公开(公告)号：US20120075253A1

公开(公告)日：2012-03-29

申请号：US13240328

申请日：2011-09-22

Applicant: Cheng Nan TSAI ,  Tzung Min SU ,  Chih Hsin LIN ,  Yuan Yu PENG ,  Teng Wei HSU ,  Yu Chia LIN

Inventor： Cheng Nan TSAI ,  Tzung Min SU ,  Chih Hsin LIN ,  Yuan Yu PENG ,  Teng Wei HSU ,  Yu Chia LIN

IPC: G06F3/042

CPC classification number: G06F3/0421 ,  G06F3/042 ,  G06F2203/04104

Abstract: The present invention provides an optical touch system configured to determine an object region according to a brightness information acquired by a brightness sensing unit and to identify a block information of objects within the object region according to an image information acquired by an image sensing unit. The present invention further provides an objection detection method for an optical touch system.

Abstract translation: 本发明提供了一种光学触摸系统，其被配置为根据由亮度感测单元获取的亮度信息来确定对象区域，并且根据由图像感测单元获取的图像信息来识别对象区域内的对象的块信息。 本发明还提供了一种用于光学触摸系统的异物检测方法。

公开(公告)号：US20120068218A1

公开(公告)日：2012-03-22

申请号：US12884570

申请日：2010-09-17

Applicant: Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Ping Hung ,  Chien Ling Hwang ,  Chen-Hua Yu

Inventor： Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Ping Hung ,  Chien Ling Hwang ,  Chen-Hua Yu

IPC: H01L33/62 ,  H01L21/50

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present disclosure provides a method of packaging for a photonic device, such as a light-emitting diode device. The packaging includes an insulating structure. The packaging includes first and second conductive structures that each extend through the insulating structure. A substantial area of a bottom surface of the light-emitting diode device is in direct contact with a top surface of the first conductive structure. A top surface of the light-emitting diode device is bonded to the second conductive structure through a bonding wire.

Abstract translation: 本公开提供了一种用于光子器件（例如发光二极管器件）的封装方法。 包装包括绝缘结构。 该包装包括各自延伸穿过绝缘结构的第一和第二导电结构。 发光二极管器件的底面的实质区域与第一导电结构的顶表面直接接触。 发光二极管器件的顶表面通过接合线接合到第二导电结构。

公开(公告)号：US20120064145A1

公开(公告)日：2012-03-15

申请号：US13015301

申请日：2011-01-27

Applicant: YU-SHIN LIN ,  CHIA-LIN YEH

Inventor： YU-SHIN LIN ,  CHIA-LIN YEH

IPC: A61L15/44 ,  A61K47/42 ,  A61K31/7036 ,  A61K35/12 ,  A61K31/65 ,  A61K31/43 ,  A61K31/18 ,  A61K36/00 ,  A61K31/165

CPC classification number: A61K31/165 ,  A61K9/7084 ,  A61K31/18 ,  A61K31/43 ,  A61K31/65 ,  A61K31/7036 ,  A61L15/44

Abstract: The present invention discloses a wound dressing which may be a double-layer wound dressing, comprising a polymer material layer in combination with anti-infective antibiotics or anti-infective Chinese herb medicine at the upper layer of the wound dressing, and a porous carbon material layer capable of loading with skin-associated epithelial cells at the lower layer of the wound dressing. The wound dressing with the antibiotics can block effectively the invasion of bacteria in the external environment, thereby preventing the wound from secondary infection. While covering the wound site, the porous carbon material layer with the epithelial cells can thus provide the healthy epithelial cells and attract the surrounding healthy cells to aggregate for secreting collagen so as to promote the wound healing process. According to the present invention, there is an obviously enhancing effect on wound tissue regeneration, restoration and healing, and there is a grant development potential in clinical applications.

Abstract translation: 本发明公开了一种创伤敷料，其可以是双层伤口敷料，其包含与伤口敷料上层的抗感染性抗生素或抗感染中草药组合的聚合物材料层和多孔碳材料 能够在伤口敷料的下层与皮肤相关的上皮细胞负载的层。 用抗生素伤口敷料可以有效地阻止细菌在外界环境中的侵袭，从而防止伤口继发感染。 在覆盖伤口部位的情况下，具有上皮细胞的多孔碳材料层因此可以提供健康的上皮细胞并吸引周围的健康细胞聚集用于分泌胶原蛋白，从而促进伤口愈合过程。 根据本发明，对伤口组织再生，恢复和愈合有明显的增强作用，临床应用具有发展潜力。

