabe ,  Yoichi Kubota ,  Osamu Tsuda

发明人： Takashi Taniguchi ,  Kenji Watanabe ,  Yoichi Kubota ,  Osamu Tsuda

IPC分类号： H01L21/20

CPC分类号： C30B9/10 ,  C01B21/064 ,  C01P2004/02 ,  C01P2004/03 ,  C30B19/02 ,  C30B29/38

摘要： The invention has for its object to provide a process of synthesizing high-purity hBN crystal bodies on a robust substrate even under normal pressure.The inventive process of producing hexagonal boron nitride crystal bodies is characterized by comprising a preparation step of preparing a mixture of a boron nitride raw material and a metal solvent comprising a transition metal, a contact step of bringing a sapphire substrate in contact with the mixture, a heating step of heating the mixture, and a recrystallization step of recrystallizing at normal pressure a melt obtained in the heating step. It is also characterized by using as the metal solvent a transition metal selected from the group consisting of Fe, Ni, Co, and a combination thereof, and at least one substance selected from the group consisting of Cr, TiN and V without recourse to any sapphire substrate.

摘要翻译： 本发明的目的是提供即使在常压下也能在坚固的基底上合成高纯度hBN晶体的方法。 制造六方氮化硼晶体的本发明方法的特征在于包括制备氮化硼原料和包含过渡金属的金属溶剂的混合物的制备步骤，使蓝宝石衬底与该混合物接触的接触步骤， 加热混合物的加热步骤和在常压下重结晶在加热步骤中获得的熔体的再结晶步骤。 还特征在于使用选自Fe，Ni，Co及其组合的过渡金属作为金属溶剂，以及选自Cr，TiN和V中的至少一种物质，而不用任何 蓝宝石衬底。

公开(公告)号：US20070077677A1

公开(公告)日：2007-04-05

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖着微电子元件的第一面的柔性基板，以及多个导电柱，其从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US4979826A

公开(公告)日：1990-12-25

申请号：US380038

申请日：1989-07-14

申请人： Koh Ishizuka ,  Tetsuharu Nishimura ,  Masaaki Tsukiji ,  Satoshi Ishii ,  Yoichi Kubota

发明人： Koh Ishizuka ,  Tetsuharu Nishimura ,  Masaaki Tsukiji ,  Satoshi Ishii ,  Yoichi Kubota

IPC分类号： G01D5/38

CPC分类号： G01D5/38

摘要： A displacement measuring apparatus has an illuminating device for illuminating a diffraction grating with a radiation beam, an optical system for directing first and second diffracted beams created by the diffraction grating with to the diffraction grating, the optical system being provided so that the first and second diffracted beams have a common optical path and travel in opposite directions along the optical path. In addition, a device receives an interference beam formed by first and second re-diffracted beams created by the first and second diffracted beams being diffracted by the diffraction grating, and outputs a signal conforming to the displacement of the diffraction grating relative to the radiation beam.

摘要翻译： 位移测量装置具有用于用辐射束照射衍射光栅的照明装置，用于将由衍射光栅产生的第一和第二衍射光束引导到衍射光栅的光学系统，所述光学系统被设置成使得第一和第二 衍射光束具有公共光路并沿着光路在相反方向上行进。 此外，设备接收由由衍射光栅衍射的第一和第二衍射光束产生的第一和第二重衍射光束形成的干涉光束，并且输出符合衍射光栅相对于辐射束的位移的信号 。

公开(公告)号：US08908176B2

公开(公告)日：2014-12-09

申请号：US13741513

申请日：2013-01-15

申请人： Yoichi Kubota ,  Naoko Shigemori ,  Naohiro Kamijo ,  Kohei Shimbo ,  Manabu Seo

发明人： Yoichi Kubota ,  Toshihiro Shigemori ,  Naohiro Kamijo ,  Kohei Shimbo ,  Manabu Seo

IPC分类号： G01J3/28 ,  G01J3/46 ,  H03F1/26 ,  H04B15/00 ,  G01J3/42 ,  G01J3/50 ,  G01J3/02

CPC分类号： G01J3/42 ,  G01J3/027 ,  G01J3/463 ,  G01J3/501 ,  G01J2003/466

摘要： A spectral characteristic obtaining apparatus includes a detection unit detecting light quantities in plural wavelength bands from a measurement target, a storage unit storing pre-obtained spectral characteristics of the measurement target, a calculation unit calculating a primary transformation matrix from the light quantities and the pre-obtained spectral characteristics of at least one reference sample and a secondary transformation matrix from one of the pre-obtained spectral characteristics corresponding to a primary wavelength band and another one of the pre-obtained spectral characteristics corresponding to a secondary wavelength band, an estimation unit estimating the spectral characteristics of the measurement target by performing a primary estimation on the light quantities in the plural wavelength bands by using the primary transformation matrix, performing a secondary estimation on a result of the primary estimation by using the secondary transformation matrix, and compositing a result of the secondary estimation with the result of the primary estimation.

