Abstract:
A method for storing data into a SRDAM. The method comprises the following steps: receiving a plurality of blocks of data; labeling said blocks successively from 1 in step of 1; dividing the label of each of said blocks by M and acquiring a corresponding remainder for each of said block, wherein M is the number of banks in said SRDAM and a positive integer; and storing said blocks in said SRDAM in according to the following rule: any logical adjacent said blocks are located physically at different banks of said SRDAM. Herein, one said block has a remainder I is stored in the (I+1) bank in said SRDAM, I being a non-positive integer. Moreover, wherein a plurality of blocks in the same backs could be stored in sequence, and said blocks are arranged in the order of corresponding remainder.
Abstract:
A safety switch device for gas gun comprises a safety lever, the safety lever has a stopping block, and at an end of the safety lever is defined with an elastic element which is used to make the safety lever return to its original position, a spark lever is defined with an abutting portion, the stopping block of the safety lever abuts against the lower portion of the abutting portion of the spark lever, such that the spark lever cannot be pressed down directly, so as to produce a passive protection mode.
Abstract:
A controlling method and device for data transmission including the steps of providing a system bus for connecting a first transmission channel and a second transmission channel with a command processor, adjusting a transmitting direction of the system bus according to a transmitting direction of the second transmission channel, and proceeding the data processing procedures of the second transmission channel, wherein parts of data processing procedures of the first transmission channel will last during a interval between the system bus adjusting the transmitting direction and the data processing procedures of the second transmission channel start on. The present invention ensure that the independence between every data caching and processing reduces the times of flushing the cached data from the data transmission channel and re-seeking through the source, shortening the transmission time, increasing facileness and improving the efficiency of the data transmission.
Abstract:
In at least one embodiment, the apparatus of the invention is a read sensor comprising a shield, a sensor element, an extra shield between the shield and the sensor element, an extra gap between the shield and the sensor and adjacent the extra shield, and a gap layer between the sensor element and the extra shield. The sensor element is positioned in a sensor layer. With the extra shield adjacent to the sensor element and separated by only the relatively thin gap layer, high areal recording density and excellent instability of the sensor element is obtained. At the same time, by fabricating the extra shield to be not significantly wider than the sensor element, the potential for shorting is minimized by placing both the gap and the thicker extra gap between the sensor lead elements and the shield. In at least one embodiment, the method of the invention is for fabricating a read sensor and comprises depositing an extra gap layer onto a shield, removing a portion of the extra gap layer to form a cavity, depositing an extra shield into the cavity, planarizing the extra gap and the extra shield, depositing a gap layer onto the extra gap and the extra shield, and depositing a sensor element onto the gap layer and adjacent to the extra shield.
Abstract:
Nanowire-based mechanical switching devices are described. For example, a nanowire relay includes a nanowire disposed in a void disposed above a substrate. The nanowire has an anchored portion and a suspended portion. A first gate electrode is disposed adjacent the void, and is spaced apart from the nanowire. A first conductive region is disposed adjacent the first gate electrode and adjacent the void, and is spaced apart from the nanowire.
Abstract:
Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an integrated circuit includes a first layer of the interconnect structure disposed above a substrate, the first layer having a first grating of alternating metal lines and dielectric lines in a first direction. The dielectric lines have an uppermost surface higher than an uppermost surface of the metal lines. The integrated circuit also includes a second layer of the interconnect structure disposed above the first layer of the interconnect structure. The second layer includes a second grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. The dielectric lines have a lowermost surface lower than a lowermost surface of the metal lines of the second grating. The dielectric lines of the second grating overlap and contact, but are distinct from, the dielectric lines of the first grating. The integrated circuit also includes a region of dielectric material disposed between the metal lines of the first grating and the metal lines of the second grating, and in a same plane as upper portions of the dielectric lines of the first grating and lower portions of the dielectric lines of the second grating. The region of dielectric material is composed of a cross-linked photolyzable material.
Abstract:
Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer.
Abstract:
Compounds are provided according to formula I: where R, R′, R3, R4, R5, and R6 are as defined herein. Provided compounds and pharmaceutical compositions thereof are useful for the prevention and treatment of a variety of conditions in mammals including humans, including by way of non-limiting example, Alzheimer' s Disease, Down's syndrome, Parkinson's Disease, and others.
Abstract:
Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer.
Abstract:
Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm2 or greater or 1 m2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.