Abstract:
A flash memory device includes a plurality of memory blocks. A selected memory block among the plurality of memory blocks includes 2n pages of data. The selected memory block includes different types of memory cells capable of storing different numbers of bits.
Abstract:
A flash memory device includes first and second memory cell array blocks and a row decoder coupled to the first memory cell array block and the second memory cell array block. The row decoder includes a block decoder, a single high voltage level shifter that is coupled to both the first and second memory cell array blocks, the single high voltage level shifter configured to provide a block wordline signal of a high voltage to the first and second memory array blocks in response to a block selection signal received from the block decoder, a first pass transistor unit, and a second pass transistor unit.
Abstract:
Disclosed is a 3D memory device including a first plane having a first mat formed on a first layer and a third mat formed on a second layer disposed over the first layer, the first and third mats sharing a bit line, and a second plane having a second mat formed on the first layer and a fourth mat formed on the second layer. The second and fourth mats share a bit line. Each one of the first through fourth mats includes a plurality of blocks and a block associated with the first plane is simultaneously accessed with a block of the second plane.
Abstract:
A semiconductor memory device having a first memory cell array block including a memory cell having a floating body, the memory cell coupled to a word line, a first bit line, and a first source line, a second memory cell array block including a reference memory cell having a floating body, the reference memory cell coupled to a reference word line, a second bit line, and a second source line, a first isolation gate portion configured to selectively transmit a signal between the first bit line and at least one of a sense bit line and an inverted sense bit line, a second isolation gate portion configured to selectively transmit a signal between the second bit line and at least one of the sense bit lines, and a sense amplifier configured to amplify voltages of the sense bit line and the inverted sense bit line to first and second sense amplifying voltage levels.
Abstract:
A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage
Abstract:
A non volatile memory device and method of operating including providing a verification voltage to a gate of a selected memory cell within multiple memory cells and providing a first pass voltage to a gate of a non-selected memory cell within the memory cells during a program verification operation; and providing a read voltage to the gate of the selected memory cell and providing a second pass voltage to the gate of the non-selected memory cell during a read operation. The second pass voltage is greater than the first pass voltage.
Abstract:
A semiconductor memory device and a method of arranging a memory cell array of the semiconductor device are provided. The semiconductor memory device has a memory cell array including a word line pair including a first word line and a second word line that are arranged in a first direction, a source line arranged in the first direction between the first word line and the second word line, a bit line pair including a first bit line and a second bit line arranged in a second direction perpendicular to the first direction, a first memory cell including a gate connected to the first word line and first and second regions respectively connected to the second bit line and the source line, and arranged in a third direction between the first direction and the second direction, and a second memory cell including a gate connected to the second word line, a third region and the second region respectively connected to the first bit line and the source line, and arranged in the third direction. The first word line and the second word line are simultaneously activated. Therefore, disturbance that may be generated between adjacent memory cells in the semiconductor memory cell can be prevented, integration density of the semiconductor memory device can be enhanced, and the number of word lines to be driven may be reduced to employ a sub-word line structure.
Abstract:
A multi-level dynamic memory device having an open bit line structure is disclosed. The multi-level dynamic memory device includes a plurality of word lines; a plurality of bit lines provided in an open bit line structure; a plurality of memory cells each of which is connected to each of the word lines and each of the bit lines and stores at least two bits of data; and a plurality of sense amplifiers, each of which amplifies a voltage difference between the bit lines, the bit lines being located at opposite sides of each of the plurality of sense amplifiers.
Abstract:
A flash memory device may include a memory cell array having a plurality of word lines, bit lines, and memory cells. Each memory cell may be arranged at an intersection of a corresponding word line and a corresponding bit line. The device may include a bit line voltage setting circuit for setting a voltage on a bit line of a given memory cell to be programmed to a variable bit line voltage or to a ground voltage. A variable bit line voltage generating circuit may be provided in the flash memory device for generating the variable bit line voltage. To facilitating programming of the device, a bit line voltage of a given memory cell to be programmed may be set based on a supply voltage of the device, so as to maintain a voltage difference based on the set bit line voltage above a given threshold voltage.
Abstract:
Methods for setting a read voltage in a memory system which comprises a flash memory device and a memory controller for controlling the flash memory device, comprise sequentially varying a distribution read voltage to read page data from the flash memory device; constituting a distribution table having a data bit number and a distribution read voltage, the data bit number indicating an erase state among the page data respectively read from the flash memory device and the distribution read voltage corresponding to the read page data; detecting distribution read voltages corresponding to data bit numbers each indicating maximum points of possible cell states of a memory cell, based on the distribution table; and defining new read voltages based on the detected distribution read voltages.