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431.
公开(公告)号:US20190341118A1
公开(公告)日:2019-11-07
申请号:US16414714
申请日:2019-05-16
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Vipin Tiwari , Nhan Do
Abstract: Numerous embodiments of a data refresh method and apparatus for use with a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. Various embodiments of a data drift detector suitable for detecting data drift in flash memory cells within the VMM array are disclosed.
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432.
公开(公告)号:US20190295647A1
公开(公告)日:2019-09-26
申请号:US16015020
申请日:2018-06-21
Applicant: Silicon Storage Technology, Inc.
Inventor: Vipin Tiwari , Hieu Van Tran , Nhan Do , Mark Reiten
IPC: G11C16/04 , H01L29/423 , H01L29/788 , H01L27/11521
Abstract: A memory device includes rows and columns of memory cells, word lines each connected to a memory cell row, bit lines each connected to a memory cell column, a word line driver connected to the word lines, a bit line driver connected to the bit lines, word line switches each disposed on one of the word lines for selectively connecting one memory cell row to the word line driver, and bit line switches each disposed on one of the bit lines for selectively connecting one memory cell column to the bit line driver. A controller controls the word line switches to connect only some of the rows of memory cells to the word line driver at a first point in time, and controls the bit line switches to connect only some of the columns of memory cells to the bit line driver at a second point in time.
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公开(公告)号:US20190286976A1
公开(公告)日:2019-09-19
申请号:US15991890
申请日:2018-05-29
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Stanley Hong , Anh Ly , Thuan Vu , Hien Pham , Kha Nguyen , Han TRan
Abstract: Numerous embodiments of decoders for use with a vector-by-matrix multiplication (VMM) array in an artificial neural network are disclosed. The decoders include bit line decoders, word line decoders, control gate decoders, source line decoders, and erase gate decoders. In certain embodiments, a high voltage version and a low voltage version of a decoder is used.
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公开(公告)号:US10381359B2
公开(公告)日:2019-08-13
申请号:US15701357
申请日:2017-09-11
Applicant: Silicon Storage Technology, Inc.
Inventor: Chien-Sheng Su , Jeng-Wei Yang , Feng Zhou
IPC: H01L27/11531 , H01L27/11524 , H01L29/423 , H01L29/66 , H01L29/788 , H01L27/11521
Abstract: A method of forming split gate non-volatile memory cells on the same chip as logic and high voltage devices having HKMG logic gates. The method includes forming the source and drain regions, floating gates, control gates, and the poly layer for the erase gates and word line gates in the memory area of the chip. A protective insulation layer is formed over the memory area, and an HKMG layer and poly layer are formed on the chip, removed from the memory area, and patterned in the logic areas of the chip to form the logic gates having varying amounts of underlying insulation.
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435.
公开(公告)号:US10381088B2
公开(公告)日:2019-08-13
申请号:US15905720
申请日:2018-02-26
Applicant: Silicon Storage Technology, Inc.
Inventor: Vipin Tiwari , Mark Reiten
IPC: G11C16/24 , H01L27/11521 , G06F7/58 , G11C16/28 , G11C16/04 , G11C16/22 , H01L29/423
Abstract: A memory device that generates a unique identifying number, and includes a plurality of memory cells and a controller. Each of the memory cells includes first and second regions formed in a semiconductor substrate, wherein a channel region of the substrate extends between the first and second regions, a floating gate disposed over and insulated from a first portion of the channel region, and a select gate disposed over and insulated from a second portion of the channel region. The controller is configured to apply one or more positive voltages to the first regions of the memory cells while the memory cells are in a subthreshold state for generating leakage current through each of the channel regions, measure the leakage currents, and generate a number based on the measured leakage currents.
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公开(公告)号:US20190214396A1
公开(公告)日:2019-07-11
申请号:US16160812
申请日:2018-10-15
Applicant: Silicon Storage Technology, Inc.
Inventor: Chunming Wang , Andy Liu , Xian Liu , Leo Xing , Melvin Diao , Nhan Do
IPC: H01L27/11521
Abstract: A twin bit memory cell includes first and second spaced apart floating gates formed in first and second trenches in the upper surface of a semiconductor substrate. An erase gate, or a pair of erase gates, are disposed over and insulated from the floating gates, respectively. A word line gate is disposed over and insulated from a portion of the upper surface that is between the first and second trenches. A first source region is formed in the substrate under the first trench, and a second source region formed in the substrate under the second trench. A continuous channel region of the substrate extends from the first source region, along a side wall of the first trench, along the portion of the upper surface that is between the first and second trenches, along a side wall of the second trench, and to the second source region.
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437.
公开(公告)号:US20190189214A1
公开(公告)日:2019-06-20
申请号:US15849268
申请日:2017-12-20
Applicant: Silicon Storage Technology, Inc.
Inventor: Vipin Tiwari , Nhan Do , Hieu Van Tran
IPC: G11C16/10 , G11C11/56 , H01L29/788 , H01L29/423 , G11C16/04
CPC classification number: G11C16/10 , G11C11/5628 , G11C16/0425 , G11C16/0483 , G11C2211/5648 , H01L29/42328 , H01L29/7885
Abstract: An improved programming technique for non-volatile memory cell arrays, in which memory cells to be programmed with higher programming values are programmed first, and memory cells to be programmed with lower programming values are programmed second. The technique reduces or eliminates the number of previously programmed cells from being adversely incrementally programmed by an adjacent cell being programmed to higher program levels, and reduces the magnitude of adverse incremental programming for most of the memory cells, which is caused by floating gate to floating gate coupling. The memory device includes an array of non-volatile memory cells and a controller configured to identify programming values associated with incoming data, and perform a programming operation in which the incoming data is programmed into at least some of the non-volatile memory cells in a timing order of descending value of the programming values.
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公开(公告)号:US20190172529A1
公开(公告)日:2019-06-06
申请号:US16273337
申请日:2019-02-12
Applicant: Silicon Storage Technology, Inc.
Inventor: Nhan Do , XIAN LIU , VIPIN TIWARI , HIEU VAN TRAN
IPC: G11C11/419 , H01L29/788 , H01L29/66 , G11C16/14 , G11C16/04 , H01L29/423 , H01L21/28 , H01L27/11521
Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.
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公开(公告)号:US20190139602A1
公开(公告)日:2019-05-09
申请号:US16148304
申请日:2018-10-01
Applicant: Silicon Storage Technology, Inc.
Inventor: Vipin Tiwari , Nhan Do , Hieu Van Tran
Abstract: A method of reading a memory device having a plurality of memory cells by, and a device configured for, reading a first memory cell of the plurality of memory cells to generate a first read current, reading a second memory cell of the plurality of memory cells to generate a second read current, applying a first offset value to the second read current, and then combining the first and second read currents to form a third read current, and then determining a program state using the third read current. Alternately, a first voltage is generated from the first read current, a second voltage is generated from the second read current, whereby the offset value is applied to the second voltage, wherein the first and second voltages are combined to form a third voltage, and then the program state is determined using the third voltage.
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公开(公告)号:US10283206B2
公开(公告)日:2019-05-07
申请号:US15792590
申请日:2017-10-24
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen , Vipin Tiwari
Abstract: Improved flash memory sensing circuits are disclosed. In one embodiment, a sensing circuit comprises a memory data read block, a memory reference block, a differential amplifier, and a precharge circuit. The precharge circuit compensates for parasitic capacitance between a bit line coupled to a selected memory cell and adjacent bit lines.
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