公开(公告)号：US20210280706A1

公开(公告)日：2021-09-09

申请号：US17315380

申请日：2021-05-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Po-Yu Yang

IPC: H01L29/778 ,  H01L21/762 ,  H01L29/20 ,  H01L29/66

Abstract: A method of fabricating high electron mobility transistor, including the steps of providing a substrate with active areas, forming a buffer layer, a channel layer and a barrier layer sequentially on the substrate and gate, source and drain on the barrier layer, forming a trench surrounding the channel layer and the barrier layer, and forming a trench isolation structure in the trench, wherein the trench isolation structure applies stress on the channel layer and the barrier layer and modify two-dimension electron gas (2DEG) or two-dimension hole gas (2DHG) of the high electron mobility transistor.

公开(公告)号：US11115033B1

公开(公告)日：2021-09-07

申请号：US17065414

申请日：2020-10-07

Applicant: United Microelectronics Corp.

Inventor： Kun-Yuan Wu ,  Wei-Jen Wang ,  Chien-Fu Chen ,  Cheng-Yang Tsai ,  Ruei-Yau Chen ,  Yu-Lin Chen

IPC: H03L7/089 ,  H03L7/099

Abstract: A speed-up charge pump includes a first charge pump for receiving an up signal and a down signal in digital form to produce a first voltage control signal at an output node. Further, at least one speed-up phase detector includes a first circuit path to receive the up signal and delay the up signal by a predetermined delay as a delay up signal and operate the up signal and the delay up signal by AND logic into an auxiliary up signal; and a second circuit path to receive the down signal and delay the down signal by the predetermined delay as a delay down signal and operate the down signal and the delay down signal by AND logic into an auxiliary down signal. A second charge pump is respectively receiving the auxiliary up and down signals to produce a second voltage control signal also at the output node.

公开(公告)号：US11114331B2

公开(公告)日：2021-09-07

申请号：US16431684

申请日：2019-06-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hao-Hsuan Chang ,  Hung-Chun Lee ,  Shu-Ming Yeh ,  Ting-An Chien ,  Bin-Siang Tsai

IPC: H01L21/76 ,  H01L21/762 ,  H01L21/02 ,  H01L21/311

Abstract: A method for fabricating semiconductor device includes the steps of: forming a trench in a substrate; forming a pad layer adjacent to two sides of trench; forming a dielectric layer to fill the trench; and performing a dry etching process to remove the pad layer and part of the dielectric layer to form a shallow trench isolation (STI). Preferably, the dry etching process comprises a non-plasma etching process.

公开(公告)号：US20210273076A1

公开(公告)日：2021-09-02

申请号：US16802564

申请日：2020-02-27

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yang-Ju Lu ,  Chun-Yi Wang ,  Fu-Shou Tsai ,  Yong-Yi Lin ,  Ching-Yang Chuang ,  Wen-Chin Lin ,  Hsin-Kuo Hsu

IPC: H01L29/66 ,  H01L21/3105 ,  H01L21/02

Abstract: A method of forming a gate includes the following steps. A gate structure is formed on a substrate. An etch stop layer is formed on the gate structure and the substrate. A dielectric layer is formed to cover the etch stop layer. The dielectric layer is planarized to form a planarized top surface of the dielectric layer and expose a portion of the etch stop layer on the gate structure. An oxygen containing treatment is performed to form an oxygen containing layer on the exposed etch stop layer. A deposition process is performed to form an oxide layer covering the planarized top surface of the dielectric layer and the oxygen containing layer.

公开(公告)号：US20210272841A1

公开(公告)日：2021-09-02

申请号：US17325125

申请日：2021-05-19

Applicant: United Microelectronics Corp.

Inventor： Da-Jun Lin ,  Bin-Siang Tsai ,  Chich-Neng Chang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

Abstract: A structure of semiconductor device includes a substrate, having a dielectric layer on top. The structure further includes at least two metal elements being adjacent, disposed in the dielectric layer, wherein an air gap is existing between the two metal elements. The air gap has a cross-section of substantially bottle shape with a flat top. A porous dielectric layer is disposed over the substrate, sealing the flat top of the air gap. An inter-layer dielectric layer disposed on the porous dielectric layer.