公开(公告)号：US20120061259A1

公开(公告)日：2012-03-15

申请号：US13320903

申请日：2010-05-24

Applicant: Jinn-Nan Lin ,  Chia-Lin Wang ,  Ziyi Zhang

Inventor： Jinn-Nan Lin ,  Chia-Lin Wang ,  Ziyi Zhang

IPC: G01N27/327 ,  G01N33/50

CPC classification number: G01N33/5438 ,  C12Q1/005 ,  G01N27/3272

Abstract: A biosensor for quantifying an analyte in a sample and usage thereof are provided. The biosensor includes an insulative substrate, a cover, a sample supply port, an electrode system including at least a working electrode, a counter electrode and a third electrode, and a reaction layer at least formed over the working electrode. The third electrode, used for estimating whether the amount of the sample is sufficient, is disposed nearer to the sample supply port than the counter electrode is. Whether the amount of the added sample is sufficient is estimated by comparing the electrical current value detected between the working electrode and the counter electrode with the electrical current value detected between the working electrode and the third electrode. This invention has a simple structure and produces accurate measurements.

Abstract translation: 提供了用于量化样品中的分析物的生物传感器及其用途。 生物传感器包括绝缘基板，盖子，样品供给口，至少包括工作电极，对电极和第三电极的电极系统以及至少在工作电极上形成的反应层。 用于估计样品量是否足够的第三电极设置得比对电极更靠近样品供给口。 通过将检测到的工作电极和对电极之间的电流值与在工作电极和第三电极之间检测到的电流值进行比较来估计添加样品的量是否足够。 本发明具有简单的结构并产生精确的测量。

公开(公告)号：US08115263B2

公开(公告)日：2012-02-14

申请号：US11041178

申请日：2005-01-24

Applicant: Chia-Lin Chen ,  Liang-Gi Yao ,  Shih-Chang Chen

Inventor： Chia-Lin Chen ,  Liang-Gi Yao ,  Shih-Chang Chen

IPC: H01L29/78

CPC classification number: H01L21/02532 ,  H01L21/02595 ,  H01L21/2022 ,  H01L21/28035 ,  H01L21/3003 ,  H01L29/4925 ,  H01L29/78

Abstract: Within a method for forming a silicon layer, there is employed at least one sub-layer formed of a higher crystalline silicon material and at least one sub-layer formed of a lower crystalline silicon material. The lower crystalline silicon material is formed employing a hydrogen treatment of the higher crystalline silicon material. The method is particularly useful for forming polysilicon based gate electrodes with enhanced dimensional control and enhanced performance.

Abstract translation: 在形成硅层的方法中，使用由较高结晶硅材料形成的至少一个子层和由下部结晶硅材料形成的至少一个子层。 使用较高结晶硅材料的氢处理形成下部结晶硅材料。 该方法对于形成具有增强尺寸控制和增强性能的多晶硅基栅电极特别有用。

公开(公告)号：US20120033386A1

公开(公告)日：2012-02-09

申请号：US12875137

申请日：2010-09-03

Applicant: CHIA-LIN LEE

Inventor： CHIA-LIN LEE

IPC: H05K7/20

CPC classification number: G06F1/206 ,  G06F1/3203

Abstract: A heat dissipating device is used in an electronic apparatus. The electronic apparatus includes a standby unit and a power supply. The heat dissipating device includes a delay unit connected to the standby unit, a switch connected to the delay unit and the power supply, and a heat sink connected to the switch. The delay unit turns on the switch when the electronic apparatus operates in a working mode, and the delay unit turns off the switch after a predetermined delay time when the electronic apparatus enters a standby mode.

Abstract translation: 在电子设备中使用散热装置。 电子设备包括备用单元和电源。 散热装置包括连接到待机单元的延迟单元，连接到延迟单元和电源的开关以及连接到开关的散热器。 当电子设备工作在工作模式时，延迟单元接通开关，并且延迟单元在电子设备进入待机模式的预定延迟时间之后关闭开关。

公开(公告)号：US08058082B2

公开(公告)日：2011-11-15

申请号：US12189635

申请日：2008-08-11

Applicant: Chen-Hua Yu ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu ,  Hung-Ta Lin

Inventor： Chen-Hua Yu ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu ,  Hung-Ta Lin

IPC: H01L21/00

CPC classification number: H01L33/22 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/24 ,  H01L33/32

Abstract: A light-emitting diode (LED) device is provided. The LED device has raised semiconductor regions formed on a substrate. LED structures are formed over the raised semiconductor regions such that bottom contact layers and active layers of the LED device are conformal layers. The top contact layer has a planar surface. In an embodiment, the top contact layers are continuous over a plurality of the raised semiconductor regions while the bottom contact layers and the active layers are discontinuous between adjacent raised semiconductor regions.

