公开(公告)号：US5964395A

公开(公告)日：1999-10-12

申请号：US868846

申请日：1997-06-09

申请人： Andrew Z. Glovatsky ,  Mohan R. Paruchuri

发明人： Andrew Z. Glovatsky ,  Mohan R. Paruchuri

IPC分类号： B23K35/02 ,  B23K35/26 ,  C23C4/00 ,  C23C26/02 ,  H05K3/32 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12

CPC分类号： H05K3/3463 ,  B23K35/0222 ,  C23C26/02 ,  C23C4/00 ,  H05K3/328 ,  B23K35/26 ,  H05K2201/0373 ,  H05K2203/0495

摘要： A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid metal is dispensed on or near the component. The liquid metal wets the component and the coating. The metal is reacted with the coating to form an electrically conductive bond with the substrate and adheres the component to the substrate. The reactive metal may be heated to a temperature which makes it liquid and facilitates wetting the coating and component. Suitable materials for the spray metal coating include copper, nickel, tin, bismuth, lead and silver and mixtures thereof. Suitable liquid metals generally include low melting temperature metals such as gallium and indium and mixtures thereof.

摘要翻译： 一种将电子部件附接到基板的方法，包括以下步骤：在基板顶上沉积喷涂金属涂层。 将电子部件放置在涂层的顶部。 液体金属被分配在部件上或附近。 液体金属润湿组分和涂层。 金属与涂层反应以与基底形成导电结合并将组分粘合到基底上。 反应性金属可以被加热到使其成为液体并有助于润湿涂层和组分的温度。 用于喷涂金属涂层的合适材料包括铜，镍，锡，铋，铅和银及其混合物。 合适的液态金属通常包括低熔点金属如镓和铟及其混合物。

公开(公告)号：US5882954A

公开(公告)日：1999-03-16

申请号：US944506

申请日：1997-10-06

申请人： Ram Singh Raghava ,  Andrew Z. Glovatsky ,  Jay DeAvis Baker ,  Michael George Todd

发明人： Ram Singh Raghava ,  Andrew Z. Glovatsky ,  Jay DeAvis Baker ,  Michael George Todd

IPC分类号： H01L21/48 ,  H05K3/14 ,  H05K3/16 ,  H05K3/38 ,  H01L21/44 ,  H01L21/50

CPC分类号： H05K3/387 ,  H01L21/4846 ,  H01L21/4864 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/14 ,  H05K3/16

摘要： There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.

摘要翻译： 本文公开了一种将金属化物粘合到基底上的方法，包括以下步骤：（1）提供具有第一表面的基底; （2）在所述第一表面顶上施加涂层，使得所述涂层具有与所述第一表面结合的第二表面，以及大致与所述第二表面相符的第三表面; （3）从第三表面蚀刻掉材料，以便在第三表面中粗糙化并形成凹坑; 和（4）通过电镀，溅射或类似方式将金属化附着到第三表面中的凹坑。

公开(公告)号：US5743457A

公开(公告)日：1998-04-28

申请号：US627793

申请日：1996-04-01

申请人： Walter Benedette ,  Medhat Said ,  Andrew Z. Glovatsky

发明人： Walter Benedette ,  Medhat Said ,  Andrew Z. Glovatsky

IPC分类号： B05C5/02 ,  B23K3/06 ,  H05K3/34

CPC分类号： B23K3/0623 ,  H05K3/3457 ,  B23K2201/36 ,  H05K2203/0126 ,  H05K3/3447

摘要： A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member actuated by the pin of said pin-in-through-hole joining zone when the valve is positioned at the zone against the board, the valve member moving from a first position closing off fluid flow from the outlet to a second position permitting fluid flow through the outlet; means for measuring a predetermined body of fluid solder that is released from the chamber when said valve member is in the second position with the assembly positioned at the zone against the board; and means to contain the released fluid solder in a predetermined shape and in and around the pin-in-through-hole joining zone while the solder solidifies.

摘要翻译： 一种焊料分配装置，用于将流体焊料沉积到电子电路板的销钉通孔连接区域中并围绕电子电路板的销钉通孔接合区域，该焊接分配装置包括：阀组件，其限定具有入口和出口的阀室，并且所述阀构件由 当所述阀定位在抵靠所述板的区域时，所述销钉在通孔接合区域中的销，所述阀构件从关闭流体流动的第一位置移动到第二位置，从而允许流体流过所述出口 ; 用于测量当所述阀构件位于所述第二位置时从所述腔室释放的预定体积的流体焊料的装置，其中所述组件位于相对于所述板的所述区域处; 以及用于在焊料固化时将所释放的流体焊料容纳在预定形状中并且在销钉通孔接合区中和周围的装置。

公开(公告)号：US5685475A

公开(公告)日：1997-11-11

申请号：US524662

申请日：1995-09-08

申请人： Vivek Amir Jairazbhoy ,  Andrew Z. Glovatsky ,  Timothy Joseph Yerdon

发明人： Vivek Amir Jairazbhoy ,  Andrew Z. Glovatsky ,  Timothy Joseph Yerdon

IPC分类号： B23K31/02 ,  B23K1/08 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34 ,  B23K3/00

CPC分类号： B23K3/0653 ,  B23K1/085 ,  B23K3/085

摘要： An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder including a turbulent wave and a laminar wave, and a cool down zone through which the board passes upon exit from the laminar flow wave of the solder wave. The improvement comprises at least one distributing manifold mounted in the tunnel having an inlet port for receiving a cold gas under pressure and at least one outlet nozzle for directing the cold gas to the circuit board, thereby rapidly cooling the circuit board and the components.

摘要翻译： 一种用于将部件焊接到电路板的装置和方法。 该设备包括在隧道中的输送机，用于通过预热区域输送板，包括湍流波和层流的焊料熔融波，以及当从焊料的层流波出射时板通过的冷却区 波。 该改进包括安装在隧道中的至少一个分配歧管，其具有用于接收压力下的冷气体的入口和用于将冷气引导到电路板的至少一个出口喷嘴，由此快速冷却电路板和部件。

公开(公告)号：US5407865A

公开(公告)日：1995-04-18

申请号：US206309

申请日：1994-03-04

申请人： Andrew Z. Glovatsky ,  Michael A. Mele ,  Patrick M. Scott

发明人： Andrew Z. Glovatsky ,  Michael A. Mele ,  Patrick M. Scott

IPC分类号： B32B15/08 ,  H01L23/04 ,  H01L21/52 ,  H01L21/84

CPC分类号： B32B15/08 ,  H01L23/04 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31699

摘要： A process of manufacturing a flexible metallized polymer film cover which provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly.

摘要翻译： 制造柔性金属化聚合物膜盖的方法，其提供对电子组件（例如电路卡组件）的环境保护，所述电子组件易受外部环境因素的影响，这些外部环境因素可能妨碍功能性能并降低可靠性。 使用两层膜形式的金属化聚合物膜，其中两个紧密接合的层，一个是电绝缘的，另一个是金属的，为封闭的组件提供环境和电气保护。