公开(公告)号：US20210257023A1

公开(公告)日：2021-08-19

申请号：US17199243

申请日：2021-03-11

Applicant: Silicon Storage Technology, Inc.

Inventor： HIEU VAN TRAN ,  ANH LY ,  THUAN VU ,  STANLEY HONG ,  FENG ZHOU ,  XIAN LIU ,  NHAN DO

IPC: G11C13/00 ,  H01L45/00 ,  H01L27/24 ,  G11C7/06

Abstract: Numerous embodiments of circuitry for a set-while-verify operation and a reset-while verify operation for resistive random access memory cells are disclosed. In one embodiment, a set-while-verify circuit for performing a set operation on a selected RRAM cell in the array applies a combination of voltages or current to a bit line, word line, and source line associated with the selected RRAM cell and stops said applying when the set operation is complete. In another embodiment, a reset-while-verify circuit for performing a reset operation on a selected RRAM cell in the array applies a combination of voltages or current to a bit line, word line, and source line associated with the selected RRAM cell and stops said applying when the reset operation is complete.

公开(公告)号：US20220293756A1

公开(公告)日：2022-09-15

申请号：US17346524

申请日：2021-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Leo Xing ,  CHUNMING WANG ,  XIAN LIU ,  NHAN DO ,  GUO XIANG SONG

IPC: H01L29/423 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming a memory device that includes forming a first insulation layer, a first conductive layer, and a second insulation layer on a semiconductor substrate, forming a trench in the second insulation layer to expose the upper surface of the first conductive layer, performing an oxidation process and a sloped etch process to reshape the upper surface to a concave shape, forming a third insulation layer on the reshaped upper surface, forming a conductive spacer on the third insulation layer, removing portions of the first conductive layer leaving a floating gate under the conductive spacer with the reshaped upper surface terminating at a side surface at a sharp edge, and forming a word line gate laterally adjacent to and insulated from the floating gate. The conductive spacer includes a lower surface that faces and matches the shape of the reshaped upper surface.

公开(公告)号：US20170098654A1

公开(公告)日：2017-04-06

申请号：US15225393

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： FENG ZHOU ,  XIAN LIU ,  JENG-WEI YANG ,  CHIEN-SHENG SU ,  NHAN DO

IPC: H01L27/115 ,  H01L29/66 ,  H01L29/423 ,  H01L29/788 ,  H01L29/49

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L21/8238 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A method of forming a pair of memory cells that includes forming a polysilicon layer over and insulated from a semiconductor substrate, forming a pair of conductive control gates over and insulated from the polysilicon layer, forming first and second insulation layers extending along inner and outer side surfaces of the control gates, removing portions of the polysilicon layer adjacent the outer side surfaces of the control gates, forming an HKMG layer on the structure and removing portions thereof between the control gates, removing a portion of the polysilicon layer adjacent the inner side surfaces of the control gates, forming a source region in the substrate adjacent the inner side surfaces of the control gates, forming a conductive erase gate over and insulated from the source region, forming conductive word line gates laterally adjacent to the control gates, and forming drain regions in the substrate adjacent the word line gates.

公开(公告)号：US20220101920A1

公开(公告)日：2022-03-31

申请号：US17152696

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： CHUNMING WANG ,  XIAN LIU ,  GUO XIANG SONG ,  LEO XING ,  NHAN DO

IPC: G11C16/04 ,  G11C16/16 ,  H01L29/423 ,  H01L27/11521 ,  H01L27/11556

Abstract: A memory device includes a semiconductor substrate, first and second regions in the substrate having a conductivity type different than that of the substrate, with a channel region in the substrate extending between the first and second regions. The channel region is continuous between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region. A second floating gate is disposed over and insulated from a second portion of the channel region. A first coupling gate is disposed over and insulated from the first floating gate. A second coupling gate is disposed over and insulated from the second floating gate. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. An erase gate is disposed over and insulated from the word line gate.

公开(公告)号：US20170316823A1

公开(公告)日：2017-11-02

申请号：US15404087

申请日：2017-01-11

Applicant: Silicon Storage Technology, Inc. ,  Agency For Science, Technology And Research

Inventor： Feng Zhou ,  XIAN LIU ,  NHAN DO ,  HIEU VAN TRAN ,  HUNG QUOC NGUYEN ,  MARK REITEN ,  ZHIXIAN CHEN ,  WANG XINPENG ,  GUO-QIANG LO

IPC: G11C13/00 ,  H01L45/00

CPC classification number: G11C13/0007 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/146 ,  H01L45/16

Abstract: A memory device and method comprising a metal oxide material disposed between and in electrical contact with first and second conductive electrodes, and a voltage source configured to apply a plurality of voltage pulses spaced apart in time across the first and second electrodes. For each one of the voltage pulses, an amplitude of the voltage increases during the voltage pulse.

