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    Electrical connector with pin retention feature
    401.
    发明授权
    Electrical connector with pin retention feature 失效
    具有引脚保持功能的电连接器

    公开(公告)号：US4847588A

    公开(公告)日：1989-07-11

    申请号：US53550

    申请日：1987-05-26

    Applicant: Ray C. Doutrich

    Inventor： Ray C. Doutrich

    IPC: H01R12/58 ,  H05K3/30

    CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10878

    Abstract: An electrical connector comprising a header with a plurality of terminal pins having means for retaining the header in position during soldering to a printed circuit board. Retention is accomplished by an offset formed as a crimp at the insertion end of at least one pair of terminals. The crimps exert opposite normal forces against one surface of their respective holes to retain the header during soldering.

    Abstract translation: 一种电连接器，包括具有多个端子销的集管，所述端头具有用于在焊接到印刷电路板期间将集管保持在适当位置的装置。 通过在至少一对端子的插入端处形成为卷曲的偏移来实现保持。 卷曲对相应孔的一个表面施加相反的法向力，以在焊接期间保持接头。

    Low profile opto-device assembly with specific optoelectronic lead mount
    402.
    发明授权
    Low profile opto-device assembly with specific optoelectronic lead mount 失效
    具有特定光电导线安装座的低调光器件组件

    公开(公告)号：US4818859A

    公开(公告)日：1989-04-04

    申请号：US57065

    申请日：1987-06-01

    Applicant: Stewart E. Hough

    Inventor： Stewart E. Hough

    IPC: G06F3/042 ,  G01V8/20 ,  G06F3/033 ,  G06F3/041 ,  G06F3/048 ,  H05K1/18 ,  G01V9/04

    CPC classification number: G06F3/0421 ,  G01V8/20 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10757

    Abstract: A low profile opto-device panel assembly suitable for use in an input detection apparatus used as an input device in conjunction with a visual display is disclosed. Arrays of light emitting devices and light detecting devices are juxtaposed along the internal edge of a peripheral frame printed circuit board to reduce the overall height of the panel assembly. Alignment housings surrounding each of the arrays of opto-devices are attached to the printed circuit board and extend inwardly of the sides of the peripheral frame printed circuit board. The opto-devices disposed in the alignment housings along the internal edge of the printed circuit boards are mechanically and electrically interconnected to the printed circuit board by bent leads which extend along the upper surface of the printed circuit board and into conventional printed circuit board holes.

    Abstract translation: 公开了一种适用于与视觉显示器一起用作输入设备的输入检测设备中的低调光学设备面板组件。 发光器件和光检测器件的阵列沿周边框架印刷电路板的内边缘并置，以减小面板组件的整体高度。 围绕每个光器件阵列的对准壳体附接到印刷电路板并且延伸到外围框架印刷电路板的侧面的内侧。 沿着印刷电路板的内边缘设置在对准壳体中的光器件通过沿着印刷电路板的上表面延伸并弯成常规印刷电路板孔的弯曲引线机械地和电气地互连到印刷电路板。

    Electrical terminal and method of securing same in circuit substrate thru-hole
    404.
    发明授权
    Electrical terminal and method of securing same in circuit substrate thru-hole 失效
    电气端子及其在电路基板通孔中的固定方法

    公开(公告)号：US4541034A

    公开(公告)日：1985-09-10

    申请号：US604297

    申请日：1984-04-26

    Applicant: William J. Fanning

    Inventor： William J. Fanning

    IPC: H05K3/30 ,  H01R9/00 ,  H05K1/00

    CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/10878

    Abstract: A thru-hole insertable terminal (10, 50, 60) includes an upper shank portion (12, 52, 66) preferably adapted for soldered securement to an end electrode (24) of a component (20), such as a capacitor. A lower shank portion (14, 54, 68) is dimensioned and adapted for minimal initial contact insertion into, and the temporary securement thereafter within, an oversized thru-hole (26, 58, 62) of a supporting substrate, such as a circuit board (28, 59, 64). At least one upwardly extending free-ended tab (32, 56, 72, 74) is formed in the lower terminal shank portion (14, 54, 68), and is oriented in the major plane thereof until after the insertion thereof within an associated substrate-formed thru-hole (26, 58, 62). Stop means (14b, 14c, 54b, 54c, 68b, 68c) also formed in the lower terminal shank portion is adapted to position the upper free end of the tab at an elevation preferably below the upper open end of a confining thru-hole. The tab (32, 56, 72, 74) is also dimensioned such that, when thusly positioned, the lower integral end thereof extends at least to the lower open end of the thru-hole. This results in the upper free end of the tab being pivoted against the sidewall of the confining thru-hole in response to a then downwardly protruding end region (14d, 54d, 68d) of the lower terminal shank portion being clinched against the underside of the supporting substrate (28, 59, 64). The thusly pivoted tab advantageously not only facilitates the temporary securement of the terminal within the associated thru-hole, but the establishment thereafter of a reliable, permanent soldered connection therebetween.

