公开(公告)号：US20120028416A1

公开(公告)日：2012-02-02

申请号：US13191950

申请日：2011-07-27

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/78 ,  B32B27/00 ,  B32B7/12

CPC classification number: H01L21/6836 ,  H01L23/3164 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81007 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/31504 ,  Y10T428/31721 ,  Y10T428/31855 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal.

Abstract translation: 本发明涉及用于倒装芯片型半导体背表面的薄膜，其被设置在连接到被粘物上的半导体元件倒装芯片的背面上，所述倒装芯片型半导体背表面膜包括粘合剂层和 层叠在粘合剂层上的保护层，其中保护层由玻璃化转变温度为200℃以上的耐热性树脂或金属构成。

公开(公告)号：US20120025399A1

公开(公告)日：2012-02-02

申请号：US13173226

申请日：2011-06-30

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L23/48 ,  C09K5/00 ,  B32B7/12 ,  H01L21/50 ,  B32B3/00

CPC classification number: C08K3/22 ,  C08K2201/001 ,  C08K2201/005 ,  C09J163/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/295 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81815 ,  H01L2224/83022 ,  H01L2224/83102 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/24355 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00

Abstract: The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on the back surface of a semiconductor element to be flip chip-connected onto an adherend, the film containing a resin and a thermoconductive filler, in which the content of the thermoconductive filler is at least 50% by volume of the film, and the thermoconductive filler has an average particle size relative to the thickness of the film of at most 30% and has a maximum particle size relative to the thickness of the film of at most 80%.

Abstract translation: 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，其将被设置在半导体元件的背面上以便倒装芯片连接到被粘物上，该薄膜含有树脂和导热填料，其中 导电填料的含量至少为膜的50体积％，并且导热填料相对于膜厚度的平均粒径为至多30％，并且具有相对于膜的厚度的最大粒径 电影最多80％。

公开(公告)号：US20110256669A1

公开(公告)日：2011-10-20

申请号：US13088738

申请日：2011-04-18

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Toshimasa SUGIMURA

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Toshimasa SUGIMURA

IPC: H01L21/50 ,  B32B7/12

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/78 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/1471 ,  Y10T428/28 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.

Abstract translation: 本发明提供了一种用于半导体背面的切割带集成膜，包括用于倒装芯片型半导体背表面的膜，用于保护连接到被粘物上的半导体元件倒装芯片的后表面和切割带，切割带 包括基材和设置在基材上的压敏粘合剂层，在压敏粘合剂层上形成用于倒装芯片型半导体背表面的膜，其中压敏粘合剂层是可辐射固化压力 敏感粘合剂层，其通过用辐射线照射而降低了对于倒装芯片型半导体背表面的膜的压敏粘合力。

公开(公告)号：US20110254176A1

公开(公告)日：2011-10-20

申请号：US13088737

申请日：2011-04-18

Applicant: Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Akiyoshi YAMAMOTO ,  Tomokazu TAKAHASHI

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Akiyoshi YAMAMOTO ,  Tomokazu TAKAHASHI

IPC: H01L23/48 ,  B32B7/12 ,  H01L21/50

CPC classification number: H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/561 ,  H01L23/3164 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2224/16225 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2924/14 ,  Y10T428/2809 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.

Abstract translation: 本发明提供了一种用于半导体背面的切割带一体化膜，包括：在基材上包括基材和压敏粘合剂层的切割带; 以及设置在压敏粘合剂层上的倒装芯片型半导体背表面的膜，其中至少一部分粘合剂层已经通过辐射线照射被预先固化。

公开(公告)号：US20110156278A1

公开(公告)日：2011-06-30

申请号：US12975783

申请日：2010-12-22

Applicant: Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

IPC: H01L23/52 ,  H01L21/50 ,  B32B27/08

CPC classification number: H01L21/6836 ,  C09J163/00 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has an elastic modulus (at 50° C.) of 10 MPa or less and the laser marking layer has an elastic modulus (at 50° C.) of 100 MPa or more.

Abstract translation: 本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中 晶片粘合层的弹性模量（50℃）为10MPa以下，激光打标层的弹性模量（50℃）为100MPa以上。