公开(公告)号：US20220139940A1

公开(公告)日：2022-05-05

申请号：US17152441

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  CHUNMING WANG ,  LEO XING ,  XIAN LIU ,  NHAN DO

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/423 ,  H01L29/78 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming memory cells, high voltage devices and logic devices on fins of a semiconductor substrate's upper surface, and the resulting memory device formed thereby. The memory cells are formed on a pair of the fins, where the floating gate is disposed between the pair of fins, the word line gate wraps around the pair of fins, the control gate is disposed over the floating gate, and the erase gate is disposed over the pair of fins and partially over the floating gate. The high voltage devices include HV gates that wrap around respective fins, and the logic devices include logic gates that are metal and wrap around respective fins.

公开(公告)号：US20200013786A1

公开(公告)日：2020-01-09

申请号：US16028244

申请日：2018-07-05

Applicant: Silicon Storage Technology, Inc.

Inventor： SERGUEI JOURBA ,  CATHERINE DECOBERT ,  FENG ZHOU ,  JINHO KIM ,  XIAN LIU ,  NHAN DO

IPC: H01L27/11524 ,  H01L29/66 ,  H01L29/423 ,  H01L29/78 ,  H01L29/788 ,  H01L21/266 ,  H01L21/768 ,  H01L21/8234 ,  H01L21/8238 ,  H01L27/088

Abstract: A memory device including a plurality of upwardly extending fins in a semiconductor substrate upper surface. A memory cell is formed on a first of the fins, and includes spaced apart source and drain regions in the first fin, with a channel region extending along top and opposing side surfaces of the first fin between the source and drain regions. A floating gate extends along a first portion of the channel region. A select gate extends along a second portion of the channel region. A control gate extends along the floating gate. An erase gate extends along the source region. A second of the fins has a length that extends in a first direction which is perpendicular to a second direction in which a length of the first fin extends. The source region is formed in the first fin at an intersection of the first and second fins.

公开(公告)号：US20180277174A1

公开(公告)日：2018-09-27

申请号：US15467174

申请日：2017-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： HIEU VAN TRAN ,  XIAN LIU ,  NHAN DO

IPC: G11C7/10 ,  G11C8/12 ,  H01L21/28 ,  H01L27/11521 ,  H01L29/423

CPC classification number: G11C7/1006 ,  G11C8/08 ,  G11C8/10 ,  G11C8/12 ,  G11C16/0425 ,  G11C16/08 ,  G11C29/024 ,  G11C2029/1202 ,  G11C2029/1204 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A system and method are disclosed for performing address fault detection in a flash memory system. An address fault detection array is used to confirm that an activated word line or bit line is the word line or bit line that was actually intended to be activated based upon the received address, which will identify a type of fault where the wrong word line or bit line is activated. The address fault detection array also is used to indicate whether more than one word line or bit line was activated, which will identify a type of fault where two or more word lines or bit lines are activated.

公开(公告)号：US20240274591A1

公开(公告)日：2024-08-15

申请号：US18110318

申请日：2023-02-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho KIM ,  CYNTHIA FUNG ,  PARVIZ GHAZAVI ,  JEAN FRANCOIS THIERY ,  CATHERINE DECOBERT ,  GILLES FESTES ,  BRUNO VILLARD ,  YURI TKACHEV ,  XIAN LIU ,  NHAN DO

IPC: H01L27/02 ,  H01L21/38 ,  H01L23/58

CPC classification number: H01L27/0207 ,  H01L21/38 ,  H01L23/585

Abstract: A semiconductor device includes a semiconductor substrate, a first module of circuitry formed on the semiconductor substrate, a second module of circuitry formed on the semiconductor substrate, and a communication ring that encircles the first module of circuitry. The communication ring includes an insulation material disposed over the semiconductor substrate, a plurality of electrical connectors disposed over the semiconductor substrate and extending across a width of the communication ring, and a conductive diffusion in the semiconductor substrate that encircles the first module of circuitry.

公开(公告)号：US20230238453A1

公开(公告)日：2023-07-27

申请号：US18126954

申请日：2023-03-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  XIAN LIU ,  CHIEN-SHENG SU ,  Nhan DO ,  CHUNMING WANG

IPC: H01L29/66 ,  H01L29/788 ,  H01L27/07 ,  H01L29/08 ,  H01L21/28 ,  H01L29/423

CPC classification number: H01L29/66825 ,  H01L29/788 ,  H01L27/0705 ,  H01L29/0847 ,  H01L29/40114 ,  H01L28/00 ,  H01L29/42328 ,  H01L29/66545 ,  G11C2216/10 ,  H01L29/6653

Abstract: A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).