Abstract translation: 提供了一种发光二极管（LED）装置。 LED装置已经凸起形成在基板上的半导体区域。 在凸起的半导体区域上形成LED结构，使得LED器件的底部接触层和有源层是保形层。 顶部接触层具有平坦的表面。 在一个实施例中，顶部接触层在多个凸起的半导体区域上是连续的，而底部接触层和有源层在相邻凸起的半导体区域之间是不连续的。

公开(公告)号：US08054284B2

公开(公告)日：2011-11-08

申请号：US11963878

申请日：2007-12-24

Applicant: Wen-Chih Tai ,  Tzu-Chiang Shen ,  Chia-Lin Liu ,  Chi-Neng Mo

Inventor： Wen-Chih Tai ,  Tzu-Chiang Shen ,  Chia-Lin Liu ,  Chi-Neng Mo

IPC: G09G3/36

CPC classification number: G09G3/3426 ,  G09G3/2055 ,  G09G2320/0626 ,  G09G2360/16

Abstract: A back light module and a method for driving the back light module are disclosed. The back light module includes a plurality of light emitting units and a driving unit. The driving unit is electrically connected to the light emitting units and utilized for driving the light emitting units according to a switched-on number of the light emitting units and a dithering scheme.

Abstract translation: 公开了背光模块和用于驱动背光模组的方法。 背光模块包括多个发光单元和驱动单元。 驱动单元电连接到发光单元并用于根据接通的发光单元数量和抖动方案来驱动发光单元。

公开(公告)号：US08044409B2

公开(公告)日：2011-10-25

申请号：US12189562

申请日：2008-08-11

Applicant: Chia-Lin Yu ,  Ding-Yuan Chen ,  Chen-Hua Yu ,  Wen-Chih Chiou

Inventor： Chia-Lin Yu ,  Ding-Yuan Chen ,  Chen-Hua Yu ,  Wen-Chih Chiou

IPC: H01L27/15

CPC classification number: H01L33/04 ,  H01L33/12 ,  H01L33/32

Abstract: A semiconductor structure includes a substrate and a conductive carrier-tunneling layer over and contacting the substrate. The conductive carrier-tunneling layer includes first group-III nitride (III-nitride) layers having a first bandgap, wherein the first III-nitride layers have a thickness less than about 5 nm; and second III-nitride layers having a second bandgap lower than the first bandgap, wherein the first III-nitride layers and the second III-nitride layers are stacked in an alternating pattern. The semiconductor structure is free from a III-nitride layer between the substrate and the conductive carrier-tunneling layer. The semiconductor structure further includes an active layer over the conductive carrier-tunneling layer.

Abstract translation: 半导体结构包括衬底和与衬底接触的导电载体隧穿层。 导电载体隧穿层包括具有第一带隙的第一III族氮化物（III族氮化物）层，其中第一III族氮化物层具有小于约5nm的厚度; 和具有比第一带隙低的第二带隙的第二III族氮化物层，其中第一III族氮化物层和第二III族氮化物层以交替图案堆叠。 半导体结构在衬底和导电载体 - 隧穿层之间不含III族氮化物层。 半导体结构还包括在导电载体 - 隧穿层上的有源层。

公开(公告)号：US20110258117A1

公开(公告)日：2011-10-20

申请号：US12760319

申请日：2010-04-14

Applicant: Farhan Ahmad ,  Meeri Siljamaki ,  Min Koo Lee ,  Chia-Lin Chen

Inventor： Farhan Ahmad ,  Meeri Siljamaki ,  Min Koo Lee ,  Chia-Lin Chen

IPC: G06Q20/00 ,  G06F17/30 ,  G06Q30/00

CPC classification number: G06Q20/3224 ,  G06Q20/202 ,  G06Q30/016 ,  G06Q30/0207 ,  G06Q30/06 ,  G06Q40/02

Abstract: A system for, and method of using multiple data flows, both transactional and non-transactional, in real time to modify a transaction is disclosed. Further the use of transaction information in real time as a decision factor to trigger a different, non-transactional response, and the combination of the two approaches is disclosed. In particular, a network comprised of a plurality of software modules and databases is capable of combining current POS/POP transaction data, with a variety of other outside data sources to provide improved information for adjusting responses to transactions in real time. More specifically, the network utilizes payer facing systems to analyze the data in combination with well-known POS/POP transaction data and a variety of internal and external systems to combine information and provide modified transactions, related discounts and offers, and other relevant messaging to the payer. In addition, a specific method for analyzing for fraud within hybrid information transactions is disclosed and several examples to illustrate the invention are included.

Abstract translation: 公开了实时修改事务的用于事务和非事务的多个数据流的系统和方法。 此外，实时地使用交易信息作为触发不同的非交易响应的决定因素，并且公开了这两种方法的组合。 特别地，由多个软件模块和数据库组成的网络能够将当前的POS / POP交易数据与各种其他外部数据源组合，以提供用于实时调整对交易的响应的改进信息。 更具体地说，网络利用面向付费者的系统来与众所周知的POS / POP交易数据和各种内部和外部系统结合来分析数据，以组合信息并提供经修改的交易，相关的折扣和优惠以及其他相关消息传递 付款人。 此外，公开了用于分析混合信息事务中的欺诈的具体方法，并且包括说明本发明的几个示例。