公开(公告)号：US11107957B2

公开(公告)日：2021-08-31

申请号：US16533060

申请日：2019-08-06

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Zhiguo Xie ,  Fuhai Li ,  Dongzi Chen ,  Qinxiu Liu

IPC: H01L33/58 ,  H01L33/52 ,  H01L27/15 ,  H01L33/60

Abstract: Provided is a LED device and a backlight module. The LED device comprises a bracket, a LED chip and an encapsulation layer. A reflective cup is arranged on the bracket, and the LED chip is arranged in the reflective cup. The encapsulation layer encases and encapsulates the LED chip in the reflective cup, the encapsulation layer has a top surface of the encapsulation layer. The top surface of the encapsulation layer is located above a top surface of the reflective cup, and is a lens curved surface. In an on-state, the LED device has virtual cross sections passing through a geometrical center of the LED chip and perpendicular to a top surface of the bracket, in at least one of the virtual cross sections of the LED device, the LED device has luminous efficiency greater than or equal to 95% within a beam angle of at least 60°.

公开(公告)号：USD901743S1

公开(公告)日：2020-11-10

申请号：US29672475

申请日：2018-12-05

Applicant: Foshan NationStar Optoelectronics Co., Ltd

Designer： Tiezhu Wang ,  Botao Wu ,  Limin Li ,  Shiquan Liang ,  Jingrui Guan ,  Yanrong Yuan ,  Tengpei He

公开(公告)号：US10818645B1

公开(公告)日：2020-10-27

申请号：US16870901

申请日：2020-05-09

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Junhua Chen ,  Fabo Liu ,  Danlei Gong ,  Zhonghai Yan ,  Yihua Tan

IPC: F21V23/00 ,  H01L25/13 ,  F21V3/04 ,  F21V9/32 ,  F21V5/02 ,  F21V13/12 ,  F21Y105/16 ,  F21Y115/10

Abstract: Some embodiments of the present disclosure provide a backlight module and a display device with the backlight module. The backlight module includes a plurality of Light-Emitting Diode (LED) luminous units arranged at intervals. Part of the plurality of LED luminous units are a plurality of first luminous units A with a first luminous peak wavelength, and the other part of the plurality of LED luminous units are plurality of second luminous units C with a second luminous peak wavelength, wherein the first luminous peak wavelength being less than a preset wavelength and the second luminous peak wavelength being greater than the preset wavelength. The plurality of first luminous units A and the plurality of second luminous units C are alternately arranged in sequence on the substrate, and in any two adjacent LED luminous units, one is a first luminous unit A and the other is a second luminous unit C.

公开(公告)号：US20200083420A1

公开(公告)日：2020-03-12

申请号：US16502101

申请日：2019-07-03

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Feng GU ,  Kuai QIN ,  Yuanbin LIN ,  Bin CAI

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/538

Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.

公开(公告)号：US10586904B2

公开(公告)日：2020-03-10

申请号：US16151733

申请日：2018-10-04

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Chuanbiao Liu ,  Lu Yang ,  Danwei Li ,  Feng Gu ,  Zhuang Peng

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L33/48 ,  H01L25/13 ,  G09F9/33

Abstract: Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.

公开(公告)号：US10573227B2

公开(公告)日：2020-02-25

申请号：US15995248

申请日：2018-06-01

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Feng Gu ,  Chuanbiao Liu ,  Kuai Qin ,  Xi Zheng ,  Yuanbin Lin

IPC: G09G3/32 ,  G09G3/34

Abstract: The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.

公开(公告)号：US20180083171A1

公开(公告)日：2018-03-22

申请号：US15711057

申请日：2017-09-21

Applicant: Foshan NationStar Optoelectronics Co., Ltd.

Inventor： Chuanbiao LIU ,  Xiaofeng LIU ,  Zongxian XIE ,  Qiang ZHAO ,  Kailiang FAN ,  Kuai QIN ,  Lu YANG

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62

Abstract: An LED bracket, an LED device and an LED display screen are disclosed. The LED bracket includes a metal bracket and a cup cover wrapping the metal bracket. The metal bracket includes a first metal pin embedded into the cup cover and a second metal pin exposed from the cup cover. A part, located on a top of the second metal pin, in the cup cover is a reflection cup. A light absorbing layer is disposed on a part of an outer side face of the reflection cup.

公开(公告)号：US20250113672A1

公开(公告)日：2025-04-03

申请号：US18774350

申请日：2024-07-16

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Guanyu WANG ,  Mingwen LAN ,  Nianbin CHENG ,  Yongzhao OU ,  Lu YANG ,  Yuanyuan DONG

IPC: H01L33/40 ,  H01L33/00 ,  H01L33/56

Abstract: A substrate includes a substrate body and a top copper layer disposed on the substrate body. Multiple insulated channels are disposed on the top copper layer. The top copper layer forms a top circuit structure based on the multiple insulated channels. A light-emitting element installation region is disposed on the top layer circuit structure. The top copper layer in the light-emitting element installation region protrudes upward to form at least one copper layer boss. Multiple light-emitting element welding positions are disposed in the light-emitting element installation region. A light-emitting element welding position is disposed on any copper layer boss. The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region.

公开(公告)号：US20240170630A1

公开(公告)日：2024-05-23

申请号：US18516594

申请日：2023-11-21

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Haojie GUO ,  Mingjun ZHU ,  Yurong LI ,  Jiaer MAI ,  Canbiao WU ,  Danwei LI

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/644 ,  H01L33/62 ,  H01L2933/0075

Abstract: Provided is an LED support. The LED support includes a substrate, an inner electrode, a heat dissipation pad, an electrode pad, and a solder resist layer. The electrode pad includes a top connection layer and a bottom electrode layer that are laminated. The top connection layer is connected to the back of the substrate and is provided with a connection portion extending toward the heat dissipation pad and connected to the conductive through hole in the substrate. The connection portion is between the heat dissipation pad and the bottom electrode layer. The spacing between the bottom electrode layer and the heat dissipation pad is greater than the spacing between the connection portion and the heat dissipation pad. The solder resist layer is filled in a groove formed between the electrode pad and the heat dissipation pad on the back of the substrate, and covers the connection portion.

公开(公告)号：US11974387B2

公开(公告)日：2024-04-30

申请号：US17867774

申请日：2022-07-19

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Nianbin Cheng ,  Cheng Li ,  Lifang Liang ,  Yikai Yuan ,  Honggui Zhan ,  Xiangxuan Tan

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K7/20

CPC classification number: H05K1/021 ,  H05K3/284 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20927 ,  H05K2201/066

Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.