公开(公告)号：US11101361B1

公开(公告)日：2021-08-24

申请号：US16886744

申请日：2020-05-28

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhaoyao Zhan ,  Qianwei Ding ,  Xiaohong Jiang ,  Ching Hwa Tey

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/417 ,  H01L29/786 ,  H01L21/02 ,  H01L21/762 ,  H01L29/66 ,  H01L29/76 ,  H01L29/16 ,  H01L29/24

Abstract: A GAA transistor includes a semiconductor substrate. A first shallow trench isolation (STI) is embedded in the semiconductor substrate. A top surface of the first STI is lower than a top surface of the semiconductor substrate. A nanowire crosses the first STI and is disposed on the first STI. A gate structure contacts and wraps around the nanowire. A source electrode contacts a first end of the nanowire. A drain electrode contacts a second end of the nanowire.

公开(公告)号：US20210257542A1

公开(公告)日：2021-08-19

申请号：US17308057

申请日：2021-05-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hui-Lin Wang ,  Chen-Yi Weng ,  Yi-Wei Tseng ,  Chin-Yang Hsieh ,  Jing-Yin Jhang ,  Yi-Hui Lee ,  Ying-Cheng Liu ,  Yi-An Shih ,  I-Ming Tseng ,  Yu-Ping Wang

IPC: H01L43/02 ,  H01L43/12 ,  H01L29/82 ,  G11C11/16 ,  H01L43/08 ,  G11C5/06

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first liner on the MTJ; forming a second liner on the first liner; forming an inter-metal dielectric (IMD) layer on the MTJ, and forming a metal interconnection in the IMD layer, the second liner, and the first liner to electrically connect the MTJ. Preferably, the first liner and the second liner are made of different materials.

公开(公告)号：US11094900B2

公开(公告)日：2021-08-17

申请号：US16241997

申请日：2019-01-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Da-Jun Lin ,  Bin-Siang Tsai ,  Chin-Chia Yang

IPC: H01L51/05 ,  H01L51/00 ,  H01L51/10

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer; performing a treatment process to rough a top surface of the first metal interconnection; and forming a carbon nanotube (CNT) junction on the first metal interconnection. Preferably, the treatment process further includes forming protrusions on the top surface of the first metal interconnection, in which the protrusions and the first metal interconnection comprise same material.

公开(公告)号：US20210249529A1

公开(公告)日：2021-08-12

申请号：US16809524

申请日：2020-03-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Po-Wen Su ,  Ming-Hua Chang ,  Shui-Yen Lu

IPC: H01L29/778 ,  H01L29/205 ,  H01L29/20 ,  H01L29/66 ,  H01L29/06

Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a patterned mask on the buffer layer; using the patterned mask to remove the buffer layer for forming ridges and a damaged layer on the ridges; removing the damaged layer; forming a barrier layer on the ridges; and forming a p-type semiconductor layer on the barrier layer.

公开(公告)号：US20210249275A1

公开(公告)日：2021-08-12

申请号：US17241704

申请日：2021-04-27

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung

IPC: H01L21/3105 ,  H01L27/088 ,  H01L21/8234 ,  H01L23/00 ,  H01L23/522 ,  H01L27/06

Abstract: A semiconductor device structure and a manufacturing method thereof are provided. The semiconductor device structure includes a semiconductor substrate having an active component region and a non-active component region, a first dielectric layer, a second dielectric layer, high resistivity metal segments, dummy stacked structures and a metal connection structure. The high resistivity metal segments are formed in the second dielectric layer and located in the non-active component region. The dummy stacked structures are located in the non-active component region, and at least one dummy stacked structure penetrates through the first dielectric layer and the second dielectric layer and is located between two adjacent high resistivity metal segments. The metal connection structure is disposed on the second dielectric layer, and the high resistivity metal segments are electrically connected to one another through the metal connection structure.