摘要翻译： 光谱特征获取装置包括检测单元，用于检测来自测量对象的多个波长带中的光量;存储单元，存储预先获得的测量对象的光谱特性;计算单元，从光量计算初级变换矩阵; 从对应于主波长带的预先获得的光谱特性之一和预先获得的对应于次波长带的光谱特性的另一个获得至少一个参考样本和次要变换矩阵的光谱特征，估计单元 通过使用主变换矩阵对多个波长带中的光量进行一次估计，通过使用二次变换矩阵对一次估计的结果进行二次估计，估计测量对象的光谱特性，以及合成 进行二次估计的结果，并进行初步估计。

公开(公告)号：US20110222056A1

公开(公告)日：2011-09-15

申请号：US13037941

申请日：2011-03-01

申请人： Manabu Seo ,  Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota

发明人： Manabu Seo ,  Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota

IPC分类号： G01J3/40

CPC分类号： G01J3/02 ,  G01J3/0205 ,  G01J3/0229 ,  G01J3/2803 ,  G01J3/502

摘要： A spectroscopic characteristics acquisition unit includes a light emitting unit to illuminate a measurement target; a lens array including lenses to receive reflected light reflected from the measurement target; a light blocking member having a pinhole array including openings; a focusing unit to focus light coming from the pinhole array; a diffraction unit to diffract the light to different directions depending on wavelength of light received by the focusing unit; and a light receiving unit to receive the reflected light diffracted by the diffraction unit. The light receiving unit includes a spectroscopic sensor array having spectroscopy sensors including pixels. Each of the lenses constituting the lens array corresponds to one of the openings of the pinhole array. The numerical aperture NA of the lens in the arrangement direction in the lens array satisfies the formula NA>sin(θmax) with respect to the maximum angle of view θmax of the focusing unit.

摘要翻译： 光谱特性获取单元包括照亮测量对象的发光单元; 透镜阵列，包括用于接收从测量对象反射的反射光的透镜; 具有包括开口的针孔阵列的遮光构件; 聚焦单元，用于聚焦来自针孔阵列的光; 衍射单元，用于根据由聚焦单元接收的光的波长将光衍射到不同的方向; 以及光接收单元，用于接收由衍射单元衍射的反射光。 光接收单元包括具有包括像素的光谱传感器的光谱传感器阵列。 构成透镜阵列的每个透镜对应于针孔阵列的一个开口。 透镜阵列中的透镜在排列方向上的数值孔径NA相对于最大视角和焦距满足公式NA> sin（＆amp; max; max）;聚焦单元的最大值。

公开(公告)号：US07754537B2

公开(公告)日：2010-07-13

申请号：US10786825

申请日：2004-02-25

申请人： Belgacem Haba ,  Yoichi Kubota

发明人： Belgacem Haba ,  Yoichi Kubota

IPC分类号： H01L21/00

CPC分类号： B81B7/007 ,  B81C2203/0109 ,  H01L2224/48091 ,  H03H9/058 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H01L2924/00014

摘要： A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and the leads are aligned with channels or other depressions between the caps. The leads are connected to contacts on the wafer, and the wafer is severed to form individual units, each including terminals supported by the cap and connected to the contacts by the leads. The resulting units can be handled and processed in the same manner as ordinary chips or chip assemblies.

摘要翻译： 包括诸如表面声波（SAW）芯片的封盖芯片的晶片或晶片的一部分通过在其上施加端子承载元件例如具有端子和引线的电介质元件或引线框架而设置有端子，使得 端子承载元件覆盖盖，并且引线与盖之间的通道或其他凹陷对准。 引线连接到晶片上的触点，并且切割晶片以形成单独的单元，每个单元包括由盖支撑并由引线连接到触点的端子。 所得到的单元可以以与普通芯片或芯片组件相同的方式进行处理和处理。

公开(公告)号：US07462932B2

公开(公告)日：2008-12-09

申请号：US11642354

申请日：2006-12-20

申请人： Belgacem Haba ,  Yoichi Kubota

发明人： Belgacem Haba ,  Yoichi Kubota

IPC分类号： H01L23/12

CPC分类号： B81B7/007 ,  B81C2203/0109 ,  H01L2224/48091 ,  H03H9/058 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H01L2924/00014

摘要： A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and the leads are aligned with channels or other depressions between the caps. The leads are connected to contacts on the wafer, and the wafer is severed to form individual units, each including terminals supported by the cap and connected to the contacts by the leads. The resulting units can be handled and processed in the same manner as ordinary chips or chip assemblies.

摘要翻译： 包括诸如表面声波（SAW）芯片的封盖芯片的晶片或晶片的一部分通过在其上施加端子承载元件例如具有端子和引线的电介质元件或引线框架而设置有端子，使得 端子承载元件覆盖盖，并且引线与盖之间的通道或其他凹陷对准。 引线连接到晶片上的触点，并且切割晶片以形成单独的单元，每个单元包括由盖支撑并由引线连接到触点的端子。 所得到的单元可以以与普通芯片或芯片组件相同的方式处理和处理。