Abstract:
An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.
Abstract:
The generation of a chip identifier supporting at least one integrated circuit, which includes providing a cutout of at least one conductive path by cutting the chip, the position of the cutting line relative to the chip conditioning the identifier.
Abstract:
A semiconductor structure including a first active area under which is buried a first reflective layer and a least one second active area under which is buried a second reflective layer, wherein the upper surface of the second reflective layer is closer to the upper surface of the structure than the upper surface of the first reflective layer.
Abstract:
A method for masking several identical functional processes manipulating digital data, including dividing the functional processes into steps at the end of each of which the process can be interrupted with the storage of at least one intermediary result, and successively executing the steps of at least two processes and selecting, at each step end, the process of the next step according to the result of a non-deterministic drawing of a number.
Abstract:
The use of a conductive bidimensional perovskite as an interface between a silicon, metal, or amorphous oxide substrate and an insulating perovskite deposited by epitaxy, as well as an integrated circuit and its manufacturing process comprising a layer of an insulating perovskite deposited by epitaxy to form the dielectric of capacitive elements having at least an electrode formed of a conductive bidimensional perovskite forming an interface between said dielectric and an underlying silicon, metal, or amorphous oxide substrate.
Abstract:
A method for forming a MIM-type capacitor by filling of trenches by conformal depositions of insulating materials and of conductive materials, two successive electrodes of the capacitor including on either side of a thin vertical insulating layer at least one conductive layer of same nature, including the step of lowering the level of the conductive layers with respect to the level of the insulating layer separating them.
Abstract:
A capacitive array comprising at least two capacitive entities, comprising a substrate layer. The substrate layer comprises a comb comprising at least four substantially identical teeth, and, for each capacitive entity, a set of fingers comprising one or more interlinked fingers. At least two sets of fingers comprise a different number of fingers, each finger being nested between two teeth of the comb and being substantially identical to the other fingers. The fingers of each set of fingers are substantially distributed symmetrically relative to a median axis of the comb. The comb and the fingers are integrated in a single block.
Abstract:
A memory cell is protected against current or voltage spikes. The cell includes a group of redundant data storage nodes for the storage of information in at least one pair of complementary nodes. The cell further includes circuitry for restoring information to its initial state following a current or voltage spike which modifies the information in one of the nodes of the pair using the information stored in the other node. The data storage nodes of each pair in the cell are implanted on opposite sides of an opposite conductivity type well from one another within a region of a substrate defining the boundaries of the memory cell.
Abstract:
A Lamb wave resonator includes a piezoelectric layer, and a first electrode against a first face of the piezoelectric layer. The first electrode includes fingers and a contact arm, with each finger including a first side in contact with the contact arm and two other sides parallel to one another. Portions of the piezoelectric layer are at least partially etched between the two fingers to form a recess. The fingers are spaced apart from one another by a distance W calculated according to the following equation: W = n · va lateral f , with n ∈ N where, valateral is an acoustic propagation speed of Lamb waves, n is an order of a resonance mode of the Lamb waves, f is a resonance frequency of the Lamb wave resonator.
Abstract:
Integrated circuit comprising doped zones (3 to 8) formed in a substrate (1, 2), forming a parasitic thyristor structure with two parasitic bipolar transistors (T1, T2), the integrated circuit comprising two metallizations (16, 19) interconnecting each of the two corresponding doped zones (4, 5; 6, 7) of the integrated circuit, to reduce the base resistances (RP−, RP−) of the two bipolar transistors, at least one of the metallizations (16, 19) performed to reduce the base resistances (RN−, RP−) of the two bipolar transistors, being connected to a power supply metallization (15, 16) in the integrated circuit, entirely through the substrate (1, 2).