    Abstract translation: 通孔可插入端子（10,50,60）包括优选地适于焊接固定到诸如电容器的部件（20）的端电极（24）的上部分部分（12,52,66）。 尺寸适合于下部柄部分（14,54,68），以便最小的初始接触插入到其后的临时固定中，在支撑衬底（例如电路）的过大通孔（26,58,62）内 （28,59,64）。 至少一个向上延伸的自由端突片（32,56,72,74）形成在下端子柄部分（14,54,68）中，并且在其主平面中定向，直到其插入相关联的 基板形成的通孔（26,58,62）。 还形成在下端子柄部分中的止动装置（14b，14c，54b，54c，68b，68c）适于将突出部的上自由端定位在优选在限制通孔的上开口端下方的高度处。 突片（32,56,72,74）的尺寸也被设计成使得当这样定位时，其下部整体端至少延伸到通孔的下开口端。 这导致突片的上部自由端响应于下端子柄部分的下一个向下突出的端部区域（14d，54d，68d）被抵靠着封闭通孔的侧壁 支撑衬底（28,59,64）。 有利的是，枢轴接头不仅有利于将端子临时固定在相关的通孔内，而且有利于在其间建立可靠的永久焊接连接。

    Method of laser soldering
    405.
    发明授权
    Method of laser soldering 失效
    激光焊接方法

    公开(公告)号：US4531044A

    公开(公告)日：1985-07-23

    申请号：US474650

    申请日：1983-01-24

    Applicant: Dale U. Chang

    Inventor： Dale U. Chang

    IPC: B23K1/005 ,  H05K1/03 ,  H05K3/34 ,  B23K15/00 ,  H01C1/14 ,  H01C1/144

    CPC classification number: H05K3/3421 ,  B23K1/0056 ,  B23K2201/40 ,  H05K1/0306 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

    Abstract: A method of soldering electrical lead strands (of a width at least 0.3 inch) to a printed electrical path is disclosed. The path is planted on an alumina ceramic substrate and a solder pad is attached to a portion of the path. A flat surface portion of each lead strand is forced into full interengagement with a pad, a CO.sub.2 defocused laser beam is directed onto the soldering assembly with the beam controlled to have a beam power of at least 100 watts, a beam spot diameter no less than the width of the lead strand and no greater than the width of the pad, and a beam on-time effective to exert a controlled thermal radius on the soldering assembly to reflow only a preselected portion of the pad and effect a solder joint between the pad and strand portion, the joint having a strength of at least 400 grams. The parameters of the beam power, beam spot diameter, and beam on-time are optimally correlated by the following equation: ##EQU1## where: C is the critical thermal radius, a is the Gaussian radius at 1/e.sup.2, ln is logarithm, Tm is the melting temperature of the solder minus the specimen temperature, P is the laser beam power in watts, A is the surface absorptivity of the solder at 10.6 microns, R is the terminal resistance per unit area of the system, tc is the critical time to bring the solder to the Tm temperature, c is the heat capacity of the system.

    Abstract translation: 公开了将电引线（宽度至少为0.3英寸）焊接到印刷电路上的方法。 将路径种植在氧化铝陶瓷基板上，并且将焊盘附接到路径的一部分。 每个引线的平坦表面部分被迫与焊盘完全相互接合，二氧化碳散焦的激光束被引导到焊接组件上，光束被控制为具有至少100瓦特的光束功率，光束点直径不小于 引线的宽度并且不大于焊盘的宽度，并且导通时间有效地在焊接组件上施加受控的热半径以仅回流焊盘的预选部分并且实现焊盘之间的焊接接头 和股线部分，该接头具有至少400克的强度。 光束功率，光束直径和光束导通时间的参数通过以下公式进行最佳相关：其中：C是临界热半径，a是1 / e2处的高斯半径，ln是对数， Tm是焊料的熔化温度减去样品温度，P是以瓦特为单位的激光束功率，A是焊料在10.6微米处的表面吸收率，R是系统每单位面积的端电阻，tc是临界值 时间使焊料达到Tm温度，c是系统的热容量。

    Printed circuit assembly and method for fabrication thereof
    407.
    发明授权
    Printed circuit assembly and method for fabrication thereof 失效
    印刷电路组件及其制造方法

    公开(公告)号：US3825877A

    公开(公告)日：1974-07-23

    申请号：US25833672

    申请日：1972-05-31

    Applicant: MATSUSHITA ELECTRIC IND CO LTD

    Inventor： OJIMA T ,  KOISO K ,  NAKANO T

    IPC: H01R12/71 ,  H01R43/20 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12 ,  H05K1/04

    CPC classification number: H05K7/06 ,  H01R43/205 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3468 ,  H05K7/12 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/1034 ,  H05K2201/10424 ,  H05K2201/10757

    Abstract: A printed circuit assembly is herein proposed which has a multiplicity of generally L-shaped external terminal elements each of which is connected at one end to a printed circuit on the printed base panel through a soldered joint and which is formed at the other with a plug portion which is to be inserted into a plug socket. The plug portion projects usually perpendicularly from the printed base panel and extends on the same side as the joints on the base panel. The joints on the base panel are therefore soldered in a single dip-soldering operation in which the plug portions of the external terminal elements are kept intact with the result that no changes in size and configuration are invited as a result of the dip-soldering operation. The external terminal elements are thus readily inserted into the plug socket and are prevented from being dislocated or deformed when the plug socket is connected to or disconnected from the group of the terminal elements. The assembly may further include retaining means for securely holding the terminal elements in position relative to the printed base panel.

    Abstract translation: 本文提出了一种印刷电路组件，其具有多个大致L形的外部端子元件，每个外部端子元件的一端通过焊接接头连接到印刷的基板上的印刷电路，并且在另一端形成有插头 要插入插座的部分。 插头部分通常垂直于印刷的基板突出并且在与基板上的接头相同的一侧上延伸。 因此，基板上的接头被焊接在单个浸焊操作中，其中外部端子元件的插头部分保持完整，结果是由于浸焊操作而不需要改变尺寸和构造 。 因此，外部端子元件容易地插入插头插座中，并且当插头插座与端子元件组连接或断开时，防止其脱位或变形。 组件还可以包括用于将端子元件相对于印刷的基板牢固地保持在适当位置的保持装置。

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